Ibhodi eFlexible
Itekhnoloji ePhambili esebenza kakuhle kunye nesisombululo esigqibeleleyo.
Iingenelo zeBhodi eQondisiweyo neFlex
Kule mihla, uyilo luqhubeka lulandela ukwenziwa kwezinto ezincinci, iindleko eziphantsi kunye nesantya esiphezulu semveliso, ngakumbi kwimarike yezixhobo eziphathwayo, edla ngokubandakanya iisekethe ze-elektroniki ezinoxinano oluphezulu. Ukusebenzisa iiBhodi eziRigid-Flex kuya kuba lukhetho oluhle kakhulu kwizixhobo ezidityaniswe nge-IO. Iingenelo ezisixhenxe eziphambili eziziswa ziimfuno zoyilo zokudibanisa izixhobo zebhodi eziguquguqukayo kunye nezixhobo zebhodi eqinileyo kwinkqubo yokuvelisa, ukudibanisa izixhobo ezi-2 ze-substrate kunye ne-prepreg, kwaye emva koko ukufikelela kuqhagamshelo lombane oluphakathi kwee-conductors ngemingxunya edlulayo okanye ii-vias ezingaboniyo/ezingcwatywe ziindlela ezingezantsi:
Indibano ye-3D yokunciphisa iisekethe
Ukuthembeka okungcono koqhagamshelo
Nciphisa inani leenxalenye kunye neenxalenye
Ukuhambelana okungcono kwe-impedance
Ngaba unokuyila isakhiwo sokudibanisa esintsonkothileyo kakhulu
Sebenzisa uyilo lwenkangeleko olulula ngakumbi
Yehlisa ubungakanani
I-rigid-flex yibhodi edibanisa ubulukhuni kunye nokuguquguquka, icubungula zombini ubulukhuni bebhodi eqinileyo kunye nokuguquguquka kwebhodi eguquguqukayo.
I-Semi-FPC
Imephu yeNdlela yoBuchule
| Into | I-Flex - Iqinile | IRegal | I-Semi-Flex |
| Umfanekiso |  |  |  |
| Izinto eziguquguqukayo | I-Polyimide | FR4 + I-Coverlay (i-Polyimide) | FR4 |
| Ubukhulu obuguquguqukayo | 0.025~0.1mm (Akukho ubhedu) | 0.05~0.1mm (Akukho bhedu) | Ubukhulu Obusele: 0.25+/‐0.05mm (Izinto Ezinikezelweyo: EM825(I)) |
| I-engile yokugoba | Ubuninzi be-180° | Ubuninzi be-180° | Ubuninzi obuyi-180°(Umaleko oguquguqukayo≤2) Ubuninzi obuyi-90°(Umaleko oguquguqukayo>2) |
| Ukunyamezela Okuguquguqukayo; IPC‐TM‐650, Indlela 2.4.3. | OKO | ||
| Uvavanyo lokugoba; 1) Ububanzi beMandrel: 6.25mm | |||
| Isicelo | I-Flex yokufaka kunye ne-Dynamic (Icala elinye) | I-Flex yokuyifaka | I-Flex yokuyifaka |
| Umphezulu wokugqiba | Ixabiso eliqhelekileyo | Umthengisi | |
| ISebe loMlilo lamavolontiya |  | 0.2~0.6um;0.2~0.35um | Ikhemikhali ye-Enthone Shikoku |
| VUMELANA |  | Okanye: 0.03~0.12um, Ngaba: 2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENIG ekhethiweyo |  | Okanye: 0.03~0.12um, Ngaba: 2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENEPIC |  | I-Au: 0.05~0.125um, i-Pd: 0.05~0.125um, i-Ni:5~10um | Chuang Zhi |
| Igolide Eqinileyo |  | I-Au:0.2~1.5um, iNi: ubuncinci be-2.5um | Umhlawuli |
| Igolide ethambileyo |  | I-Au:0.15~0.5um, i-Ni:min 2.5um | IINTLANZI |
| Itini yokuntywiliselwa |  | Ubuncinci: 1um | Itekhnoloji ye-Enthone / ATO |
| Isilivere yokuntywiliselwa |  | 0.15~0.45um | IMacdermid |
| I-HASL (OS) engenalo i-lead kunye ne-HASL (OS) |  | 1 ~ 25um | Nihon Superior |
Uhlobo lwe-Au/Ni
● I-Gold plating inokwahlulwa ibe yigolide ebhityileyo kunye negolide etyebileyo ngokwesixa. Ngokubanzi, igolide engaphantsi kwe-4u”(0.41um) ibizwa ngokuba yigolide ebhityileyo, ngelixa igolide engaphezulu kwe-4u” ibizwa ngokuba yigolide etyebileyo. I-ENIG inokwenza kuphela igolide ebhityileyo, hayi igolide etyebileyo. I-Gold plating kuphela enokwenza zombini igolide ebhityileyo netyebileyo. Ubukhulu obukhulu begolide etyebileyo kwibhodi eguquguqukayo bunokuba ngaphezu kwe-40u”. Igolide etyebileyo isetyenziswa kakhulu kwiindawo zokusebenza ezineemfuno zokubopha okanye zokumelana nokuguguleka.
