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I-PCB ecinezela rhoqo yeHybrid, i-6L resin plug hole
Umaleko ophezulu/nawuphi na umenzi we-HDI womaleko
Umgangatho
Inkqubo yoLawulo loMgangatho: ISO 9001: 2015, ISO14001: 2015, IATF16949: 2016, OHSAS 18001: 2007, QC080000: 2012SGS, RBA, CQC, WCA kunye ne ESA, SQ MARK, Canon GA, Sony GP
Umgangatho womgangatho wePCB: IPC 1, IPC 2, IPC 3, GJB 362C-2021, AS9100
Inkqubo yokuvelisa ephambili yePCB：IL/lmage、PatternPlating、I/L AOI、B/Oxide、Layup、Press、LaserDrilling、Drilling、PTH、PanelPlating、O/Llmage、PanelPlating、SESEtching、O/L AOI、S/Mask、Legend、SurfaceFinshed（ENIGENEPIG、Hard Gold、Soft Gold、HASL、LF-HASL、lmm Tin、lmm Silver、OSP）、Rout 、ET、FV
Izinto zovavanyo lwezixhobo zokuhlola
i-oven: uvavanyo lokugcina amandla obushushu
Umatshini wokuvavanya inqanaba lokungcola kwe-ion: Uvavanyo lokucoceka kwe-ion
umatshini wokuvavanya ityuwa: Uvavanyo lwetyuwa
Umvavanyi we-DC ombane ophezulu: uvavanyo lokumelana nombane
i-megger: ukumelana nobushushu
umatshini wokuxinana jikelele: uvavanyo lwamandla okukhupha
I-CAF: Uvavanyo lokufuduka kwe-ion, ukuphucula ii-substrates ze-PCB, ukuphucula ukucutshungulwa kwe-PCB, njl.
I-OGP: Ukusebenzisa izixhobo zokulinganisa umfanekiso we-3D ezingadibaniyo, kunye neqonga lokuhamba le-XYZ axis kunye nesibuko sokusondeza ngokuzenzekelayo, kusetyenziswa imigaqo yohlalutyo lomfanekiso ukucubungula imiqondiso yomfanekiso ngekhompyutha, ukulinganiswa kobukhulu bejometri kunye nokunyamezelana kwendawo kunokufunyaniswa ngokukhawuleza nangokuchanekileyo, kwaye amaxabiso e-CPK anokuhlalutywa.
Umatshini wokulawula ukumelana okwi-intanethi: ukumelana nokulawula uvavanyo lwe-TCT Iindlela eziqhelekileyo zokusilela, ukuqonda izinto ezinokubangela umonakalo kwizixhobo zenkqubo kunye nezinto eziyinxalenye ukuqinisekisa ukuba imveliso iyilwe okanye yenziwe ngokuchanekileyo na
ibhokisi yokothuka ebandayo neyobushushu: uvavanyo lokothuka ebandayo neyobushushu, ubushushu obuphezulu nobuphantsi
igumbi lobushushu kunye nokufuma rhoqo: Uvavanyo lokumelana nokugqwala kwe-electrochemical kunye nokumelana nokugquma komphezulu
imbiza yesolder: uvavanyo lokunyibilikisa
Uvavanyo lweRoHS: RoHS
umvavanyi we-impedance: amaxabiso e-AC impedance kunye nokulahleka kwamandla
izixhobo zovavanyo zombane: Vavanya ukuqhubeka kwesekethe yemveliso
Umatshini wenaliti ebhabhayo: Uvavanyo lokuqhuba uvavanyo oluphezulu lwe-voltage kunye novavanyo oluphantsi lokuqhuba
Umatshini wokuhlola imingxunya ozenzekelayo ngokupheleleyo: Jonga iintlobo ezahlukeneyo zemingxunya engaqhelekanga, kubandakanya imingxunya engqukuva, imingxunya emifutshane yesloti, imingxunya emide yesloti, imingxunya emikhulu engaqhelekanga, imingxunya eneembobo, imingxunya embalwa, imingxunya emikhulu nemincinci, kunye nemisebenzi yokuhlola iplagi yemingxunya
I-AOI：I-AOI ihlola ngokuzenzekelayo iimveliso ze-PCBA ngeekhamera ze-CCD ezikumgangatho ophezulu, iqokelele imifanekiso, ithelekise amanqaku ovavanyo kunye neeparameter ezifanelekileyo kwisiseko sedatha, kwaye emva kokucutshungulwa komfanekiso, ijonga iziphene ezincinci ezinokungajongwa kwi-PCB ekujoliswe kuyo. Akukho ndlela yokubaleka kwiziphene zesekethe.
Isicelo (jonga umfanekiso oqhotyoshelweyo ngeenkcukacha)
Ii-PCB ze-HDI zisetyenziswa kwiindawo ezahlukeneyo ezifana neefowuni eziphathwayo, iikhamera zedijithali, ii-AI, ii-IC carriers, izixhobo zonyango, ulawulo lwemizi-mveliso, iilaptops, ii-elektroniki zeemoto, iirobhothi, iidrone, njl.njl.
Isicelo
Ii-PCB ze-HDI zisetyenziswa kwiindawo ezahlukeneyo ezifana neefowuni eziphathwayo, iikhamera zedijithali, ii-AI, ii-IC carriers, izixhobo zonyango, ulawulo lwemizi-mveliso, iilaptops, ii-elektroniki zeemoto, iirobhothi, iidrone, njl.njl.