● Typus: PCB (2-68 stratis) fabricatio exemplaris et fasciculorum, praeclara consecuta in HDI, PCB multistrato alto, FPC, Rigid-Flex, etc.
● Processus specialis: foramen caecum/sepultum, sulcus gradatim confectus, magnitudo ultra, resistentia/capacitas sepulta, pressio hybrida, rigido-flexibilis, digitus aureus, structura N+N, cuprum grave, perforatio retrorsum.
● Substrata communia: FR4 Tg/ALTA, Tg/Humilis DK, RO4350B, FR408HR, M4, M6, TU862, TU872, Rogers, IT968, etc.
● Superficies: HASL, HASL sine plumbo, ENIG, Stannum immersionis, Argentum immersionis, Auratum, OSP, ENIG+OSP, ENEPIG.
● Certificationes IISO9001/ISO14001/TS16949/UL//ISO13485/QC08000/GJB 9001C-2017.