● I-plating yegolide inokwahlulwa ibe yigolide ethambileyo kunye negolide eqinileyo ngokohlobo lwayo. Igolide ethambileyo yigolide eqhelekileyo ecocekileyo, ngelixa igolide eqinileyo iqulethe i-cobalt. Kungenxa yokuba i-cobalt yongezwa ukuba ubunzima bomaleko wegolide buyanda kakhulu budlula i-150HV ukuhlangabezana neemfuno zokumelana nokuguguleka.
| Uhlobo lwezinto | Iipropati | Umthengisi | |
| Izinto eziqinileyo | Ukulahleka Okuqhelekileyo | DK>4.2, DF>0.02 | I-NanYa / EMC / TUC / ITEQ / ShengYi / Isola / Doosan njl. |
| Ilahleko Ephakathi | DK>4.1, DF:0.015~0.02 | I-NanYa / EMC / TUC / ITEQ njl. | |
| Ukulahleka okuphantsi | I-DK:3.8~4.1, DF:0.008~0.015 | EMC / NanYa / TUC / Isola / Panasonic njl. | |
| Ilahleko ephantsi kakhulu | I-DK:3.0~3.8, DF:0.004~0.008 | EMC / Panasonic / Rogers / TUC / Isola / ITEQ / NanYa njl. | |
| Ukulahleka Okuphantsi Kakhulu | DK | Rogers / TUC / ITEQ / Panasonic / Isola njl. | |
| BT | Umbala: Mhlophe / Mnyama | MGC / Hitachi / NanYa / ShengYi njl. | |
| Ifoyile yeCopper | Umgangatho | Uburhabaxa(RZ)=6.34um | UNanYa, KB, LCY |
| I-RTF | Uburhabaxa(RZ)=3.08um | UNanYa, KB, LCY | |
| I-VLP | Uburhabaxa(RZ)=2.11um | I-MITSUI, iFoyile yeSekethe | |
| I-HVLP | Uburhabaxa(RZ)=1.74um | I-MITSUI, iFoyile yeSekethe | |
| Uhlobo lwezinto | I-DK/DF eqhelekileyo | I-DK/DF ephantsi | |||
| Iipropati | Umthengisi | Iipropati | Umthengisi | ||
| Izinto eziguquguqukayo | I-FCCL (ene-ED kunye ne-RA) | I-Polyimide eqhelekileyo DK:3.0~3.3 DF:0.006~0.009 | I-Thinflex / iPanasonic / iTaiflex | I-DK yePolyimide eguquliweyo: 2.8~3.0 DF: 0.003~0.007 | I-Thinflex / iTaiflex |
| Ingubo egqunyiweyo (emnyama/etyheli) | I-Adhesive eqhelekileyo DK:3.3~3.6 Df:0.01~0.018 | Taiflex / Dupont | I-Adhesive eguquliweyo DK:2.8~3.0 DF:0.003~0.006 | I-Taiflex / i-Arisawa | |
| Ifilimu yeBond (Ubukhulu: 15/25/40 um) | I-Epoxy DK eqhelekileyo: 3.6~4.0 DF: 0.06 | Taiflex / Dupont | I-Epoxy eguquliweyo DK:2.4~2.8 DF:0.003~0.005 | I-Taiflex / i-Arisawa | |
| I-inki ye-S/M | Imaski yeSolder; Umbala: Luhlaza / Luhlaza okwesibhakabhaka / Mnyama / Mhlophe / Mthubi / Mbovu | I-Epoxy eqhelekileyo DK:4.1 DF:0.031 | I-Taiyo / OTC / AMC | I-Epoxy eguquliweyo DK:3.2 DF:0.014 | I-Taiyo |
| I-inki yentsomi | Umbala wesikrini: Mnyama / Mhlophe / Mthubi Inkjet Umbala: Mhlophe | I-AMC | |||
| Ezinye izixhobo | I-IMS | Ii-substrates zeMetallic ezifakwe i-insulation (ezine-Al okanye i-Cu) | I-EMC / Ventec | ||
| Ukuqhuba okuphezulu kobushushu | 1.0 / 1.6 / 2.2 (W/M*K) | I-ShengYi / Ventec | |||
| Mna | Ifoyile yesilivere (SF‐PC6000‐U1 / SF‐PC8600‐C) | Tatsuta | |||
Izinto zeSpeed ePhezulu kunye neFrequency ephezulu (eziguquguqukayo)
| DK | Df | Uhlobo lwezinto | |
| I-FCCL (iPolyimide) | 3.0~3.3 | 0.006~0.009 | Uthotho lwePanasonic R‐775; uthotho lweThinflex A; uthotho lweThinflex W; uthotho lweTaiflex 2up |
| I-FCCL (iPolyimide) | 2.8~3.0 | 0.003~0.007 | Uthotho lweThinflex LK; uthotho lweTaiflex 2FPK |
| I-FCCL (LCP) | 2.8~3.0 | 0.002 | Uthotho lweThinflex LC; uthotho lwePanasonic R‐705T se; uthotho lweTaiflex 2CPK |
| Isigqubuthelo | 3.3~3.6 | 0.01~0.018 | Uthotho lweDupont FR; uthotho lweTaiflex FGA; uthotho lweTaiflex FHB; uthotho lweTaiflex FHK |
| Isigqubuthelo | 2.8~3.0 | 0.003~0.006 | Uthotho lwe-Arisawa C23; uthotho lwe-Taiflex FXU |
| Iphepha Lokubopha | 3.6~4.0 | 0.06 | Uthotho lweTaiflex BT; uthotho lweDupont FR |
| Iphepha Lokubopha | 2.4~2.8 | 0.003~0.005 | Uthotho lwe-Arisawa A23F; uthotho lwe-Taiflex BHF |
Itekhnoloji yokuDrila iBack
● Ii-microstrip traces akufanele zibe nee-vias, kufuneka zihlolwe kwicala le-trace.
