Tlhahiso ea PCB le PCBA
Seboka sa mosebetsi
Hlahloba libaka tsa rona tsa tlhahiso tsa sejoale-joale le lits'ebetso tse tsoetseng pele tsa tlhahiso
Lethathamo la Lisebelisoa tsa Tlhahiso ea PCB
Lisebelisoa tsa tlhahiso tse fetang 200 tse nepahetseng haholo, ho kenyeletsoa le mechini e 50 ea ho cheka ea li-axis tse tšeletseng, mechini e 10 ea ho cheka ea laser, le mechini e 20 ea AOI, e fanang ka mohala oa tlhahiso o iketsang ka botlalo.
I/L — Setšoantšo sa Lera la ka Hare le AOI
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Hloekisa pele (enke) | Orbotech, Schmid | 3 | Hloekisa diphanele tse ka hare pele o di penta |
| Sekoahelo sa Roller (Se otlolohileng) | Schmid, KCE | 2 | Ho penta ka ho otloloha ha photoresist |
| Sekoahelo sa Roller (Se otlolohileng) | Schmid, KCE | 1 | Ho koahela/ho lamination ho otlolohileng ha photoresist |
| DES (Hlahisa/Etsa/Etsa/Etsa Sekotwana) | Atotech, Manz, HOYA, YangBo (TW) | 3 | Ho ntshetsa pele lera le ka hare–ho ntsha–ho ntsha |
| Ho Itlhahisa ka Bohona (enke) | Orbotech, Lithography e se nang maske, Skrine | 5 | Ho pepesehela ka boiketsetso bakeng sa mekhahlelo e ka hare |
| Ho pepesehela ka letsoho | Colight, OLEC | 1 | Ho pepesehela likarolo tse nyane ka letsoho |
| Ho sibolloa ha I/L AOI | Orbotech | 6 | Ho lemoha sekoli sa AOI sa lera le ka hare |
| Seteishene sa ho Sebetsa Bocha sa V-Smart | Orbotech | 5 | Netefatso/phetoho ka letsoho bakeng sa liphoso tsa AOI |
| Spiron ea I/L AOI | Orbotech | 3 | Tlhahlobo ea AOI e kopaneng le lera le ka hare |
| Ke khothaletsa I/L AOI | Orbotech | 1 | AOI e ka hare e nang le lera le phahameng le nepahetseng |
| OPE (Punch ea lera le ka hare) | LPKF, Schmoll, Mitsubishi | 2 | Lisebelisoa/ho phunya bakeng sa ngoliso ea lamination |
Tobetsa — Lamination le Oxide e sootho
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Oxide e sootho ea Bondfilm e otlolohileng | ChuangKe, DengTai | 2 | Ho lokisa bokaholimo pele ho lamination |
| Mochini o Tloaelehileng oa ho Hatisa (2 o Chesang + 1 o Batang) | HuoQuan | 2 | Lamination |
| Mochini oa Khatiso oa Elektroniki (ADARA 48 / 73) | CEDATE (Italy) | 4 | Ho lamination ka nepo |
| RBM Thermal Fusion (Hot-Melting) | HuoQuan; MuNuo | 4+2, 12 | Thuso ea phallo ea resin |
| Ho Beha ka Bootho/ka Matsoho (Stacker) | CEDATE (Italy) | 4 | Ho beoa ha lamination |
| Sehahi se Iketsang sa PP | ZhengYe | 4 | Ho seha ha PP esale pele |
| Ho Cheka ka X-ray (Lisebelisoa) | DeLiFu; HaoShuo | 4 | Ngoliso le ho cheka ka sepheo |
| Tlhahlobo ea X-ray | Aisida | 2 | Netefatso ea ngoliso kamora khatiso |
RF — Rigid-Flex Lamination & Flex Core
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Regal-Flex Press | — | 10 | Lamination e tiileng-e feto-fetohang |
| PLASMA (bakeng sa Regal-Flex) | — | 2 | Ho kenya tshebetsong bokaholimo bakeng sa ho kgomarela ho flex |
| Sehloekisi sa Poleiti ea Tšepe | — | 2 | Lipoleiti tse hloekileng tsa lamination |
