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Kupedzisa kwePCB

Kupedzisa Kwepamusoro Kukosha Kwakajairika Mutengesi
Dhipatimendi reMoto reVazvipiri 0.3~0.55µm, 0.25~0.35µm Enthone
Shikoku Chemical
BVUMIRANA Kana: 0.03~0.12um, Ni: 2.5~5um ATO tech/Chuang Zhi
Sarudzo yeENIG Kana: 0.03~0.12um, Ni: 2.5~5um ATO tech/Chuang Zhi
ENEKI Au: 0.05~0.125µm, Pd: 0.05~0.3µm Chuang Zhi
Mukati: 3 ~ 10um
Ndarama Yakaoma Au : 0.127~1.5um , Ni : min 2.5um Mubhadhari/EEJA
Goridhe Rakapfava Au : 0.127~0.5um , Ni : min 2.5um HOVE
Tin yekunyudza Minimum: 1am Enthone / ATO tech
Sirivha Yekunyudzwa 0.127~0.45um Macdermid
HASL isina lead 1 ~ 25um Nihon Superior

Nekuda kwekuti mhangura iripo muchimiro chema oxides mumhepo, zvinokanganisa zvakanyanya kugona kusvira uye mashandiro emagetsi emaPCB. Saka, zvakakosha kuita kupedzisa pamusoro pePCB. Kana pamusoro pePCB pasina kupera, zviri nyore kukonzera matambudziko ekusvira chaiwo, uye muzviitiko zvakakomba, mapedhi esvira uye zvikamu hazvigone kusvira. Kupedzisa pamusoro pePCB kunoreva maitiro ekugadzira pamusoro pePCB. Chinangwa chekupedzisa kwePCB ndechekuona kuti PCB ine kugona kusvira zvakanaka kana kushanda kwemagetsi. Kune mhando dzakawanda dzekupedzisa pamusoro pePCB.
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Kuenzanisa Kwemhepo Inopisa (HASL)

Inzira yekuisa solder yesimbi yakanyungudutswa pamusoro pePCB, woipukuta nemhepo inopisa yakamanikidzwa woita jira rekupenda rinodzivirira kuoxidation yemhangura uye rinopa mukana wakanaka wekusonesa. Munguva iyi, zvakakosha kuti uve nehunyanzvi hwezvinhu zvinotevera zvakakosha: tembiricha yekusonesa, tembiricha yebanga remhepo inopisa, kumanikidzwa kwebanga remhepo inopisa, nguva yekunyudza, kumhanya kwekusimudza, nezvimwewo.

Kubatsira kweHASL
1. Nguva yakareba yekuchengetedza.
2. Kunyorovesa zvakanaka padhi uye kufukidza mhangura.
3. Rudzi rwacho runoshandiswa zvakanyanya rusina mutobvu (runoenderana neRoHS).
4. Tekinoroji yevakuru, inodhura zvishoma.
5. Yakakodzera kwazvo kuongororwa nemaziso uye kuyedzwa nemagetsi.

Kusasimba kweHASL
1. Hazvina kukodzera kubatanidza waya.
2. Nekuda kwe meniscus yechisikigo ye solder yakanyungudutswa, kutsetseka kwayo kwakashata.
3. Hazvishande kune maswichi ekubata ane capacitive.
4. Kune mapaneru akatetepa, HASL ingasakodzera. Kupisa kwakanyanya kwebhavhu kunogona kukonzera kuti bhodhi redunhu ritenderere.

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2. Dhipatimendi reMoto reVazvipiri
OSP ipfupiso yeOrganic Solderability Preservative, inozivikanwawo se per solder. Muchidimbu, OSP inoreva kuti inopfapfaidzwa pamusoro pe copper solder pads kuti ipe firimu rekudzivirira rakagadzirwa nemakemikari eorganic. Firimu iri rinofanira kunge riine zvinhu zvakaita se oxidation resistance, thermal shock resistance uye hunyoro resistance kudzivirira copper surface kubva kungura (oxidation kana vulcanization, nezvimwewo) munzvimbo dzakajairika. Zvisinei, mukunyungudika kwekupisa kwakanyanya kunotevera, firimu iri rekudzivirira rinofanira kubviswa nyore nyore ne flux nekukurumidza, kuitira kuti copper surface yakachena yakaratidzwa ikwanise kubatana nekunyungudika kuti igadzire solder joint yakasimba munguva pfupi. Nemamwe mashoko, basa reOSP nderekushanda sechipingamupinyi pakati pe copper nemhepo.

