Tlhahiso ea PCB ea Maqhubu a Phahameng a Multilayer: Temoho ea Ts'ebetso ea Bohlokoa ea Lamination le Taolo ea Boleng
Ka tsoelo-pele e potlakileng ea lisebelisoa tsa elektroniki, li-PCB tse nang le maqhubu a mangata li fetohile tsa bohlokoa lits'ebetsong tsa sejoale-joale tse kang puisano ea 5G, tsamaiso ea sathelaete le litsamaiso tsa radar. Ha maqhubu a matšoao a ntse a eketseha, boleng ba ts'ebetso ea lamination e fetoha ntlha ea bohlokoa ho fihlelleng ts'ebetso e phahameng, ts'epo le bophelo bo bolelele ba ts'ebeletso.
Sehloohong sena, re hlahloba mehato ea bohlokoa ea ho lamination ea PCB ea mekhahlelo e mengata e phahameng, re hlahloba mekhoa e tloaelehileng ea liphoso, 'me re totobatsa mehato e sebetsang ea taolo ea boleng bakeng sa liphetho tse ntle tsa tlhahiso ea PCB.
Lintho tsa bohlokoa tsa Ts'ebetso ea Lamination
1. Tokisetso ea Lintho tse Hlokahalang
✔ Khetho ea Substrate
Li-PCB tse nang le maqhubu a phahameng li hloka thepa e nang le:
●Kopanelo e tlase ea dielectric (Dk): bakeng sa ho ata ha lets'oao ka potlako
●Ntho e fokolang ea ho qhalana (Df): ho fokotsa tahlehelo ea lets'oao
Li-substrate tse khethiloeng li kenyelletsa Rogers le Taconic. Mohlala, li-PCB tsa seteishene sa motheo sa 5G hangata li sebelisa li-substrate tse nang le boleng ba Dk pakeng tsa 3.0–3.5, ho netefatsa ts'ebetso e tsitsitseng ho pholletsa le liteishene tsa data tse lebelo le phahameng.
✔ Litšobotsi tsa Foil ea Koporo
● Ho se tsitse ha bokaholimo bo tlase: ho fokotsa tahlehelo ea mokhanni
● Bohloeki bo phahameng: e netefatsa khanyetso e tlase le phetiso e ntle ea lets'oao
Boima bo tloaelehileng ba koporo: 1/2 oz kapa 1/4 oz koporo ea electrolytic, e loketseng ts'ebetso ea RF.
✔ Ho lumellana ha Preg (PP)
Li-prepreg li sebetsa e le lera la sekhomaretsi ho lamination. Lintlha tsa bohlokoa li kenyelletsa:
●Resin le phallo: e tlameha ho lumellana le thepa ea motheo le foil ea koporo
●Mefuta e fapaneng ea li-prepreg e sebelisoa ho latela botenya ba PCB le palo ea lera. Khetho e nepahetseng ea prepreg e netefatsa ho khomarela ho matla ha lera le ts'ebetso ea motlakase.
2. Tlhahiso ea Lera la ka Hare
✔ Litšoantšo le ho Sebetsa ka ho Nepahala Haholo
●Ho pepesehela Photoresist ho lokela ho fihlela ho nepahala ha boemo ba micron
●Ho tšoana ha ho qoelisoa ho bohlokoa ho boloka bophara ba mola/mamello ea sebaka (mohlala, 50μm/50μm)
✔ Tlhahlobo ea Lera la Ka Hare
Tlhahlobo e matla le e hlabang kamora ho tjhesa e sebedisa AOI (Otomatiki Optical Inspection) le tlhahlobo ya probe e fofang e netefatsa hore potoloho ha e na diphoso. Esita le dikgutshwane tse nyane kapa di-open tse nyane di ka baka diphoso tse kgolo meralong ya maqhubu a phahameng kamora ho lamination.
3. Ts'ebetso ea Lamination
✔ Pele ho Lamination (Ho Hatella Pele)
Sepheo: ho leleka moea o tšoasitsoeng le lintho tse fofang habonolo
●Mocheso: 60–80°C
●Khatello: 1–2 MPa
●Nako: 5–10 mets
Ho tobetsa pele ho netefatsa ho khomarela ha lera la pele le ho batalatsa lera la thepa bakeng sa liphetho tse ntle tsa lamination.
✔ Hot Press Lamination
Mokhoa oa mantlha moo resin ea prepreg e phallang le ho fola:
●Mocheso: 180–220°C
●Khatello: 5–10 MPa
●Nako: metsotso e 30–60
●Ho tšoana ha mocheso oa poleiti e chesang: ±2°C ho bohlokoa ho qoba ho se leka-lekane ha resin
Resin e tlameha ho tlatsa libaka tse pakeng tsa mealo ka ho lekana ho netefatsa ho khomarela ho matla le ho qoba likheo.
