Boto e sa fetoheng
Theknoloji e Tsoetseng Pele e Sebetsang Haholoanyane le Tharollo e Phethahetseng.
Melemo ea Boto e Tiileng-Flex
Matsatsing ana, moralo o ntse o tsoela pele ho phehella ho etsa hore lihlahisoa li be nyane, li theko e tlase le lebelo le phahameng, haholo-holo 'marakeng oa lisebelisoa tsa mohala, oo hangata o kenyeletsang lipotoloho tsa elektroniki tse nang le bongata bo phahameng. Ho sebelisa Liboto tsa Rigid-Flex e tla ba khetho e ntle bakeng sa lisebelisoa tse kantle tse hokahantsoeng ka IO. Melemo e supileng e meholo e tlisoang ke litlhoko tsa moralo oa ho kopanya lisebelisoa tsa boto tse tenyetsehang le lisebelisoa tsa boto e thata ts'ebetsong ea tlhahiso, ho kopanya lisebelisoa tse peli tsa substrate le prepreg, ebe ho fihlella khokahano ea motlakase ea li-conductor ka masoba a ka ntle kapa li-vias tse foufetseng/tse patiloeng ke tse latelang:
Kopano ea 3D ho fokotsa lipotoloho
Tšepo e betere ea khokahano
Fokotsa palo ea likarolo le likarolo
Ho ba le botsitso bo betere ba impedance
E ka rala sebopeho se rarahaneng haholo sa ho bokella lintho
Kenya tšebetsong moralo oa ponahalo o bonolo haholoanyane
Fokotsa boholo
Rigid-flex ke boto e kopanyang ho tiea le ho tenyetseha, e sebetsanang le ho tiea ha boto e thata le ho tenyetseha ha boto e tenyetsehang.
Semi-FPC
'Mapa oa Tsela ea Bokhoni
| Ntho | E tenyetseha - E tiile | Borena | Semi-Flex |
| Setšoantšo |  |  |  |
| Thepa e Tenyetsehang | Polyimide | FR4 + Sekoahelo (Polyimide) | FR4 |
| Botenya bo tenyetsehang | 0.025~0.1mm (Ntle le koporo) | 0.05~0.1mm (Ntle le koporo) | Botenya bo setseng: 0.25+/‐0.05mm (Thepa e inehetseng: EM825(I)) |
| Sekhutlo se kobehang | Boholo ba 180° | Boholo ba 180° | Boholo ba 180°(Lera le flex≤2) Boholo ba 90°(Lera le flex>2) |
| Mamello ea ho Flexural; IPC‐TM‐650, Mokhoa oa 2.4.3. | Potoloho e ka tlase ho 1000 | Potoloho ea | SEO |
| Teko ea ho kobeha; 1) Bophara ba mandrel: 6.25mm | |||
| Kopo | Flex ho kenya & Dynamic (Lehlakore le le leng) | Flex ho kenya | Flex ho kenya |
| Qetello ea Bokaholimo | Boleng bo Tloaelehileng | Mofani | |
| Lefapha la Mollo la Baithaopi |  | 0.2~0.6um;0.2~0.35um | Khemik'hale ea Enthone Shikoku |
| LUMELANA |  | Kapa: 0.03~0.12um, Ke: 2.5~5um | ATO tech/Chuang Zhi |
| ENIG e Khethiloeng |  | Kapa: 0.03~0.12um, Ke: 2.5~5um | ATO tech/Chuang Zhi |
| ENEKI |  | Au: 0.05~0.125um, Pd: 0.05~0.125um,Ni:5~10um | Chuang Zhi |
| Khauta e Thata |  | Au: 0.2~1.5um, Ni: bonyane 2.5um | Molefi |
| Khauta e Bonolo |  | Au: 0.15~0.5um, Ni:min 2.5um | TLHAPI |
| Tin ea ho qoelisoa |  | Bonyane: 1um | Theknoloji ea Enthone / ATO |
| Silevera ea ho Iqoelisa |  | 0.15~0.45um | Macdermid |
| HASL (OS) e se nang HASL le e nang le lead |  | 1 ~ 25um | Nihon Superior |
Mofuta oa Au/Ni
● Ho maneha khauta ho ka aroloa ka khauta e tšesaane le khauta e teteaneng ho latela botenya. Ka kakaretso, khauta e ka tlase ho 4u”(0.41um) e bitsoa khauta e tšesaane, ha khauta e ka holimo ho 4u” e bitsoa khauta e teteaneng. ENIG e ka etsa khauta e tšesaane feela, eseng khauta e teteaneng. Ho maneha khauta feela ho ka etsang khauta e tšesaane le e teteaneng. Botenya bo boholo ba khauta e teteaneng botong e tenyetsehang bo ka ba ho feta 40u”. Khauta e teteaneng e sebelisoa haholo-holo libakeng tsa mosebetsi tse nang le litlhoko tsa ho khomarela kapa ho hanyetsa ho tsofala.
