20-Layer Gold-Plated High-Frequency PCB: Advanced Design for High-Performance Applications
Features of PCB Products
●Type: Through-hole PCB + Thick Copper PCB + Pure High-Frequency PCB
●Material: Shengyi S7136H High-Frequency High-TG Material
●Number of Layers: 20L
●Board Thickness: 2.4mm
●Size: 160233.35mm
●Surface Finish: Gold Plating (2µ")
●Drilling: 0.2mm, 12:1 Aspect Ratio
●Drilling Times: 1 time
●Lamination: 1 time
●Special Feature: Beveled Edge Design
Design and Product Features:
●Material Advantages: High-TG material ensures stability and performance in high-frequency applications.
●Unique Thickness and Shape Design: 2.4mm thickness and beveled edge design enhance durability and performance.
●Advanced Manufacturing Process: Single drilling and lamination process ensure precision and reliability.
In - depth Analysis of PCB Impedance: Importance, Analysis and Optimization Strategies
1、 Introduction
In modern electronic devices, the performance of the printed circuit board (PCB) is crucial for the stable operation of the entire system. Among them, impedance, as a key parameter, directly affects the quality of signal transmission. This article will analyze the impedance information of the provided PCB, explore its importance, and discuss how to optimize the performance of the PCB through reasonable design.
2、 Overview of PCB Impedance
Impedance refers to the opposition to the flow of electric current in a circuit. In an alternating - current circuit, it includes the combined effects of resistance, inductance, and capacitance. For a PCB, precise impedance control is a key factor in ensuring signal integrity. When a signal propagates in a transmission line, if the impedance is not matched, problems such as signal reflection, attenuation, and distortion will occur, thus affecting the performance of electronic devices.
3、 Analysis of impedance information of circuit board
From the provided table, we can see that the impedance information of this PCB includes several key parameters. For example, the table records in detail the trace width (in mils), trace spacing (in mils), and the corresponding target impedance values (such as 50Ω, 40Ω, 85Ω, 100Ω, etc.) between different layers (such as L1, L2, L3, etc.).
Taking the layers L1 and L3 as an example, when the trace width is 15.5 mils, the target impedance is 50Ω. In the actual adjustment and calculation, these parameters may be fine - tuned according to specific process and material characteristics to ensure an accurate impedance value. For example, in some cases, to achieve the target impedance value, the trace width may need to be adjusted to 17 mils.
Looking at layers L1 and L2, when the trace width is 6 mils, the target impedance is 50Ω; when the trace width is 9 mils, the target impedance is 40Ω. These data show that there is a close relationship between the trace width and impedance. Generally, the wider the trace width, the lower the impedance.
In addition, the table also records some special layer combinations, such as L3 and L2/L4, L5 and L4/L6, etc., with a target impedance of 40Ω. In the adjustment and calculation, the trace width will be fine - tuned according to the actual situation, such as adjusting it to 5.5 mils.
4、 The Importance of Impedance Control
(1) Signal integrity
In high - speed digital signal transmission, signal integrity is of utmost importance. Precise impedance control can reduce signal reflection and ensure that the signal maintains its original shape and amplitude during transmission, thus improving the accuracy and reliability of data transmission. For example, in high - speed serial communication interfaces (such as USB 3.0, HDMI, etc.), strict impedance matching is the key to ensuring high - speed data transmission.
(2) Reduce electromagnetic interference (EMI)
When the impedance of the PCB is not matched, electromagnetic radiation will be generated, leading to electromagnetic interference. By reasonably controlling the impedance, the intensity of electromagnetic radiation can be reduced, the interference to surrounding electronic devices can be decreased, and the electromagnetic compatibility (EMC) of the entire system can be improved.
(3) Improve system performance
Precise impedance control can improve the performance and stability of electronic devices. In high - frequency circuits, such as radio - frequency (RF) circuits and microwave circuits, slight changes in impedance can have a significant impact on signal transmission and processing. By optimizing the impedance design, the gain, sensitivity, and selectivity of the circuit can be improved, thus enhancing the performance of the entire system.
5、 Methods for optimizing the impedance of circuit boards
(1) Reasonable selection of materials
The materials of the PCB have an important impact on impedance. Different materials have different dielectric constants and loss tangent values, and these parameters will affect the signal propagation speed and attenuation. Therefore, when designing a PCB, appropriate materials should be selected according to specific application requirements to ensure the stability and consistency of impedance.
