Pampiri e Tšoeu ea Taolo ea Boleng ba PCB e Phahameng
Temohisiso ea Pele: Karolo ea Bohlokoa ea Taolo ea Boleng Mehleng ea Li-PCB tse Nang le Khafetsa e Phahameng
Mapolanka a potoloho a hatisitsoeng ka maqhubu a phahameng (li-PCB) a kajeno a sebetsa e le motheo oa theknoloji bakeng sa litsamaiso tse ngata tse tsoetseng pele tsa elektroniki. Ho tloha ho latella ho tlase haholo puisanong ea 5G le ho beha ka nepo ho tsamaiseng sathelaete, ho ea ts'ebetsong ea matšoao a radar libakeng tse rarahaneng tsa motlakase le k'homphieutha e sebetsang hantle, ho tšepahala le ho nepahala ha li-PCB tse nang le maqhubu a phahameng ke habohlokoa haholo.
Bakeng sa litsebi tsa boleng bo holimo le baenjiniere ka ho tšoana, ho tseba lintlha tse rarahaneng tsa taolo ea boleng ba PCB e phahameng ho bohlokoa. Pampiri ena e tšoeu e fana ka leseli le tebileng mohatong o mong le o mong oa netefatso ea boleng—ho tloha moralong ho ea tlhahisong—mme e hlalosa maano a ho fihlela maemo a ts'ebetso a ntseng a eketseha a lits'ebetso tsa moloko o latelang.
Moralo: Motheo oa Boleng
Sebopeho sa Potoloho: Ho nepahala ke Ntho ea Bohlokoa
Lipotolohong tse nang le maqhubu a phahameng, botšepehi ba lets'oao bo itšetlehile ka taolo e hlokolosi ea impedance. Mohlala, ho boloka impedance e ikhethang ka hare ho ± 5% (hangata 50Ω kapa 75Ω) ho bohlokoa haholo, haholo-holo ho Li-PCB tsa seteishene sa motheo sa 5G. Diphapang tse nyane, tse kang ho se tshwane ha 0.1Ω maqhubung a maqhubu a millimeter (24–52GHz), di ka lebisa ho pontshong e matla, ho fokotseha ha letshwao, le ho eketseha ha sekgahla sa diphoso tsa bit.
Ho fokotsa sena, baenjiniere ba meralo ba itshetlehile ka software e tswetseng pele ya ho etsisa motlakase ho ntlafatsa bophara ba mola, sebaka, botenya ba dielectric, le botsitso ba dielectric (Dk). Dibakeng tse jwalo tse nang le maqhubu a phahameng, esita le ho se tsitse ha sebopeho sa microscopic ho ka senya tshebetso.
Ho feta moo, topology ea routing e lokela ho laoloa ka hloko:
● Bolelele bo feteletseng ba ho latela mohlala bo eketsa tieho le tahlehelo ea lets'oao.
● Mehlala e menyenyane e eketsa khanyetso.
● Meralo e teteaneng e baka puisano e fapaneng, e lokelang ho lula e le ka tlase ho:
● Moqoqo o Haufi le Bofelo (O LATELANG): -30dB
● Moqoqo o Felletseng (FEXT): -40dB
Bakeng sa li-interface tse lebelo le phahameng joalo ka USB 3.0 kapa HDMI, tsela ea ho tsamaisa lipara tse fapaneng e tlameha ho boloka ho nepahala ho lekanang ha bolelele ba ±5mil ho netefatsa botšepehi ba lets'oao.
Moralo oa Stackup: Ho Leka-lekanya Fisiks le Tlhahiso
Li-PCB tsa sejoale-joale tse nang le maqhubu a phahameng, haholo-holo mecheng ea puisano le lifofane, hangata li feta mekhahlelo e 10. Meralo ena e hloka thepa e nang le DD e tlase le DD e tlase, joalo ka Rogers RO4350B, ho fokotsa tahlehelo ea lets'oao le ho boloka lebelo la data. Leha ho le joalo, thepa ena e hlahisa litšenyehelo tse phahameng le ho rarahana ha ts'ebetso.
Litekanyetso tsa bohlokoa li kenyelletsa:
● Ho nepahala ha ngoliso ea mekhahlelo e fapaneng: e lokela ho ba ka hare ho ±50μm ho qoba ho se tsamaisane hantle kapa ho apara borikhoe bo bokhutšoanyane.
● Maemo a ho lamination:
● Mocheso: 180–220°C
● Khatello: 5–10MPa
● Nako: Metsotso e 30–60
Lihlopha tsa boenjiniere le tsa tlhahiso li tlameha ho sebelisana haufi-ufi ho netefatsa hore meralo ea stackup e lumellana le bokhoni ba moetsi ba ho lamination.
Tlhahiso: Ho tloha Thepang ho ea ho Mosebetsi o Hloahloa
Taolo ea Lisebelisoa tse Tala: Boleng bo Tsoang Mohloling
Sistimi e matla ea tlhahlobo ea boleng e kenang ea bohlokoa. Mohlala:
● Ho kheloha ha Drk: ≤ ± 0.1
● Df (tahlehelo e tetebetseng): ● Ho mamella botenya: ho laoloa ka thata
● Liphoso tsa pono: tse kang lipululana, ho qhaqha le ho ngoatheha li lokela ho qojoa
Bohloeki ba foil ea koporo le litaba tsa resin ea prepreg le tsona li ama ts'ebetso haholo. Koporo e hloekileng haholo e netefatsa khanyetso e tlase, ha phallo e nepahetseng ea resin e netefatsa ho hokahana ho matla ha mekhahlelo e fapaneng. Ho nka lisampole le liteko nako le nako ho thusa ho boloka ho latela litekanyetso tsa boleng ba thepa ea RF.