● Ho maneha khauta ho ka aroloa ka khauta e bonolo le khauta e thata ho latela mofuta. Khauta e bonolo ke khauta e hloekileng e tloaelehileng, ha khauta e thata e le cobalt e nang le khauta. Ke hobane cobalt e ekelitsoe hore thatafalo ea lera la khauta e eketseha haholo ho feta 150HV ho fihlela litlhoko tsa ho hanyetsa ho tsofala.
| Mofuta oa Boitsebiso | Matlo | Mofani | |
| Thepa e Tiileng | Tahlehelo e Tloaelehileng | DK>4.2, DF>0.02 | NanYa / EMC / TUC / ITEQ / ShengYi / Isola / Doosan jj. |
| Tahlehelo e Bohareng | DK>4.1, DF:0.015~0.02 | NanYa / EMC / TUC / ITEQ jj. | |
| Tahlehelo e Tlase | DK:3.8~4.1, DF:0.008~0.015 | EMC / NanYa / TUC / Isola / Panasonic jj. | |
| Tahlehelo e Tlase Haholo | DK:3.0~3.8, DF:0.004~0.008 | EMC / Panasonic / Rogers / TUC / Isola / ITEQ / NanYa jj. | |
| Tahlehelo e Tlase ea Ultra | DK | Rogers / TUC / ITEQ / Panasonic / Isola jj. | |
| BT | 'Mala: Tšoeu / Botsho | MGC / Hitachi / NanYa / ShengYi joalo-joalo. | |
| Foile ea Koporo | E tloaelehileng | Bokgopo(RZ)=6.34um | NanYa, KB, LCY |
| RTF | Bokgopo(RZ)=3.08um | NanYa, KB, LCY | |
| VLP | Bokgopo(RZ)=2.11um | MITSUI, Potoloho ea Foile | |
| HVLP | Bokgopo(RZ)=1.74um | MITSUI, Potoloho ea Foile | |
| Mofuta oa Boitsebiso | DK/DF e tloaelehileng | DK/DF e tlase | |||
| Matlo | Mofani | Matlo | Mofani | ||
| Thepa e Tenyetsehang | FCCL (Ka ED & RA) | Polyimide e tloaelehileng DK:3.0~3.3 DF:0.006~0.009 | Thinflex / Panasonic / Taiflex | Polyimide e fetotsoeng DK:2.8~3.0 DF:0.003~0.007 | Thinflex / Taiflex |
| Sekoahelo (Setšo/Sesehla) | Sekhomaretsi se Tloaelehileng DK:3.3~3.6 Df:0.01~0.018 | Taiflex / Dupont | Sekhomaretsi se Fetotsoeng DK:2.8~3.0 DF:0.003~0.006 | Taiflex / Arisawa | |
| Filimi ea Bond (Botenya: 15/25/40 um) | Epoxy e tloaelehileng DK:3.6~4.0 DF:0.06 | Taiflex / Dupont | Epoxy e fetotsoeng DK:2.4~2.8 DF:0.003~0.005 | Taiflex / Arisawa | |
| Enke ea S/M | Maske ea Solder; 'Mala: Tala / Putsoa / Botšo / Bosweu / Bosehla / Bofubelu | Epoxy e tloaelehileng DK:4.1 DF:0.031 | Taiyo / OTC / AMC | Epoxy e fetotsoeng DK:3.2 DF:0.014 | Taiyo |
| Enke ea tšōmo | 'Mala oa skrine: Botšo / Bosweu / Bosehla Inkjet 'Mala: Bosweu | AMC | |||
| Lisebelisoa tse ling | IMS | Li-substrate tsa tšepe tse nang le insulation (tse nang le Al kapa Cu) | EMC / Ventec | ||
| Motlakase o Phahameng oa Thermal | 1.0 / 1.6 / 2.2 (Boemo ba Leholimo/Bophara) | ShengYi / Ventec | |||
| Ke | Foile ea silevera (SF‐PC6000‐U1 / SF‐PC8600‐C) | Tatsuta | |||
