● Type: PCB(2-68 layers) sample & batch manufacturing, achieved excellent results in HDI, high multi-layer PCB, FPC, Rigid-Flex, etc.
● Special process: blind/buried hole, step groove, ultra size, buried resistance/capacity, hybrid pressing, rigid-flex, gold finger, N+N structure, heavy copper, back drilling.
● Common substrates: FR4 Tg/HIGH, Tg/Low DK, RO4350B, FR408HR, M4, M6, TU862, TU872, Rogers, IT968, etc.
● Surface finish: HASL, Pb-free HASL, ENIG, Immersion Tin, Immersion silver, gold plating, OSP, ENIG+OSP, ENEPIG.
● IISO9001/ISO14001/TS16949/UL//ISO13485/QC08000/GJB 9001C-2017 certifications.