(2) Accurate circuit design
Precisely controlling the width, spacing, and length of the traces is the key to achieving impedance matching. In the design process, professional circuit design software should be used to carry out accurate trace layout and parameter calculation according to the target impedance value. At the same time, factors such as the trace routing and bending angles that affect the impedance should also be considered, and right - angle turns and overly long traces should be avoided as much as possible.
(3) Manufacturing process control
The manufacturing process of the PCB also has a certain impact on impedance. For example, the accuracy of the etching process, the pressure and temperature of the lamination process, etc., will affect the actual size of the traces and the performance of the materials, resulting in impedance deviations. Therefore, during the manufacturing process, process parameters should be strictly controlled to ensure the quality and performance of the PCB.
(4) Impedance testing and adjustment
During the production process, impedance testing should be carried out on the PCB to ensure that it meets the design requirements. If a large impedance deviation is found, adjustments should be made in a timely manner. The impedance can be optimized by adjusting the trace width, thickness, or changing the materials.
Impedance control of the PCB is a key link in the design and manufacturing of electronic devices. Through a detailed analysis of the PCB impedance information, we can better understand the impact of impedance on signal transmission and take corresponding measures to optimize the performance of the PCB. Reasonable material selection, precise trace design, strict manufacturing process control, and accurate impedance testing and adjustment are all important means to achieve precise impedance control of the PCB. Only in this way can we ensure that electronic devices operate stably in high - speed and high - frequency environments and meet the continuous development needs of modern electronic technology.
High - Frequency PCBs: All - Round Advantages Shaped by Superior Performance
●High Reliability: Rigorous testing ensures stable operation in demanding environments.
●Excellent Signal Integrity: Advanced impedance control and gold plating ensure minimal signal loss.
●Customization Options: Tailored solutions for specific high-frequency applications.
Superior Frequency Response
It can handle a wide range of frequencies with minimal distortion. For example, in a 5G communication base station, where signals operate at extremely high frequencies, this high - frequency PCB can accurately transmit and receive signals, ensuring seamless communication between devices. The advanced material composition and circuit design allow it to maintain a flat frequency response curve even in the ultra - high - frequency range, which is crucial for high - speed data transfer.
Low Insertion Loss
In microwave applications such as satellite communication systems, the low insertion loss of this PCB is a significant advantage. When signals travel through the PCB, there is very little power loss, which means that the transmitted signals can reach the receiving end with high fidelity. This is especially important in long - distance communication scenarios where signal strength needs to be maintained over large distances.
High Thermal Conductivity
In high - power and high - frequency electronic devices like radar systems, heat generation is a common issue. This high - frequency PCB has excellent thermal conductivity properties. The heat - dissipating materials used in its construction can quickly transfer heat away from critical components, preventing overheating and ensuring the long - term stable operation of the device. For instance, in a high - power radar transmitter, the PCB can effectively dissipate the heat generated during operation, reducing the risk of component failure due to excessive heat.
Low Dielectric Constant
With a low dielectric constant, the PCB can reduce signal propagation delay. In high - speed digital circuits, such as those used in high - performance computing servers, this feature allows for faster data processing and transmission. The reduced delay ensures that data packets can be processed and transmitted in a timely manner, improving the overall system performance.
Precision Manufacturing
The manufacturing process of this high - frequency PCB is highly precise. Advanced manufacturing techniques, such as laser drilling and micro - via technology, are used to ensure accurate circuit placement and connection. In the production of aerospace - grade electronic equipment, where precision is of utmost importance, this high - frequency PCB can meet the strict requirements of the industry. Each component can be accurately placed on the PCB, ensuring the reliability and performance of the final product.
Compatibility with Advanced Components
It is fully compatible with the latest high - performance electronic components. For example, in the development of next - generation smartphones, which require integration of advanced 5G chips, high - speed processors, and multiple sensors, this high - frequency PCB can seamlessly connect and support these components. The PCB's design and material properties are optimized to work with the latest component technologies, enabling the creation of more compact and powerful electronic devices.
High - Density Integration
This high - frequency PCB allows for high - density integration of components. In small - form - factor devices like wearable health monitors, where space is extremely limited, the ability to pack a large number of components onto a single PCB is essential. The PCB's design enables the efficient use of space, allowing for the integration of multiple functions into a small device without sacrificing performance.
Cost - effective in the Long Run
Although the initial cost of this high - frequency PCB may be slightly higher than traditional PCBs, it offers long - term cost savings. Due to its high reliability and durability, the need for frequent replacement or repair of the PCB is reduced. In industrial control systems that operate continuously for long periods, the reduced maintenance and replacement costs can lead to significant savings over the lifetime of the system.