Taolo ea Boleng ba Ts'ebetso: Ho nepahala ka botlalo bo bong le bo bong
Ho hlaba:
● Ho mamella bophara ba mola: ± 0.05mm
● Ho tšoana ha ho qotsitsoeng: Phapang ea Taolo e fokolang e ka fella ka ho senngoa kapa ho qhekelloa ho feteletseng, e leng se behang botšepehi ba potoloho kotsing.
Ho cheka:
● Ho nepahala ha sebaka sa lesoba: ± 0.1mm
● Ho mamella bophara ba lesoba: ± 0.02mm
Ho hlwekisa ka mora ho tjheka ho tlosa ditshila ho thibela ho roala dikgutshwane. Ho kwahela di-vias ka koporo ho netefatsa hore di-conductivity di a kganna le ho tshepahala.
Ho betla ka motlakase:
● Botenya ba ho betla holim'a metsi: 1–3μm
● Ka ho penta leboteng: 0.5–1.5μm
Taolo e nepahetseng ea k'hemistri ea tharollo le bongata ba hona joale e thibela mathata a kang li-voids, li-bubble, kapa delamination, e leng se netefatsang ts'ebetso ea nako e telele.
Tlhahlobo ea ho Hlōleha le Mehato ea Thibelo
Ho Hlōleha ha Motlakase: Libolai tse Khutsitseng tsa Botšepehi ba Letšoao
Matšoao: ho fokotseha ha molumo, ho sotha, ho bua haholo ka tsela e feteletseng le ho senyeha ha sebopeho sa maqhubu
Mabaka:
● Ho se tsamaisane ha impedance
● Ho se lumellane ha thepa
● Ho fata kapa ho poleitisa ho sa nepahalang
Litharollo:
● Ntlafatso ea moralo e thehiloeng ho ketsiso
● Tiisetso e tiileng ea boleng ba thepa
● Litaolo le tlhahlobo tse ntlafalitsoeng tsa ts'ebetso
Liphoso tsa Sebopeho: Likotsi tsa 'Mele tse Patehileng
Mathata a tloaelehileng:
● Ho qhaqha
● Ho robeha ha mohlala
● Lipotoloho tse khutšoane
● Li-via tse thibetsoeng
Lisosa tsa mantlha li tloha ho liphoso tsa lamination le ho se tsamaisane hantle ha ho tjheka ho isa ho litšila tsa plating. Ho sebetsana le tsona ho hloka:
● Ntlafatso ea ts'ebetso
● Tlhahlobo e iketsang
● Libaka tse hloekileng tsa tlhahiso
Tšepo ea Nako e Telele: Teko ea 'Nete
Matšoenyeho a bohlokoa:
● Mapetso a manonyeletso a solder
● Leqephe la ntoa la PCB
● Ho hloleha ha ho kenya mocheso
Maano a thibelo a kenyeletsa:
● Ho ntlafatsa liprofaele tsa ho tjheseletsa le khetho ea thepa
● Ho bapisa li-CTE tsa thepa ka har'a stackup
● Taolo e tiileng ea tikoloho nakong ea tlhahiso
Tekanyetso ea Indasteri: Boleng e le Phapang
Bahlahisi ba maemo a holimo ba sebelisa:
● Lisebelisoa tsa moralo oa PCB tse thehiloeng ho AI
● Ts'ebetso e iketsahalletsang e tsoetseng pele
● Mekhoa e felletseng ea tlhahlobo
Lihlahisoa tsa bona li fihlela maemo a thata bakeng sa puisano ea 5G, ea lifofane le ea sathelaete, li na le sekhahla se phahameng sa tlhahiso le botšepehi bo sa bapisoeng. Ka lehlakoreng le leng, bahlahisi ba sa holang hantle hangata ha ba na moralo o tsoetseng pele, taolo ea thepa le bokhoni ba tlhahlobo, e leng se lebisang ho sekhahla se phahameng sa liphoso le tlholisano e fokolang.
Ke Hobane'ng ha Thabo e Feletseng e Eketsehileng?
Rich Full Joy e hahile botumo bo tiileng indastering ea RF PCB le boto ea potoloho ea maqhubu a phahameng ka:
● Tsebo e tebileng ea domain ea botšepehi ba lets'oao
● Tsebo ea taolo ea boleng mohatong o mong le o mong
● Tšehetso e felletseng ho tloha moralong ho isa sehlahisoa se felileng
● Katleho e pakiloeng litsamaisong tsa lifofane, tsa mehala ea puisano, tsa radar le tsa sathelaete
Re amohela tšebelisano-'moho le litsebi tsa boleng bo holimo le baenjiniere ba batlang bokhabane tlhahisong ea RF PCB. Re latele bakeng sa temohisiso e eketsehileng ha re ntse re tsoela pele ho khanna boqapi lefapheng la PCB le sebelisoang khafetsa.