Lebelo le Phahameng le Lisebelisoa tsa Maqhubu a Phahameng (E tenyetsehang)
| DK | Df | Mofuta oa Boitsebiso | |
| FCCL (Polyimide) | 3.0~3.3 | 0.006~0.009 | Letoto la Panasonic R‐775; Letoto la Thinflex A; Letoto la Thinflex W; Letoto la Taiflex 2up |
| FCCL (Polyimide) | 2.8~3.0 | 0.003~0.007 | Letoto la Thinflex LK; Letoto la Taiflex 2FPK |
| FCCL (LCP) | 2.8~3.0 | 0.002 | Letoto la Thinflex LC; Panasonic R‐705T se; Letoto la Taiflex 2CPK |
| Sekoahelo | 3.3~3.6 | 0.01~0.018 | Letoto la Dupont FR; Letoto la Taiflex FGA; Letoto la Taiflex FHB; Letoto la Taiflex FHK |
| Sekoahelo | 2.8~3.0 | 0.003~0.006 | Letoto la Arisawa C23; Letoto la Taiflex FXU |
| Leqephe la Tlamahano | 3.6~4.0 | 0.06 | Letoto la Taiflex BT; Letoto la Dupont FR |
| Leqephe la Tlamahano | 2.4~2.8 | 0.003~0.005 | Letoto la Arisawa A23F; Letoto la Taiflex BHF |
Theknoloji ea ho Cheka ka Morao
● Melaetsa ea microstrip ha ea lokela ho ba le li-vias, e tlameha ho hlahlojoa ho tloha lehlakoreng la molaetsa.
● Molaetsa o ka lehlakoreng la bobedi o lokela ho hlahlojwa ho tloha lehlakoreng la bobedi (Lehlakore la ho qala le lokela ho ba ka lehlakoreng leo).
● Moralo o motle ke hore mesaletsa ea stripline e lokela ho hlahlojoa ho tsoa lehlakoreng lefe kapa lefe le fokotsang stub haholo.
● Liphetho tse ntle ka ho fetisisa bakeng sa stripline li tla fumanoa ka ho sebelisa li-vias tse khutšoane tse qhetsoeng morao.
Kopo ea Sehlahisoa: Sensor ea radar ea likoloi
Lintlha tsa Sehlahisoa:
PCB ea mekhahlelo e 4 e nang le thepa e kopantsoeng (Hydrocarbon + Standard FR4)
Bophahamo: 4L HDI / E sa lekanang
Phephetso:
Thepa e nang le maqhubu a phahameng e nang le Standard FR4 Lamination
Tekanyo e laoloang ea botebo
Kopo ea Sehlahisoa: Sensor ea radar ea likoloi
Lintlha tsa Sehlahisoa:
PCB ea mekhahlelo e 4 e nang le thepa e kopantsoeng (Hydrocarbon + Standard FR4)
Bophahamo: 4L HDI / E sa lekanang
Phephetso:
Thepa e nang le maqhubu a phahameng e nang le Standard FR4 Lamination
Tekanyo e laoloang ea botebo
Kopo ea Sehlahisoa:
Seteishene sa motheo
Lintlha tsa Sehlahisoa:
Mealo e 30 (Thepa e ts'oanang)
Ho bokellana: Palo e phahameng ea lera / E lekanang
Phephetso:
Ngoliso bakeng sa mekhahlelo ka 'ngoe
Karolelano e phahameng ea PTH
Paramethara ea bohlokoa ea lamination
Kopo ea Sehlahisoa:
Khopolo
Lintlha tsa Sehlahisoa:
Ho bokellana: Mealo e 16 Moalo ofe kapa ofe
Teko ea IST: Boemo: 25‐190℃ Nako: 3 mets, 190‐25℃ Nako: 2 mets, 1500 Potoloho. Sekhahla sa phetoho ea khanyetso≤10%, Mokhoa oa teko: IPC‐TM650‐2.6.26. Sephetho: Pasa.
