Good news | Received a patent for a high-frequency PCB lamination automatic analysis device

During the PCB lamination process, the lamination program ensures that the actual material temperature curve meets the curing requirements of the material, including the heating rate, pressure transfer point, total pressure size, curing temperature, and curing time. Currently, one fixed program is set for one type of material for production. To ensure that the processing of all materials of this type meets the requirements, high demand lamination programs are often used for production. In High-frequency PCB lamination detection, automatic analysis devices are required. However, the existing automatic analysis devices do not have pressure protection function and do not have dust removal function, which affects the quality of analysis and is inconvenient for people to use. Therefore, Rich Full Joy proposed a high-frequency PCB lamination automatic analysis device to solve the existing problem.

Rich Full Joy Technical Solution

1.By extending the cylinder, the horizontal plate is driven to move downwards, and the horizontal plate is driven by a fixed rod to move the detector downwards. When the detector drives the pressure sensor to contact the detected object, the pressure sensor transmits data to the central processing unit, achieving data transmission function.

2.The central processing unit is used to close the cylinder through the control unit to avoid damage to the detected object. The dust around the detection platform is sucked into the inner chamber of the dust collection bag through the pipeline connector, vacuum pipe, and horn pipe at the input end of the fan, achieving the effect of dust removal torealizethe dust removal function.

3.Using high-frequency signal analysis technology to accurately identify and analyze high-frequency signals in PCB lamination, and performing corresponding processing and verification.

4.Using efficient data processing capabilities to process a large amount of PCB lamination data, and conducting real-time analysis and feedback to ensure the accuracy and timeliness of the analysis results.

Rich Full Joy Innovative Points

1.High levelof automation: It realizes fully automated operations from data collection, processing to result output, greatly improving analysis efficiency.

2.Featuring high precision. This project adopts high-precision testing probes and advanced testing technology to ensure the accuracy and reliability of the analysis results.

3.Through algorithm research, intelligent analysis of High Frequency Pcb Ptfe lamination data has been achieved, improving the accuracy and efficiency of the analysis.

4.This project solvedthe problem that the existing automatic analysis device does not have pressure protection function and does not have dust removal function, which affects the quality of analysis and is inconvenient for people to use.

5.This project is able toachieve anti slip effect by setting anti slip pads. By setting auxiliary telescopic rods, the stability of the horizontal plate when moving downwards can be improved. By setting springs, guide wheels, and connecting rods, the stability of the horizontal plate can be further improved.

Issues addressed by Rich Full Joy

1.Effective integration of various functional modules is required to ensure that each part can work together.

2.Solvedthe problem of existing technologies being unable to be used in complex environments.

3.Addressedthe issue that existing PCB lamination cannot be comprehensively analyzed.due to its complex signal characteristics.

4.Capable of conducting multidimensional analysis on high-frequency PCB lamination to ensure accuracy.

5.Through efficient data processing algorithms, it is possible to quickly and accurately analyze high-frequency signal data in PCB lamination.

6.Has high stability and can operate normally under long-term use and different environments.