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Blind Spot Monitoring System
Product manufacturing instructions
| Type Of Circuit Board | High-frequency Hybrid pressing PCB+Metal edging PCB+impedance |
| pcb board layers | 8L |
| pcb board thickness | 2.0mm |
| Single size | 144*141.5mm/1PCS |
| Surface finish | ENIG |
| Inner copper thickness | 18um |
| Outer copper thickness | 35um |
| Solder Masking | green(GTS，GBS) |
| Silkscreen Pcb | white(GTO,GBO) |
| circuit board material | Rogers RO4350B 1E/1E 0200 (DK=3.48）（0.508mm）+ Regular Substrates S1000-2M FR-4、TG170 |
| through hole | Solder mask plug holes |
| Density of mechanical drilling hole | 17W/㎡ |
| Density of laser drilling hole | / |
| Min via size | 0.2mm |
| Min line width/space | 8/10mil |
| Aperture | 10mil |
| Pressing | 1 time |
| pcb board drilling | 1 time |
Quality Assurance
Quality Management System: ISO 9001: 2015, ISO14001:2015,IATF16949: 2016,OHSAS 18001: 2007,QC080000:2012SGS ,RBA,CQC,WCA & ESA,SQ MARK,Canon GA,Sony GP,
PCB quality standard: IPC 1 ,IPC 2,IPC 3 ,GJB 362C-2021，AS9100
PCB major manufacturing process: IL/lmage, PatternPlating, I/L AOI, B/Oxide, Layup, Press, LaserDrilling, Drilling, PTH, PanelPlating, O/Llmage, PanelPlating, SESEtching, O/L AOI, S/Mask, Legend, SurfaceFinshed (ENIGENEPIG, Hard Gold, Soft Gold, HASL, LF-HASL, lmm Tin, lmm Silver, OSP), Rout, ET, FV
Detection items
| Inspection equipment | test items |
| Oven | Thermal energy storage testing |
| Ion contamination level testing machine | Ionic cleanliness test |
| Salt spray testing machine | Salt spray test |
| DC high-voltage tester | Voltage withstand test |
| Megger | Insulation resistance |
| Universal tensile machine | Peel strength test |
| CAF | Ion migration testing, improving PCB substrates, improving PCB processing, etc. |
| OGP | Using non-contact 3D image measuring instruments, combined with XYZ axis moving platform and automatic zoom mirror, utilizing image analysis principles to process image signals by computer, the measurement of geometric dimensions and positional tolerances can be quickly and accurately detected, and CPK values can be analyzed. |
| On line resistance control machine | Control resistance TCT test Common failure modes, understanding the potential factors that may cause damage to system equipment and components to confirm whether the product is correctly designed or manufactured |
| Inspection equipment | test items |
| Cold and thermal shock box | Cold and thermal shock test, high and low temperature |
| Constant temperature and humidity chamber | Electrochemical corrosion&surface insulation resistance testing |
| Solder pot | Solderability test |
| RoHS | RoHS test |
| Impedance tester | AC impedance and power loss values |
| Electrical testing equipment | Test the circuit continuity of the product |
| Flying needle machine | High voltage insulation and low resistance conducting test |
| Fully automatic hole inspection machine | Check for various irregular hole types, including round holes, short slot holes, long slot holes, large irregular holes, porous, few holes, large and small holes, and hole plug inspection functions |
| AOI | AOI automatically scans PCBA products through high-definition CCD cameras, collects images, compares test points with qualified parameters in the database, and after image processing, checks for small defects that may be overlooked on the target PCB. There is no escape from circuit defects |
What is a Blind Spot Monitoring System (BSM)?
A Blind Spot Monitoring System (BSM) is a cutting-edge vehicle safety technology designed to detect and monitor the blind spots on both sides of your car, helping you avoid potential collisions. Here’s a closer look at the key functions and benefits of a Blind Spot Monitoring System:
Main Functions of Blind Spot Monitoring System
Blind Spot Detection: Utilizing advanced sensors (usually radar or cameras), the system detects vehicles or obstacles in the blind spot areas, providing real-time alerts.
Lane Change Assistance: Advanced Blind Spot Monitoring Systems can integrate with your vehicle's steering and braking systems. This feature assists you during lane changes, enhancing overall safety and preventing collisions.
Advanced Technology: Combines radar and camera systems for accurate and reliable detection.
Investing in a Blind Spot Monitoring System is a smart move for any driver looking to enhance their vehicle's safety features. Stay aware of your surroundings and drive with confidence knowing that your BSM system is keeping an eye on your blind spots.
Benefits of Blind Spot Monitoring Systems
Enhanced Safety: Significantly reduces the risk of accidents by alerting drivers to vehicles in their blind spots.
Stress-Free Driving: Provides peace of mind, especially during lane changes and merging on highways.
What is the dielectric constant of RO4350B?
The dielectric constant (Dk) of RO4350B may vary slightly with frequency, although this change is usually small. RO4350B is designed as a high-performance microwave and radio frequency application material, with a relatively stable dielectric constant (Dk) designed to adapt to different frequency requirements.
In its technical data sheet, Rogers Corporation typically provides a dielectric constant value at a specific frequency (such as 10 GHz), which is approximately 3.48 for RO4350B. This means that when designing and evaluating the suitability of the RO4350B circuit board for specific applications, this dielectric constant value can be considered.
However, Practically, when evaluating the performance of any material at different frequencies, it is important to understand how its dielectric constant varies with frequency, as this can affect the propagation speed and loss of signals. Although the Dk value of RO4350B is designed to be relatively stable, it may exhibit slight variations over an extremely wide frequency range. In the design process of high-frequency applications, it is usually recommended to refer to the detailed technical specification data of materials to obtain the most accurate material property information.
Application
HDI PCB has a wide range of application scenarios in the electronic field, such as :
-Big Data & AI : HDI PCB can improve the signal quality, battery life and functional integration o mobile phones, while reducing their weight and thickness. HDI PCB can also support the development of new technologies such as 5G communication, AI and IoT, etc.
-Automobile : HDI PCB can meet the complexity and reliability requirements of automotive electronic systems, while improving the safety, comfort and intelligence of automobiles. It can also be applied to functions such as automotive radar, navigation, entertainment and driving assistance.
-Medical : HDI PCB can improve the accuracy, sensitivity and stability of medical equipments, while reducing their size and power consumption. It can also be applied in fields such as medical imaging, monitoring, diagnosis and treatment.
Application
The mainstream applications of HDI PCB are in mobile phones, digital cameras, AI, IC carriers, laptops, automotive electronics, robots, drones, etc., being widely used in multiple fields.
-Medical : HDI PCB can improve the accuracy, sensitivity and stability of medical equipments, while reducing their size and power consumption. It can also be applied in fields such as medical imaging, monitoring, diagnosis and treatment.