Phephetso:
Ho laminating ka makhetlo a fetang 6
Ho nepahala ha li-vias tsa laser
Kopo ea Sehlahisoa:
Khopolo
Lintlha tsa Sehlahisoa:
Ho bokellana: Lesoba
Thepa: FR4 e tloaelehileng
Phephetso:
Ho sebelisa theknoloji ea De‐cap ho PCB e Tiileng
Ngoliso lipakeng tsa mekhahlelo
Ho petetsoa hanyane sebakeng sa litepisi
Mokhoa oa bohlokoa oa ho benya bakeng sa G/F
Kopo ea Sehlahisoa:
Mojule oa Khamera / Buka ea Lintlha
Lintlha tsa Sehlahisoa:
Ho bokellana: Lesoba
Thepa: FR4 e tloaelehileng
Phephetso:
Ho sebelisa theknoloji ea De‐cap ho PCB e Tiileng
Lenaneo la bohlokoa la laser le liparamente ts'ebetsong ea De-cap
Kopo ea Sehlahisoa:
Mabone a likoloi
Lintlha tsa Sehlahisoa:
Ho bokellana: IMS / Heatsink
Lisebelisoa: Tšepe + Sekhomaretsi/Bolokolohi ba Pele + PCB
Phephetso:
Motheo oa aluminium le motheo oa koporo (lera le le leng)
Ho khanna ha mocheso
FR4+ Sekhomaretsi/Bolokolohi ba Pele + Bolokolohi ba Al
Melemo:
Ho qhala ha mocheso o moholo
Lintlha tsa Sehlahisoa:
Thepa e potlakileng haholo (E ts'oanang)
Ho bokellana: Chelete ea tšepe ea koporo e kentsoeng / e tšoanang
Phephetso:
Ho nepahala ha tekanyo ea chelete ea tšepe
Ho nepahala ha ho buloa ha lamination
Phallo ea resin e mahlonoko
Kopo ea Sehlahisoa:
Seteishene sa likoloi / sa indasteri / sa motheo
Lintlha tsa Sehlahisoa:
Koporo ea motheo ea lera la kahare 6OZ
Koporo e ka ntle e nang le motheo o ka ntle 3OZ/6OZ e tlameletsoe ka ho feletseng:
Boima ba koporo ba 6OZ ka lera le ka hare
Phephetso:
Lekhalo la koporo la 6OZ le tlatsitsoe ka botlalo ka epoxy
Ha ho na ho kheloha ha ho sebetsoa ha lamination
Kopo ea Sehlahisoa:
Fono e bohlale / Karete ea SD / SSD
Lintlha tsa Sehlahisoa:
Ho bokellana: HDI / Anylayer
Thepa: FR4 e tloaelehileng
Phephetso:
Profaele e tlase haholo/RTF Cu foil
Ho tšoana ha Plating
Filimi e omileng e nang le qeto e phahameng
Ho pepesehela LDI (Setšoantšo se tobileng sa Laser)
Kopo ea Sehlahisoa:
Puisano / Karete ea SD / Mojule oa Optical
Lintlha tsa Sehlahisoa:
Ho bokellana: HDI / Anylayer
Thepa: FR4 e tloaelehileng
Phephetso:
Ha ho lekhalo le ka lehlakoreng la monoana ha PCB e ntse e sebetsa ka khauta e betliloeng
Filimi e ikhethang e hanyetsanang
Kopo ea Sehlahisoa:
Indasteri
Lintlha tsa Sehlahisoa:
Ho bokellana: Ho tiea-ho Flex
Ka Eccobond phetohong ea Rigid-Flex
Phephetso:
Lebelo le tebileng la ho falla le botebo ba shaft
Paramethara ea khatello ea moea e mahlonoko