How to Manufacture High-Quality PCBs? Comprehensive Guide to Key PCB Manufacturing Steps

PCB Production Process

Step 1: Data Verification

Before production, the PCB manufacturer verifies the board-making data provided by the customer, including the board size, process requirements, and product quantity. Production proceeds only after reaching an agreement with the customer.

Step 2: Material Cutting

According to the customer's board-making information, cut the production boards into small pieces that meet the requirements. Specific operations: large plate material → cutting according to MI requirements → cutting the plate → corner cutting/edge grinding → plate discharge.

Step 3: Drilling

   Drill the required hole diameter at the corresponding positions on the PCB board. Specific operations: large plate material → cutting according to MI requirements → curing → corner cutting/edge grinding → plate discharge.

Step 4: Copper Sinking

   A thin layer of copper is chemically deposited on the insulating hole. Specific operations: rough grinding → hanging the board → automatic copper sinking line → lowering the board → soaking in 1% dilute H2SO4 → thickening the copper.

Step 5: Image Transfer

Transfer the images from the production film to the board. Specific operations: hemp board → film pressing → standing → alignment → exposure → standing → development → inspection.

Step 6: Graphic Plating

Electroplate a copper layer of the required thickness and a gold nickel or tin layer on the exposed copper sheet or hole wall of the circuit pattern. Specific operations: upper plate → degreasing → secondary water washing → micro corrosion → water washing → acid washing → copper plating → water washing → acid soaking → tin plating → water washing → lower plate.

Step 7: Film Removal

Remove the anti-electroplating coating layer with NaOH solution to expose the non-circuit copper layer.

Step 8: Etching

Remove non-circuit parts with a chemical reagent.

Step 9: Solder Mask

Transfer the images of the green film onto the board, mainly to protect the circuit and prevent soldering of parts with tin on the circuit.

Step 10: Silkscreen

Print recognizable characters on the PCB board. Specific operations: after the final curing of the solder mask, cool and stand still, adjust the screen, print characters, and finally cure.

Step 11: Gold Fingers

Apply a nickel/gold layer of the required thickness on the plug finger to enhance its hardness and wear resistance.

Step 12: Forming

Punch the shape required by the customer using a mold or CNC machine.

Step 13: Testing

Functional defects caused by open circuits, short circuits, etc., are difficult to detect through visual inspection and can be tested using a flying probe tester.