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Understanding the purpose of PCB lamination
2024-06-26
1. Brown Oxidizing
Purpose:
Chemically oxidize the surface of copper to generate a layer of oxide (brown cuprous oxide), which further increases the surface area to enhance bonding strength.
Attention:
1. After brown oxidizing, the board should be promptly loaded and laminated. If left for too long, it is prone to moisture and combine with CO2 in the air to form carbonic acid, which will dissolve the brown oxide layer, affecting its bonding strength and increasing the risk of delamination.
2. Board with thick Copper Layer (≥2oz) and bare board need to be baked to remove excess moisture.
Baking parameters: 120℃±5℃×120 min
2. Pre stack
Purpose:
According to MI instructions, stack the core board and PP together.
Common structure of 4 layer board
3. Board loading
Purpose:
Place each set of pre stacked and riveted boards independently on the steel plate in sequence, usually with 4-6pnl boards for production on each plate.
4. Lamination
Purpose:
Through a certain temperature and pressure, the solidification process of PP from semi-solid to liquid is carried out to bond the core board, PP and copper foil together.
5. Unloading
Purpose:
Disassemble the laminated board into PNLs, and cool them down .
6.X-Ray target drilling
Purpose:
Grasp the position of the inner layer graphic target through X-Ray irradiation of the X-Ray device, and then drill positioning holes through mechanical drilling.
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