Kubatsira kweOSP
1. Zviri nyore uye zvinokwanisika kutenga; Kupedzisa pamusoro pechinhu ichi kungopfapfaidza chete.
2. Pamusoro pe solder pad pakanyatsotsvedzerera, ine hurefu hwakafanana neENIG.
3. Hapana mutobvu (unoenderana neRoHS standards) uye hauna kukuvara.
4. Inogona kugadziriswazve.

Kusasimba kweOSP
1. Kunyorova kusina kunaka.
2. Kujeka uye kutetepa kwefirimu zvinoreva kuti zvakaoma kuyera mhando kuburikidza nekutarisa nemaziso uye kuita bvunzo online.
3. Nguva pfupi yebasa, zvinodiwa zvakanyanya pakuchengetera nekubata.
4. Kudzivirirwa kwakashata kwepurasitiki inoputirwa nemaburi.

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Sirivha Yekunyudzwa

Sirivha ine hunhu hwakagadzikana hwemakemikari. PCB inogadziriswa nehunyanzvi hwekunyudza sirivha inogona kuramba ichiita zvakanaka nemagetsi kunyangwe ikasangana nenzvimbo dzinopisa zvakanyanya, dzine hunyoro uye dzakasvibiswa, pamwe nekuchengetedza kugona kwayo kunyudza kunyangwe ikarasikirwa nekubwinya kwayo. Kunyudza sirivha inyaya inochinja-chinja apo jira resirivha yakachena rinoiswa zvakananga pamusoro pemhangura. Dzimwe nguva, sirivha inonyudzwa inosanganiswa neOSP coatings kudzivirira sirivha kuti isabatane nesulfides munzvimbo.

Kubatsira kweSirivha Yakanyudzwa
1. Kugona kusungirira zvakanyanya.
2. Kureba kwakanaka kwenzvimbo.
3. Mutengo wakaderera uye usina mutobvu (zvinoenderana neRoHS standards).
4. Inoshanda kune Al waya bonding.

Kusasimba kweSirivha Yakanyudzwa
1. Zvinodiwa pakuchengetera zvinhu zvakawanda uye zviri nyore kusvibiswa.
2. Nguva pfupi yekuunganidza mushure mekuburitsa kubva mupakeji.
3. Zvakaoma kuita bvunzo dzemagetsi.

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Tin yekunyudza

Sezvo zvese zvinosungirirwa zvichibva patini, tini inogona kuenderana nechero rudzi rwezvinosungirirwa. Mushure mekuwedzera zvinowedzerwa zve organic ku tin immersion solution, chimiro chetini chinoratidza chimiro che granular, ichikunda matambudziko anokonzerwa ne tin whiskers uye tin falling, ukuwo iine kugadzikana kwakanaka kwekupisa uye kugona kusungirirwa.
Maitiro eImmersion Tin anogona kugadzira tin yemhangura yakati sandara pakati pesimbi kuti tin yemvura ikwanise kusanganiswa zvakanaka pasina matambudziko ekupfava kana kupararira kwesimbi.

Kubatsira kweTin yekunyudza
1. Inoshanda pamitsetse yekugadzira yakatwasuka.
2. Inoshanda pakugadzirisa waya dzakapfava uye pakusungirira pasina mutobvu, kunyanya pakugadzirisa.
3. Kureba kwayo kwakanaka kwazvo, kunoshanda kuSMT.

Kusasimba kweTin yekunyudza
1. Kudiwa kwekuchengetedza kwakanyanya, zvinogona kukonzera kuti zvigunwe zvichinje ruvara.
2. Mashavha esimbi anogona kukonzera matambudziko ekupfupisa majoini uye matambudziko ekusonesa, zvichiita kuti nguva yekushanda ipfupi.
3. Zvakaoma kuita bvunzo dzemagetsi.
4. Maitiro acho anosanganisira zvinhu zvinokonzera kenza.

