● Rudzi: PCB (2-68 layers) sampuli & batch kugadzira, yakawana zvakanakisa mhedzisiro muHDI, yakakwira yakawanda-layer PCB, FPC, Rigid-Flex, nezvimwe.
● Special process: gomba rakapofumara / rakavigwa, step groove, ultra size, kuvigwa kupikisa / kukwanisa, hybrid pressing, rigid-flex, chigunwe chegoridhe, N + N chimiro, mhangura inorema, kuchera kumashure.
● Common substrates: FR4 Tg/HIGH, Tg/Low DK, RO4350B, FR408HR, M4, M6, TU862, TU872, Rogers, IT968, nezvimwewo.
● Kupedzwa kwepamusoro: HASL, Pb-isina HASL, ENIG, Immersion Tin, Immersion sirivheri, goridhe plating, OSP, ENIG + OSP, ENEPIG.
● IISO9001/ISO14001/TS16949/UL//ISO13485/QC08000/GJB 9001C-2017 zvitupa.