| Ho Seha ka Laser ea UV | — | 2 | Ho seha sebopeho se flexible/sekoahelo |
| Sehahi sa Flex-Core | — | 2 | Ho seha ha motheo o flexible |
| Onto e otlolohileng | — | 2 | Ho baka/ho phekola ka mokhoa o feto-fetohang |
| Laminator e Nyenyane-E Kholo | — | 2 | Lamination e tšesaane ea filimi e omileng |
Ho Cheka — Mekaniki le Laser
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Sekoti sa Laser (5Z00U / ML605GTW5) | Mitsubishi | 20 | Ho cheka ka laser ea microvia |
| Mechini ea ho phunya e tšeletseng | Hitachi; LongZe; DongTai; DaLiang | 150+ | Ho cheka ka lebelo le phahameng |
| Mechini ea ho phunya e nang le li-spindle tse peli | XueLong; HuaJian; DaLiang | 8 | Mohlala le ho cheka setša se senyenyane |
| Sekenara sa Boemo ba Lesoba (CPK) | MACHVISION | 2 | Tlhahlobo ea ngoliso ea ho phunya |
| Sesepa/Polesetara sa Bokaholimo se Iketsang | ChengZhong (CDZ550) | 12 | Ho lokisa le ho lokisa bokaholimo |
Tsela
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Mochini oa ho Tsamaisa Litsela | YOWSUN | 12 | Tsela ea profil |
| Mochini oa ho betla | — | 4 | Ho benya ha moedi |
| Mochini oa ho Otla | — | 6 | Ho tlosa diphanele |
Teko ea Motlakase (ET)
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Setei sa ho Lekola ho Fofa | ATG | 6 | Teko ea ho tsoela pele ha motlakase le ho itšehla thajana |
| Setei sa Lipekere tsa Bethe | — | 10 | Teko ea tlhahiso ea bongata |
Tlhahlobo ea ho Qetela ea Pono (FV)
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Liteishene tsa Tlhahlobo ea Pono | Ka tlung | 40 | QC ea sehlahisoa sa ho qetela |
| Limatlafatsi | — | 20 | Tlhahlobo e ntle ea tšobotsi |
Kamore ea Lifilimi
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Setshwantsho sa Laser | Orbotech | 2 | Sehlahisoa sa filimi |
| Khabinete ea polokelo ea lifilimi | — | 5 | Ho sebetsana le filimi ka mokhoa o sireletsehileng |
FPC (PCB e Tenyetsehang)
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Laminator ea sekoahelo | Hitachi | 3 | FPC coverlay lamination |
| Mochini oa ho Seha oa PI | — | 2 | Ho seha ha polyimide |
| Ho phunya ka laser bakeng sa FPC | — | 2 | Ho tjheka ka microvia bakeng sa ho tenyetseha |
QA (Netefatso ea Boleng / Laboratori)
| Lebitso la Senyesemane | Morekisi(barekisi) | Bongata | Morero |
|---|---|---|---|
| Mekhoa ea ho Lekanya ea 2D/3D | OPTEK; ZhengYe | 1 (2D), 1 (setšoantšo se iketsang) | Tlhahlobo ea litekanyo |
| Teko ea Impedance (CITS800S2) | Polar | 1 | Tekanyo ea impedance |
| Botenya ba ho Koahela X-ray | ZhengYe | 1 | Botenya ba ho betla |
| Teko ea Tšilafalo ea Ion | ZhengYe | 1 | Teko ea bohloeki (ionic) |
| Kamore ea Spray ea Letsoai | — | 1 | Teko ea ho hanyetsa ts'enyeho |
| Kamore ea Tšabo ea Thermal | — | 1 | Ho tšepahala (ho tšoha ha mocheso) |
| Microscope ea Metallographic | Olympus | 1 | Tlhahlobo ea likarolo tse fapaneng |