Ho rala bakeng sa ho Etsa Lintho ka Bokhoni ho Li-PCB tse Phethahetseng ka Maqhubu a Phahameng: Ho hokahanya Boiqapelo le Nnete ea Tlhahiso

Selelekela

Moralong oa li-PCB tse nang le maqhubu a phahameng, moralo oa tlhahiso (DFM) ke borokho ba bohlokoa bo hokahanyang boqapi ba boenjiniere le tlhahiso e phahameng le e theko e tlase. Bakeng sa baenjiniere ba meralo ea RF PCB, ho tseba melao-motheo ea DFM ho bolela ho theha liboto tse seng feela tse sebetsang empa hape li tšepahala, li ka atolosoa, le tse sebetsang hantle ho li hlahisa.

Ho tloha ho sebaka sa ho latela mohlala ho sebopeho sa li-stackup, ka moralole jiometri ea sebaka, ntlha e 'ngoe le e 'ngoe e tlameha ho nahana ka linnete tsa thepa e sebelisoang khafetsa le mamello ea tlhahiso. Sengoloa sena se hlalosa likarolo tsa bohlokoa tsa moralo oa PCB o ka hlahisoang khafetsa le kamoo o amang boleng, bokhoni le litšenyehelo kateng.

1. Moralo oa ho Latela le ho Tsamaellana ha Tlhahiso

Bophara bo Botle ba ho Latela le Sebaka

Ho li-PCB tse nang le maqhubu a phahameng, bophara ba motsamao le sebaka li ama bobeli ts'ebetso ea motlakase (mohlala, taolo ea impedance) le chai ea tlhahiso.

• Impedance ea sepheo: 50Ω kapa 75Ω—e hloka bophara/libaka tse nepahetseng tsa ho latela tse baloang ho sebelisoa laminate Dk
• Lithibelo tsa tlhahiso: Bakeng sa thepa e nang le maqhubu a phahameng, phapang ea ts'ebetso e bonolo ho feta ka FR-4 e tloaelehileng

Tataiso ea Moralo: Qoba ho sutumelletsa moeli o tlase oa mamello ea ho hlaba. Sebakeng sa 3mil/3mil, sebelisa 4mil/4mil kapa e kholoanyane holim'a li-laminate tse nang le maqhubu a phahameng ho thibela ho senyeha ha makgutshwane, ho buleha, kapa ho sala morao tshenyo.

Tsela e Sebetsang ea Matšoao

Tsela e atlehang ea ho tsamaisa matšoao a lebelo le phahameng e lokela ho ba:

• Ka ho toba le ka bokhutšoanyane (ho fokotsa ho fokotseha ha lets'oao)
• E arotsoe ka sebaka sa maqhubu (ho thibela ho bua ka tsela e fapaneng)
• E loketse liteko (ka di-pad tsa teko tse fumanehang habonolo)

Sena sea ntlafala botšepehi ba lets'oao, litšehetso teko ea tlhahiso, le ho thibela diphoso tsa tshebetso nakong ya ho sebediswa.

2. Sebopeho sa Stackup: Ho Leka-lekanya Litlhoko tsa Motlakase le Tlhahiso

Palo ea Meralo le Khetho ea Thepa

• Mealo e meng = karohano e betere ya letshwao/matla, empa ditjeo le kotsi di phahame
• Mealo e fokolang haholo = taolo e mpe ea EMI, tsela e sitisitsoeng

Bakeng sa lits'ebetso tse rarahaneng tsa RF joalo ka 5G, Mealo e fetang 10 li tloaelehile. Rogers RO4350B ke khetho e tsebahalang bakeng sa litlhoko tse tlase tsa Dr/Df, empa e hloka taolo e tiileng ts'ebetsong.

Keletso ea Boenjiniere: Khetha li-laminate eseng feela bakeng sa ts'ebetso empa hape le bakeng sa tsona ho sebetsa ka thata, boitšoaro ba ho ikopanyale botsitso ba mocheso nakong ea ho lamination.

Mehopolo ea Ts'ebetso ea Lamination

Li-PCB tsa RF tse nang le mekhahlelo e mengata li hloka taolo e tiileng holim'a:

• Ho nepahala ha ngoliso (± 50μm)
• Liparamente tse hatellang: 180–220°C, 5–10MPa, metsotso e 30–60 ho latela tekanyo ea pele le ea koporo

Ntlafatso ea Stackup e lokela ho leka-lekanya kabo ea dielektri le ho lekana ha koporo ho netefatsa hore lamination e lekana le ho qoba ho warpage kapa delamination.

3. Moralo oa Via le Pad: Ho hokahanya le Bokhoni ba Ts'ebetso

Ka Mofuta le Go tirila Boholo

• Likoti tse phunyeletsang ho bonolo ho e etsa empa ho kenyelletsa likokoana-hloko
• Li-via tse foufetseng le tse patiloeng fokotsa ho sotha ha lets'oao empa ho eketsa litšenyehelo le ho rarahana

Khothaletso ea Moralo: Sebelisa mefuta e loketseng bandwidth ea lets'oao la hau le pokello ea mamello. Qoba ka bophara bo bonyenyane ho feta 0.2 mm, kaha li thatafatsa ho phunya le ho poleiti.