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BVUMIRANA

ENIG (Electroless Nickel Immersion Gold) ipurasitiki inoshandiswa zvakanyanya ine zvidimbu zviviri zvesimbi, apo nickel inoiswa zvakananga pamhangura uye maatomu egoridhe anoputirwa pamhangura kuburikidza nekuchinja kwekuchinja. Ukobvu hwemukati me nickel hunowanzova 3-6um, uye ukobvu hwekunze kwegoridhe hunowanzova 0.05-0.1um. Nickel inoumba chigadziko chinovhara pakati pe solder nemhangura. Basa regoridhe nderekudzivirira nickel oxidation panguva yekuchengetwa, nokudaro zvichiwedzera hupenyu hwesherufu, asi maitiro egoridhe rekunyudza anogonawo kugadzira kutsetseka kwakanaka kwepamusoro.
Kufambiswa kwe ENIG ndekwekuti: kuchenesa-->kutema-->chinokonzeresa-->kuputira makemikari e nickel-->kuisa goridhe-->kuchenesa zvakasara

Mabhenefiti eENIG
1. Yakakodzera kusungirirwa kwesimbi isina mutobvu (inoenderana neRoHS).
2. Kutsvedzerera kwepamusoro-soro.
3. Inogara kwenguva refu uye nzvimbo inogara kwenguva refu.
4. Yakakodzera Al waya bonding.

Kusasimba kweENIG
1. Inodhura nekuda kwekushandisa goridhe.
2. Maitiro akaomarara, akaoma kudzora.
3. Zviri nyore kugadzira chinhu chepedhi nhema.

Electrolytic Nickel/Goridhe (goridhe rakaoma/goridhe rakapfava)

Goridhe reNickel reElectrolytic rakakamurwa kuita "goridhe rakaoma" uye "goridhe rakapfava". Goridhe rakaoma harina kuchena kwakawanda uye rinowanzoshandiswa muminwe yegoridhe (PCB edge connectors), PCB contacts kana dzimwe nzvimbo dzisingapfeki. Ukobvu hwegoridhe hunogona kusiyana zvichienderana nezvinodiwa. Goridhe rakapfava rine kuchena kwakakwirira uye rinowanzoshandiswa mukubatanidza waya.

Kubatsira kweElectrolytic Nickel/Goridhe
1. Nguva refu yekushanda.
2. Yakakodzera kubatanidza tambo nekubatanidza waya.
3. Goridhe rakaoma rakakodzera kuyedzwa nemagetsi.
4. Hapana mutobvu (inotevedzera RoHS)

Kusasimba kweElectrolytic Nickel/Goridhe
1. Kupedzisa kwepamusoro kunodhura zvikuru.
2. Zvigunwe zvegoridhe zvinoshandisa electroplate zvinoda waya dzinofambisa mhepo.
3. Goridhe raive risina kunyatsogonya zvakanaka. Nekuda kweukobvu hwegoridhe, zvidimbu zvakakora zvakaoma kugonya.

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ENEKI

Electroless Nickel Electroless Palladium Immersion Gold kana ENEPIG iri kushandiswa zvakanyanya pakupedzisa PCB. Zvichienzaniswa neENIG, ENEPIG inowedzera imwe layer ye palladium pakati pe nickel negoridhe kuchengetedza nickel layer kubva mukuora uye kudzivirira kugadzira mapedhi matema anogadzirwa nyore nyore mu ENIG surface finish process. Ukobvu hwe nickel hwakaita 3-6um, ukobvu hwe palladium hunenge 0.1-0.5um uye ukobvu hwegoridhe hunenge 0.02-0.1um. Kunyangwe ukobvu hwegoridhe huri hudiki pane ENIG, ENEPIG inodhura zvakanyanya. Zvisinei, kudzikira kwemitengo ye palladium munguva pfupi yapfuura kwakaita kuti mutengo weENEPIG uve wakaderera.

Kubatsira kweENEPIG
1. Ine mabhenefiti ese eENIG, hapana chinhu cheblack pad.
2. Yakakodzera kubatanidza waya kupfuura ENIG.
3. Hapana njodzi yekuora.
4. Nguva refu yekuchengetedza, isina lead (inoenderana neRoHS)

Kusasimba kweENEPIG
1. Maitiro akaomarara, akaoma kudzora.
2. Mutengo wakakwira.
3. Inzira itsva uye haisati yakura.