IC carrier board PCB

Design to match chip size, peripheral component layout, and installation space. For example, smart watch carriers require precise miniaturization.

Use low-dielectric-constant materials (e.g., Rogers) for high-speed applications and FR-4 for general use. Match the thermal expansion coefficient with the chip.

Follow signal integrity principles: keep high-speed signals short and straight, ensure differential pairs are equal in length and uniform in spacing. For example, PCIe interfaces require strict control of length and spacing.

Plan uniform power planes and isolate different power domains during partitioning to avoid crosstalk between digital and analog power supplies.

Establish a low-impedance grounding plane, add protection rings for sensitive signals, and use multi-point grounding for RF circuits.

Via size is determined by current and frequency. Use small-diameter vias (e.g., ＜0.3mm for signals above 10GHz) for high-speed signals to reduce parasitic parameters.

Precisely match pad size and spacing, optimize routing and heat dissipation in the BGA area, and add a thermal via array below the BGA.

Test points should be accessible for equipment, and must be set at key signal nodes and power pins to meet functional testing requirements.

Silk screen should clearly mark component labels, polarity, etc., and be placed in blank areas away from welding regions.

Customize the shape (e.g., rectangular/irregular) according to equipment structure and installation requirements to ensure compatibility with other components, such as in laptop carriers.

Set tolerances (e.g., ±0.05mm for line width) based on manufacturing processes to ensure interlayer alignment and component installation accuracy.

Use heat sinks, vias, or metal substrates for high-power chips. For example, CPU carriers enhance heat dissipation through large copper planes and vias.

Use metal shielding covers or surface shielding layers to enclose sensitive circuits (e.g., RF modules).

Consider materials, routing, and thermal design comprehensively. Use high-quality materials and reduce stress concentrations.

Design to meet process capabilities (e.g., minimum line width/spacing) for easy manufacturing.

Include sufficient test points and interfaces (e.g., JTAG) for production testing and fault diagnosis.

Arrange components for easy replacement, placing vulnerable parts in accessible locations.

Optimize cost by controlling layer count, size, and selecting appropriate materials and processes under performance requirements.

Use lead-free soldering and environmentally friendly materials to comply with RoHS standards.

Processes include material cutting, drilling, copper deposition, electroplating, circuit fabrication, solder masking, silk screening, and surface treatment.

Materials include copper-clad laminates (FR-4, high-frequency materials), copper foil, solder/silk screen inks, and surface treatment materials (gold/tin plating, OSP).

Use high-precision equipment, maintain drills regularly, control speed/feed rate, and use positioning pins to keep deviation ≤±0.05mm.

Use electroless plating to deposit 0.2-0.5μm thin copper on the hole wall, making non-conductive walls conductive for electroplating.

Precisely control current density, time, plating solution composition / temperature. For example, 18-35μm copper plating is achieved by adjusting parameters.

Use photolithography to transfer patterns, followed by development and etching. Minimum line width can reach 0.075mm.

Use high-quality ink, control coating thickness/uniformity, optimize exposure/curing parameters. Film thickness 25-40μm, bubble/pinhole-free.

Use screen printing to control ink thickness (10-20μm) and precision, ensuring clear characters and accurate positioning.

Choose HASL for solderability and ENIG for flatness, based on application requirements.

Short circuits, open circuits, trace opens, solder mask defects, blurred silk screen, rough hole walls, delamination, etc.

Use AOI, X-ray, flying probe testing, and ICT to inspect circuit integrity, soldering quality, and electrical performance.

Use micro-etching to remove excess copper for shorts, jumper wires for opens, and local repair for solder mask defects. Re-inspect after repair.

3-7 days for ordinary carriers, 10-15 days for complex ones, and 1-3 days for urgent orders (with higher costs).

Optimize design to reduce layer count/size, select cost-effective materials/processes, and improve yield.

Generates wastewater, exhaust gas, and waste residue containing heavy metals, requiring treatment to meet discharge standards.

Use automated loading/unloading, silk screening, and inspection equipment to improve efficiency and quality consistency.

Drilling machines, copper deposition/electroplating lines, exposure machines, etching machines, solder mask/silk screen printers, surface treatment, and inspection equipment.

Regularly clean, maintain, replace wear parts, and calibrate parameters to ensure stable equipment operation.

Optimize parameters for drilling, electroplating, etching, etc., through experimental analysis—e.g., improve plating uniformity to enhance quality and efficiency.

Implement standard procedures, control raw material quality, calibrate equipment, and train personnel to ensure batch-to-batch consistency.

Use multimeters, oscilloscopes, and network analyzers to test continuity, impedance, and signal transmission characteristics.

Use eye diagram, reflection, and crosstalk tests to analyze distortion. Eye diagram opening must meet standards.

Optimize power distribution networks, add decoupling capacitors, reduce internal resistance/inductance, and lower noise—e.g., place multi-value capacitors near chip pins.

Use vector network analyzers to test insertion loss, return loss, isolation, etc., to ensure normal RF signal transmission.

