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High-frequency Hybrid pressing PCB

  • Category High-frequency Hybrid pressing PCB+mechanical drilled blind hole+Metal edging +metallized blind groove
  • Number of layer 8L
  • Board Thickness 3.0mm
  • Material Rogers RO4350B 1E/1E 0200 (DK=3.48)(0.508mm)+ SYTECH S1000-H
  • Single size 255*171mm/1PCS
  • Surface finish ENIG
  • Inner copper thickness:35um Outer copper thickness:70um
  • Color of solder mask:green(GTS,GBS) Silkscreen color:white(GTO,GBO)
  • Via treatment resin plug hole
  • Density of mechanical drilling hole 6W/㎡
  • Min via size 0.3mm
  • Min line width/space:10/10mil Aperture ratio:10mil
  • Pressing times:3 time Drilling times:3 time
  • PN B0800051A
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Quality Assurance


Quality Management System:ISO 9001: 2015、 ISO14001:2015、IATF16949: 2016、OHSAS 18001: 2007、QC080000:2012SGS  、RBA、CQC、WCA & ESA、SQ MARK、Canon GA、Sony GP
PCB quality standard:IPC 1 、IPC 2、IPC 3 、GJB 362C-2021,AS9100
PCB major manufacturing process:IL/lmage、PatternPlating、I/L AOI、B/Oxide、Layup、Press、LaserDrilling、Drilling、PTH、PanelPlating、O/Llmage、PanelPlating、SESEtching、O/L AOI、S/Mask、Legend、SurfaceFinshed(ENIGENEPIG、Hard Gold、Soft Gold、HASL、LF-HASL、lmm Tin、lmm Silver、OSP)、Rout 、ET、FV

 Inspection equipment&test items

oven:thermal energy storage testing
Ion contamination level testing machine:Ionic cleanliness test
salt spray testing machine:Salt spray test
DC high-voltage tester:voltage withstand test
Megger:insulation resistance
Universal tensile machine:peel strength test
CAF:Ion migration testing, improving PCB substrates, improving PCB processing, etc.
OGP:Using non-contact 3D image measuring instruments, combined with XYZ axis moving platform and automatic zoom mirror, utilizing image analysis principles to process image signals by computer, the measurement of geometric dimensions and positional tolerances can be quickly and accurately detected, and CPK values can be analyzed.
On line resistance control machine:control resistance TCT test Common failure modes, understanding the potential factors that may cause damage to system equipment and components to confirm whether the product is correctly designed or manufactured


Cold and thermal shock box:cold and thermal shock test, high and low temperature
Solder pot:solderability test
RoHS:RoHS test
Impedance tester:AC impedance and power loss values
Electrical testing equipmentFlying needle machine:High voltage insulation and low resistance conducting test:Test the circuit continuity of the product
Fully automatic hole inspection machine:Check for various irregular hole types, including round holes, short slot holes, long slot holes, large irregular holes, porous, few holes, large and small holes, and hole plug inspection functions
AOI:AOI automatically scans PCBA products through high-definition CCD cameras, collects images, compares test points with qualified parameters in the database, and after image processing, checks for small defects that may be overlooked on the target PCB. There is no escape from circuit defects



HDI PCB has a wide range of application scenarios in the electronic field, such as :

-Big Data & AI : HDI PCB can improve the signal quality, battery life and functional integration o mobile phones, while reducing their weight and thickness. HDI PCB can also support the development of new technologies such as 5G communication, AI and IoT, etc.

-Automobile : HDI PCB can meet the complexity and reliability requirements of automotive electronic systems, while improving the safety, comfort and intelligence of automobiles. It can also be applied to functions such as automotive radar, navigation, entertainment and driving assistance.

-Medical : HDI PCB can improve the accuracy, sensitivity and stability of medical equipments, while reducing their size and power consumption. It can also be applied in fields such as medical imaging, monitoring, diagnosis and treatment.

The mainstream applications of HDI PCB are in mobile phones, digital cameras, AI, IC carriers, laptops, automotive electronics, robots, drones, etc., being widely used in multiple fields.


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