Moralo oa Pad bakeng sa Tšepo ea Solder

• Netefatsa hore li-pad lia tšoana karolo ea maoto le profil ea phallo hape
• Bakeng sa phallo e ncha: ntlafatsa boholo ba pad bakeng sa phallo e lekanang ea solder
• Bakeng sa ho soldera maqhubu: nolofalletsa drainage ea solder ka sebopeho/mokhoa o nepahetseng oa pad

Ho qoba mathata a ho kopanya litšepe: Nahana ka ENIG kapa OSP e khethileng bakeng sa lits'ebetso tse sebelisoang khafetsa. Qoba li-pad tse nang le oxidized kapa tse sa tlameloang hantle tse ka bakang ho betla mabitla, ho hokahanyakapa manonyeletso a batang.

4. Mefokolo e Tloaelehileng le Litharollo tsa Boenjiniere

Liphoso tsa Mola

• Matšoao: Mebala e bulehang, e mekhutšoanyane, kapa bophara bo sa tsitsang
• Lisosa: Mela e mesesaane haholo, taolo e mpe ea ho phunya, ho phunya ho sa tsamaellaneng hantle
• Litharollo:
• Sebelisa mekhoa e itekanetseng li-geometri tse mosa ho etch
• Lekola k'hemistri e nyenyane le ho lokisa bokaholimo ba PCB
• Lekanya mechine ea ho phunya 'me u hlahlobe ho senyeha ha li-bit

Mathata a ho Kopanya Mealo

• Matšoao: Delamination, borikhoe bo bokhutšoanyane ba lera la ka hare
• Lisosa: Khatello/mocheso o fokolang oa lamination kapa ho se tsamaisane hantle
• Litharollo:
• Khetha li-prepreg tse hanelang mongobo
• Sebelisa litsamaiso tsa ho hokahanya lamination tse nepahetseng haholo
• Moralo o nang le ho lekaneng libaka tse arohaneng

Liphoso tsa Via le Pad

• Matšoao: Li-vias tse koetsoeng, ho phuthela ho fokolang, ho phahamisa li-pad kapa ho oxidation
• Lisosa: Lithōle tsa ho phunya, k'hemistri e fokolang ea ho poleiti, ho se khomarele li-pad tse lekaneng
• Litharollo:
• Ntlafatsa tlhoekiso kamora ho cheka
• Boloka k'hemistri ea ho hlapa le liparamente tsa ho betla ka plating
• Ntlafatsa jiometri ea pad 'me u e sebelise sephutheloana sa ho thibela oxidation

Ho Koala Sekheo: Moralo o ka Etsoang o Fana ka Boleng

Likhamphani tse kenyang Melao-motheo ea DFM ho moralo oa RF PCB ho lula ho feta bahlolisani ba bona:

• Poelo e phahameng ea ho pasa pele
• Liphetoho tse fokolang kapa liphetoho tsa moralo
• Ho tšepahala ha nako e telele ho betere
• Litletlebo tsa bareki tse fokotsehileng le litšenyehelo tsa waranti

Ka lehlakoreng le leng, ho hlokomoloha tlhahiso e ka etsoang ho lebisa tiehong ea tlhahiso khafetsa, chai e tlase, le boleng bo sa tsitsang ba sehlahisoa—haholo-holo ho sefofane, tsa bongakakapa lisebelisoa tsa elektroniki tsa tšireletso, moo ho hloleha e seng khetho.

Hobaneng Rich Full Joy e le Molekane oa Hao oa RF PCB ea Molemohali

Ho Thabo e Felletseng e Ruileng, re feta moralo—re etsa boenjiniere bakeng sa katleho ea tlhahisoLitsebi tsa rona li utloisisa potoloho e felletseng ea bophelo ba li-PCB tse nang le maqhubu a phahameng, ho tloha mekhoeng e metle ea DFM ho isa ts'ebetsong e tsoetseng pele ea thepa ea RF.

• Moralo o nepahetseng oa moralo bakeng sa lits'ebetso tsa RF
• Litekanyetso tsa Stackup le mohlala oa impedance
• Netefatso ea moralo ka ho hokahanya ts'ebetso ea tlhahiso
• Meralo e ntlafalitsoeng ka tlhahiso e tšehelitsoeng ke boiphihlelo ba lilemo tse mashome ba tlhahiso ea RF

Tšepa Morui Thabo e Felletseng ho u thusa ho rala e tsamaisoang ke ts'ebetso, e bolokang tjheletele e ka etsoa haholo Li-PCB tsa RF—tse entsoeng ho tloha khopolo-taba ho ea ho setsi sa tlhahiso.