RoHS and Environmental Compliance
This high - frequency PCB complies with RoHS (Restriction of Hazardous Substances) and other environmental regulations. In the era of increasing environmental awareness, using such a PCB is not only beneficial for the environment but also helps companies avoid potential legal and reputational risks. For example, in the production of consumer electronics, using an environmentally friendly PCB can enhance the brand image and meet the requirements of environmentally conscious consumers.
Industry - Standard Certification
It has obtained various industry - standard certifications, such as ISO 9001 for quality management and ISO 14001 for environmental management. These certifications ensure that the PCB meets the highest quality and environmental standards. In the automotive electronics industry, where safety and quality are top priorities, the availability of these certifications gives manufacturers confidence in using this high - frequency PCB in their products, reducing the risk of product failures and ensuring compliance with industry regulations.
20 - layer Gold - plated High - frequency PCBs: Rigorous Quality Inspection and Traceability, Forging Superior Quality
Strict Quality Inspection:
To ensure the highest standards of quality and reliability, this 20-layer gold-plated high-frequency PCB undergoes a rigorous and comprehensive quality inspection process. Each PCB is subjected to a series of advanced tests, including impedance testing, signal integrity checks, and high-frequency performance evaluations. Impedance testing ensures that the PCB meets the precise electrical requirements necessary for high-frequency applications, minimizing signal loss and distortion. Signal integrity checks are conducted to verify that the PCB can maintain the integrity of high-speed signals, even in complex electromagnetic environments. Additionally, the PCB is tested for thermal stability, mechanical strength, and resistance to environmental factors such as humidity and vibration. These tests are performed using state-of-the-art equipment, including automated optical inspection (AOI) and X-ray inspection systems, to detect any potential defects or inconsistencies. By adhering to such stringent quality control measures, we ensure that every PCB delivers consistent performance and reliability, meeting the demands of even the most critical applications.
Traceability System:
In addition to rigorous testing, this PCB is supported by a robust traceability system that tracks every stage of the manufacturing process, from raw material procurement to the final product. Each component and material used in the production of the PCB is carefully documented, including details such as supplier information, batch numbers, and quality certifications. This traceability system ensures complete transparency and accountability throughout the supply chain, allowing us to quickly identify and address any issues that may arise. For example, if a specific batch of materials is found to have a defect, the traceability system enables us to pinpoint the affected products and take corrective action without delay. Furthermore, this system provides our customers with detailed records of the PCB's production history, including test results and inspection reports, giving them confidence in the quality and reliability of the product. By maintaining a comprehensive traceability system, we not only enhance the quality of our PCBs but also build trust with our customers, ensuring that they receive products that meet their exact specifications and performance requirements.
Commitment to Excellence:
Our quality assurance process is a reflection of our commitment to delivering products that exceed industry standards. By combining advanced testing technologies with a meticulous traceability system, we ensure that every PCB is built to the highest levels of precision and reliability. This commitment to excellence is particularly important in industries such as military, aerospace, and telecommunications, where even the smallest defect can have significant consequences. Our quality assurance team works closely with our engineering and manufacturing teams to continuously improve our processes and incorporate the latest advancements in PCB technology. This collaborative approach allows us to stay at the forefront of the industry, providing our customers with cutting-edge solutions that meet their evolving needs. Whether you are designing a next-generation radar system or a high-speed communication network, you can trust our PCBs to deliver the performance and reliability you need to succeed.
By prioritizing quality at every stage of the manufacturing process, we ensure that our PCBs not only meet but exceed the expectations of our customers, providing them with the confidence to push the boundaries of innovation.
High - TG, Gold Plating and Beveled Edge: The Path to Excellence of 20 - layer High - frequency PCBs
Importance of High-TG Material:
High-TG (High Glass Transition Temperature) materials are crucial for high-frequency PCBs, especially in applications where thermal stability is a priority. High-TG materials, such as Shengyi S7136H, ensure that the PCB maintains its structural integrity and electrical performance even under high-temperature conditions. This is particularly important in military, aerospace, and industrial applications where the PCB may be exposed to extreme heat during operation. The high-TG material prevents delamination, warping, and other thermal failures, ensuring long-term reliability and performance. Additionally, high-TG materials offer better mechanical strength and chemical resistance, making them ideal for harsh environments.
