R&D of Beidou chip mounting components

The BeiDou chip includes a chipset of RF chips, baseband chips, and microprocessors. Relevant equipment can receive signals transmitted by BeiDou satellites through the BeiDou chip, thereby completing positioning and navigation functions. BeiDou positioning chips are widely used in many fields of modern society, and need to be mounted on circuit boards for use.

At present, the installation of Beidou chips is usually completed through mechanical operations. During installation, the chips are usually adsorbed by suction cups, and then moved to the circuit board for welding. However, the current suction cups lack positioning devices, which can easily deviate from the center of the chip when adsorbed. This can lead to deviation during chip installation, resulting in welding failure. Therefore, our company proposed the R&D of Beidou chip installation components to solve the existing problems.

Rich Full Joy Technical Solution

1.Adopting advanced precision positioning technology to achieve high-precision positioning of Beidou chips, ensuring the accuracy of mounting positions.

2.By setting a positioning plate, the device starts the motor when picking up the chip, and uses the motor to drive the reverse screw to rotate. The screw sleeve slides horizontally under the action of the surface thread of the reverse screw. With this setting, the spacing between the positioning plates can be adjusted to the appropriate position according to the size of the chip, and then the mechanical arm moves the suction cup above the chip.

3.The positioning board positions the chip so that the suction cup is located at the center of the surface of the chip. Then, the electric cylinder starts to lower the suction cup and make contact with the surface of the chip. At the same time, the vacuum pump starts to generate negative pressure on the suction cup and adsorb the chip. When mounting, the positioning board is positioned at the chip installation position, and then the electric cylinder releases to place the chip on the circuit board.

4.By setting up a fan, the air blown out by the fan after starting is transmitted to the air groove of the positioning board through the air duct, and then blown out from the air outlet below the positioning board. This setting allows for dust removal of the circuit board before chip installation, preventing dust from adhering to the surface of the circuit board toaffect the normal installation of the chip.

Rich Full Joy Innovative Points

1.By using a positioning plate to locate and retrieve the chip, the suction cup can be attached to the center of the chip, which improves the accuracy of chip mounting and prevents accidental dropping of the chip due to the displacement of the suction cup attachment position.

2.By setting up a fan, the circuit board can be dusted before chip installation, preventing dust from adhering to the surface of the circuit board toaffect the normal installation of the chip.

3.Polishing the inner wall of the positioning plate can prevent friction between the positioning plate and the chip corners, which may cause chip wear.

Issues addressed by Rich Full Joy

1.Solvedthe problem of inaccurate positioning of existing technologies.

2.Solvedthe problem of chip wear caused by existing technology during chip processing.

3.Has high-precision positioning function and good environmental adaptability.

4.Realizedefficient and high-quality installation process to ensure the reliability and stability of components.