✔ Pholiso e Laoloang
●Sekhahla se loketseng sa ho pholisa: 1–3°C/min
●E thibela khatello ea maikutlo le ho senyeha ha letlalo
Ho pholisa butle-butle ho dumella ho imolla kgatello ya motjhini, ho netefatsa botsitso ba boholo le ho ba bataletse.
Mefokolo e Tloaelehileng ea Lamination le Lisosa tsa Motheo
Ho Hlalosa Mekhahlelo e Meholo
Letšoao:
● Karohano ea lera e bonahalang kapa e nyenyane haholo
●Matla a ho hlohlora a fokotsehile (
Mabaka:
●Li-prepreg tse silafalitsoeng ke mongobo kapa tse nang le resin e tlase
●Khatello kapa mocheso o sa lekaneng oa lamination
●Ho hloleha ha ho phekola ka resin ka lebaka la polokelo e mpe kapa mongobo o feteletseng
Tšusumetso:
●Ho fokotsa le ho sotha ha lets'oao
●Ho senyeha ha botšepehi ba nako e telele
Likheo tsa ka Hare (Li-bubble)
Letšoao:
●Lipokotho tsa moea li fumanoa ka tlhahlobo ea X-ray
●E tloha boholo ba pinhead ho isa ho li-voids tsa milimithara
Mabaka:
●Ho se tsoe moeeng ka botlalo nakong ea pele ho khatiso
●Ho futhumatsa ka potlako ho baka ho phatloha ha mosi o fetohang ka potlako
●Ho tlosa khase e mpe kapa ho se khethe lintho tse lokelang ho sebelisoa esale pele
Tšusumetso:
● Bokhoni bo sa lebelloang ba ho kenya moea ka lekhalo
●Phetoho ea mohato oa RF le tahlehelo e eketsehileng ea ho kenngoa
Leqephe la ho Sebetsana le ho Fetoha ha PCB
Letšoao:
●Li-PCB lia kobeha, lia sotha; li feta mamello ea ho batalatsa ea 0.5%
● Mathata kopanong ea SMT, ho se lumellane hantle ha mechini
Mabaka:
● Ho se pholise ka ho lekana kamora ho lamination
●Ho se tshwane ha CTE ho pholletsa le mekhahlelo
●Khatello e sa lekanang kapa kabo ea koporo
Tšusumetso:
●Manonyeletso a solder a petsohileng
●Lithapo lia robeha tlas'a khatello ea mechine
●Koketso e fokotsehileng ea kopano le ts'epo ea tšimo
Tsebo ea Rich Full Joy ho Lamination ea PCB e Phahameng ka Maqhubu
Ka boiphihlelo bo tebileng indastering tlhahisong ea RF PCB, Rich Full Joy e utloisisa tekano e bonolo e hlokahalang lipakeng tsa thepa ea thepa, liprofaele tsa mocheso le ho nepahala ha ts'ebetso. Bokhoni ba rona ba bohlokoa bo kenyelletsa:
●Bokgoni ho Rogers, Taconic, le thepa e 'ngoe e tsoetseng pele
● Mocheso o phahameng oa lamination le litsamaiso tsa taolo ea khatello
●Lisebelisoa tse tsoetseng pele tsa ho hlahloba X-ray, AOI, le matla a ho phunya
● Tšehetso e kopaneng ea moralo bakeng sa tlhahiso (DFM)
Re netefatsa hore li-PCB tsa hau tse nang le maqhubu a mangata a phahameng li fihlela botšepehi bo tiileng ba lets'oao le maemo a botsitso ba mechini a hlokahalang bakeng sa lits'ebetso tsa 5G, radar, sathelaete le tsa lifofane.
Sebelisana le Barui ba Thabo e Felletseng
Haeba o ntse o sebetsana le mathata a multilayer RF PCB lamination, Rich Full Joy ke molekane oa hau ea loketseng. Taolo ea rona ea boleng bo sebetsang, tsebo e tebileng ea lintho tse bonahalang, le litharollo tsa boenjiniere tse etselitsoeng uena li u thusa:
● Fokotsa sekhahla sa liphoso
●Potlakisa nako ea ho ea 'marakeng
●Finyella ts'ebetso ea RF e sa bapisoeng le e 'ngoe
Ikopanye le rona kajeno kapa latela lintlafatso tsa rona tsa tekheniki—re ikemiselitse ho matlafatsa moloko o latelang oa puisano ka litharollo tsa PCB tsa maemo a lefats'e.