Use thermal imagers to measure temperature distribution and calculate thermal resistance. Chip surface temperature must be within rated limits.

Use shielding, filtering, and proper routing—e.g., separate digital/analog grounds and add shielding to sensitive signals.

Perform high-temperature aging (e.g., 85℃), thermal cycling, humidity, and vibration tests to evaluate environmental adaptability.

Predict service life through accelerated life testing and Arrhenius equation modeling.

Optimize grounding, shielding, and filtering to control signal radiation and interference sensitivity—e.g., add grounding frames at PCB edges.

Perform bending, tension, and shear tests to evaluate board strength, which must meet relevant standards.

Evaluate via chemical resistance tests (soaking in acid/alkali solutions) to observe appearance and performance changes.

Select materials with good weather resistance and apply surface protection treatments (such as coating three-proof paint) to extend outdoor service life.

Use an insulation resistance tester to measure the insulation resistance between circuits and between circuits and ground (should be above megohm level).

Evaluate by testing parameters such as dielectric constant and dielectric loss factor. In high-frequency applications, the dielectric constant should be stable and low.

Optimize wiring, use low-loss materials, and adopt microstrip or stripline structures for high-speed signals to reduce delay.

Apply different power loads, observe circuit heating and changes in electrical performance, and evaluate the current-carrying capacity of power device circuits.

Measure power noise, signal noise, etc., to ensure that the peak-to-peak value of power noise is within the allowable range.

Adopt redundant designs (such as adding backup circuits or components), and use dual-line transmission for critical signals to improve reliability.

Test signal response speed and stability under dynamic operating conditions (such as dynamic testing of high-speed data transmission interfaces).

Conduct compatibility tests with different chips and modules (such as testing with different batches of chips) to ensure normal system operation.

First use AOI to check for circuit short points, then use a multimeter to measure resistance for positioning, and check for short circuits in circuits or component pins.

Use flying probe testing or a multimeter to measure circuit continuity and check for open circuits or blocked vias (possibly caused by excessive etching or drilling issues).

Use an oscilloscope to observe signal waveforms, check for reflection and crosstalk issues, and investigate improper wiring or impedance mismatch.

Measure power supply voltage, check for short circuits/open circuits in power supply lines and decoupling capacitor failure, and investigate power chip faults or excessive line loss.

Use a thermal imager to identify heat sources and check for power device overload or poor heat dissipation (such as improper heat sink installation or insufficient heat vias).

Use a spectrum analyzer to detect interference sources and check shielding measures (such as ground connection of shielding covers and normal operation of filter circuits).

Use AOI to check for cold solder joints, missing solder joints, and bridging, and investigate improper welding temperature/time or flux quality issues.

Use multimeters and oscilloscopes to test component performance (such as resistance, capacitance, and diode conductivity), and investigate overvoltage/overcurrent causes.

Re-examine design documents, compare actual performance with specifications, and investigate improper wiring or parameter setting errors (such as line width insufficient for current carrying).

Check for oxidation/contamination on test point surfaces, wear of test probes, or equipment connection issues. Clean test points or replace probes.

Check silk screen clarity, accuracy, and position, and investigate silk screen process or ink quality issues (such as adjusting silk screen parameters).

Observe solder mask layer for bubbles, pinholes, and peeling, and investigate coating/curing process issues (such as adjusting coating thickness and curing temperature).

Use X-ray to detect interlayer bonding and investigate excessive thermal stress or material compatibility issues (such as rapid temperature changes during production).

Observe hole walls under a microscope and check drilling parameters and drill bit wear (such as adjusting drilling speed and feed rate).

Check surface treatment layer uniformity, firmness, and oxidation/corrosion, and investigate improper process parameters (such as adjusting electroplating time and current density).

Use measuring tools such as calipers to compare with design dimensions and investigate manufacturing positioning or processing accuracy issues (such as checking drilling positioning).

Use a flatness measuring instrument to detect and investigate thermal stress or material issues (such as excessive thermal expansion coefficient of the board, optimize thermal design).

Test material composition and check the production process (such as whether lead-containing materials are used and whether wastewater / exhaust emissions meet standards).

Communicate with manufacturers and check whether the design meets process requirements (such as minimum line width/spacing meeting equipment capabilities, optimize the design).

Check the rationality of test point settings and interface normality, and investigate insufficient test points or inconvenient positions (replan test points).

IC carrier PCBs focus more on chip connection, with smaller size, higher precision, denser wiring, and higher requirements for signal integrity and heat dissipation.

Evaluate suppliers' production capacity, quality control, technical level, price, and delivery time (such as checking relevant certifications and equipment advancement).

Reasonably control inventory quantity based on production plans and demand forecasts, conduct regular inventory checks, and use the ABC classification method to prevent overstocking/shortages.

Physical disassembly and chemical treatment can be used to recover copper and precious metals (such as acid leaching to recover copper, in line with environmental requirements).