| Ntho | PCB e tiileng (HDI) | PCB e tenyetsehang | PCB e tiileng-Flex |
| Lera le Phahameng | 2-68L | 12L | 68L |
| Lera le ka Hare la Bonyane la Trace/Sebaka | 1.4/1.4mil | 2/2mil | 2/2mil |
| Lera le ka ntle la ho latela/Sebaka se senyenyane | 1.4/1.4mil | 3/3mil | 3/3mil |
| Koporo e ka Hare ea Max | 6oz | 2oz | 6oz |
| Koporo e ka ntle ea Max | 6oz | 3oz | 6oz |
| Ho Cheka Mechine e Menyenyane | 0.15mm/6mil | 0.15mm | 0.15mm |
| Ho Cheka ha Laser e Nyenyane | 0.05mm/3mil | 0.05mm | 0.05mm |
| Karolelano e Phahameng ea Mahlakore (Mechanical Drilling) | 20:1 | / | 20:1 |
| Karolelano e Phahameng ea Mahlakore (Ho Cheka ka Laser) | 1:1 | 1:1 | 1:1 |
| Ho Lekanya Mealo e Kopaneng | +/-0.254mm(1mil) | ± 0.05mm | ± 0.05mm |
| Mamello ea PTH | ± 0.075mm | ± 0.075mm | ± 0.075mm |
| Mamello ea NPTH | ± 0.05mm | ± 0.05mm | ± 0.05mm |
| Mamello ea Countersink | +0.15mm | ± 0.15mm | ± 0.15mm |
| Botenya ba boto | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Boto Botenya Mamello ( |
± 0.1mm | ± 0.05mm | ± 0.1mm |
| Boto Botenya Mamello (≥1.Omm) | ± 8% | / | ± 10% |
| Boholo ba Boto bo Bonyane | 10 * 10mm | 5*5mm | 10 * 10mm |
| Boholo ba Boto | 1200mm*750mm | 500*1200mm | 500*500mm |
| Tekanyo ea Kemiso | +/-0.075mm(3mil) | ± 0.05mm | ± 0.1mm |
| BGA ea ka | 0.125mm (5mil) | 7mil | 7mil |
| SMT ea ka | 0.177*0.254mm(7*10mil) | 7*10mil | 7*10mil |
| Sebaka se Senyenyane sa ho Hlahisa Mask | 1.5mil | 2mil | 1.5mil |
| Letamo la ka la Maske ea Solder | 3mil | 3mil | 3mil |
| Tšōmo | Bosweu, Botsho, Bofubedu, Bosehla | Bosweu, Botsho, Bofubedu, Bosehla | Bosweu, Botsho, Bofubedu, Bosehla |
| Bophara/Bophahamo bo Bonyenyane ba Tšōmo | 4/23mil | 4/23mil | 4/23mil |
| Metsotsoana ea ho Koba (Boto e le 'Ngoe) | / | Botenya ba Boto ba 3-6 | Botenya ba Boto ea Flexbile ea 3-7 x |
| Metsotsoana ea ho Koba (Boto e habeli ea lehlakore) | / | Botenya ba Boto ea 6-10 x | Botenya ba Boto ea Flexbile ea 6-11 x |
| Metsotsoana ea ho Koba (Boto ea Mebala e mengata) | / | 10-15 x Botenya ba Boto | Botenya ba Boto ea Flexbile ea 10-16 x |
| Metsotsoana e Kobehang (Ho Kobeha ho Matla) | / | Botenya ba Boto ea 20-40 x | 20-40 × Botenya ba Boto |
| Bophara ba Fillet ea Mathata | / | 1.5+0.5mm | 1.5+0.5mm |
| Seqha le ho Sotha | 0.005 | / | 0.0005 |
| Mamello ea Impedance | E Felletseng ka Bong: ±5Ω(≤50Ω)，±7%(＞50Ω) | E Felletseng ka Bong: ±5Ω(≤50Ω),±10%(＞50Ω) | E Felletseng ka Bong: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Mamello ea Impedance | Phapang: ±5Ω(≤50Ω)，±7%(＞50Ω) | Phapang: ± 5Ω(≤50Ω),± 10%(＞50Ω) | Phapang: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Maske ea Solder | Botala, Botsho, Boputsoa, Bofubedu, Matt Botala, Bosehla, Bosweu, Pherese | Maske e Tala ea Solder/PI e Ntšo/PI e Tšehla | Botala, Botsho, Boputsoa, Bofubelu, Matt Botala |
| Qetello ea Bokaholimo | Ho penta ka khauta e ikhethang, ENIG, Ho penta ka khauta e thata, Monoana oa khauta, Silevera ea ho qoelisoa, Ho penta ka khauta, HASL LF, OSP, ENEPIG, Ho penta ka khauta e bonolo | Ho maneha khauta ka elektroniki, ENIG, Ho maneha khauta ka thata, Monoana oa khauta, Silevera ea ho qoelisoa, Tin ea ho qoelisoa, OSP, ENEPIG, Ho maneha khauta ka bonolo | Ho betla khauta ka elektroniki, ENIG, Ho betla khauta ka thata, Monoana oa khauta, Silevera ea ho qoelisoa, Tin ea Immersio, HASL LF, OSP, ENEPIG, Ho betla khauta ka bonolo |
| Ts'ebetso e Ikhethang | E patiloe/e foufetse ka tsela, poropo ea mohato, e kholo haholo, e patiloe khanyetso/bokgoni, khatello e tsoakiloeng, RF, monoana oa khauta, sebopeho sa N+N, koporo e teteaneng, ho cheka ka morao, HDI(5+2N+5) | monoana oa khauta, lamination, sekhomaretsi se tsamaisang motlakase, filimi e sireletsang, dome ea tšepe | E patiloe/e foufetse ka tsela, mokoti oa mohato, e kholo haholo, e patiloe khanyetso/bokhoni, khatello e tsoakiloeng, RF, monoana oa khauta, sebopeho sa N+N, koporo e teteaneng, ho phunya mokokotlo |
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