Benefits of Gold Plating:
Gold plating on PCBs offers several advantages, particularly in high-frequency and high-reliability applications. The gold surface provides excellent conductivity, ensuring minimal signal loss and optimal electrical performance. This is especially important for high-frequency signals, where even minor resistance can lead to significant signal degradation. Gold plating also enhances the durability of the PCB, protecting it from oxidation and corrosion, which can occur in humid or chemically aggressive environments. Furthermore, gold plating ensures reliable solderability and contact performance, which is critical for components that require frequent connections and disconnections. The 2µ" gold thickness on this PCB ensures a balance between performance and cost, providing long-lasting reliability without excessive material usage.
Advantages of Beveled Edge Design:
The beveled edge design is a unique feature of this high-frequency PCB, offering both functional and mechanical benefits. From a functional perspective, the beveled edges help reduce signal reflections and interference, which are common issues in high-frequency applications. This design ensures smoother signal transmission and minimizes losses, enhancing the overall performance of the PCB. Mechanically, the beveled edges reduce stress concentration points, making the PCB more resistant to physical damage during handling and installation. This is particularly important in applications where the PCB may be subjected to vibrations or mechanical shocks, such as in military or aerospace systems. The beveled edge design also facilitates easier integration into complex assemblies, ensuring a perfect fit and reducing the risk of installation errors.
This 20-layer gold-plated high-frequency PCB is designed to meet the demanding requirements of high-performance applications, offering reliability, precision, and superior functionality. With its high-TG material, gold-plated surface, and beveled edge design, it ensures optimal performance in even the most challenging environments. Whether used in military radar systems, aerospace communication, or high-frequency testing equipment, this PCB provides the durability and signal integrity needed for critical applications. Its advanced manufacturing process and rigorous quality assurance further guarantee its reliability, making it the ideal choice for industries where performance and precision are paramount.
By leveraging the latest advancements in PCB technology, this product sets a new standard for high-frequency applications, ensuring that your systems operate at peak performance under all conditions.
Applications of 20-Layer Gold-Plated High-Frequency PCB
Applications of 20-Layer Gold-Plated High-Frequency PCB
This PCB is designed for demanding applications that require high-frequency performance, power efficiency, and long-term reliability.
1️⃣ RF and Microwave Communication Systems
Ideal for 5G base stations, satellite communication, and high-speed RF signal transmission.
2️⃣ Aerospace and Defense Electronics
Used in radar systems, avionics, and secure military communication networks due to its high reliability and thermal stability.
3️⃣ Automotive Radar and ADAS Systems
Supports 77GHz millimeter-wave automotive radar, LiDAR, and autonomous vehicle control systems.
4️⃣ High-Speed Data Transmission and AI Servers
Essential for AI server PCBs, cloud computing, and high-speed optical transceivers that demand low latency and high bandwidth.
5️⃣ Medical Imaging and Diagnostic Equipment
Suitable for MRI, CT scanners, and ultrasound systems, where high-precision signal processing is critical.
6️⃣ Industrial Control and Automation
Used in robotics, automated test equipment (ATE), and IoT edge computing where real-time signal processing and power stability are essential.
7️⃣ Satellite and Space Exploration Systems
Designed for space-grade PCBs in satellite payloads, telemetry systems, and deep-space communication networks.
8️⃣ High-Frequency Radar and Electronic Warfare Systems
Used in electronic countermeasure (ECM) systems, airborne surveillance, and high-speed phased-array radar applications.
9️⃣ High-Power Wireless Charging and Energy Transmission
Supports resonant wireless power transfer systems for electric vehicles (EVs), industrial applications, and smart city infrastructure.
🔟 Quantum Computing and Advanced Research Equipment
Suitable for quantum processors, cryogenic computing, and experimental physics applications requiring ultra-low loss PCB technology.
Why Choose This 20-Layer High-Frequency PCB?
✔️ Optimized for High-Speed and RF Performance – Designed to minimize signal loss, crosstalk, and impedance mismatches.
✔️ High-TG Material for Thermal Stability – Withstands extreme thermal conditions for mission-critical applications.
✔️ Precision Manufacturing for High Reliability – Single drilling and lamination process ensure consistent quality and performance.
✔️ Customizable for Advanced Engineering Applications – Available with custom stack-up configurations, different surface finishes, and special mechanical designs.
Looking for a reliable, high-performance 20-layer PCB for your advanced applications? Contact us now to discuss your custom requirements, pricing, and lead time.