● Umkhondo kwicala lesibini kufuneka uhlolwe ukusuka kwicala lesibini (Icala lokuqalisa kufuneka libe kwelo cala).
● Uyilo oluhle kukuba imikhondo yemigca kufuneka ihlolwe nakweyiphi na icala enciphisa kakhulu i-via stub.
● Iziphumo ezilungileyo ze-stripline ziya kufumaneka ngokusebenzisa ii-vias ezimfutshane ezifakwe i-backdrilled.
Isicelo seMveliso: Inzwa yeradar yezithuthi
Iinkcukacha zeMveliso:
I-PCB enamaleko ama-4 enezinto ezixutyiweyo (iHydrocarbon + i-Standard FR4)
Ukudibanisa: 4L HDI / Ayilingani
Umngeni:
Izinto ezisetyenziswa rhoqo nge-Standard FR4 Lamination
Ulawulo lobunzulu bokubhola
Isicelo seMveliso: Inzwa yeradar yezithuthi
Iinkcukacha zeMveliso:
I-PCB enamaleko ama-4 enezinto ezixutyiweyo (iHydrocarbon + i-Standard FR4)
Ukudibanisa: 4L HDI / Ayilingani
Umngeni:
Izinto ezisetyenziswa rhoqo nge-Standard FR4 Lamination
Ulawulo lobunzulu bokubhola
Isicelo seMveliso:
Isikhululo sesiseko
Iinkcukacha zeMveliso:
Iileya ezingama-30 (Izinto ezifanayo)
Ukuxhoma: Inani eliphezulu leeleya / Ukulingana
Umngeni:
Ubhaliso lweeleya nganye
Umlinganiselo ophezulu we-PTH
Ipharamitha ye-lamination ebalulekileyo
Isicelo seMveliso:
Inkumbulo
Iinkcukacha zeMveliso:
Ukuxhoma: Iileya ezili-16 Anylayer
Uvavanyo lwe-IST: Imeko: 25‐190℃ Ixesha: 3 min, 190‐25℃ Ixesha: 2 min, 1500 Cycles. Izinga lokutshintsha kokumelana≤10%, Indlela yovavanyo: IPC‐TM650‐2.6.26. Isiphumo: Ukuphumelela.
Umngeni:
Ukulaminetha ngaphezulu kwezihlandlo ezi-6
Ukuchaneka kwe-laser vias
Isicelo seMveliso:
Inkumbulo
Iinkcukacha zeMveliso:
Beka phezulu: Umqolomba
Izinto eziphathekayo: I-FR4 esemgangathweni
Umngeni:
Ukusebenzisa itekhnoloji ye-De‐cap kwi-Rigid PCB
Ubhaliso phakathi kweengqimba
Ukuxinana okuncinci kwindawo yesitephu
Inkqubo ebalulekileyo yokuhombisa i-G/F
Isicelo seMveliso:
Imodyuli yeKhamera / Incwadi yamanqaku
Iinkcukacha zeMveliso:
Beka phezulu: Umqolomba
Izinto eziphathekayo: I-FR4 esemgangathweni
Umngeni:
Ukusebenzisa itekhnoloji ye-De‐cap kwi-Rigid PCB
Inkqubo yelaser ebalulekileyo kunye neeparameters kwinkqubo yeDe-cap
Isicelo seMveliso:
Izibane zeemoto
Iinkcukacha zeMveliso:
Ingqokelela: IMS / Heatsink
Izinto eziphathekayo: Isinyithi + Iglue/Ukulungiselela kwangaphambili + iPCB
Umngeni:
Isiseko se-aluminiyam kunye nesiseko sobhedu (umaleko omnye)
Ukuqhuba kobushushu
Iglue ye-FR4+/Prepreg + Al lamination
Iingenelo:
Ukutshatyalaliswa kobushushu obukhulu
Iinkcukacha zeMveliso:
Izinto ezikhawulezayo (ezifanayo)
Ingqokelela: Ingqekembe yobhedu efakiweyo / i-Symmetric
Umngeni:
Ukuchaneka kobukhulu bengqekembe
Ukuchaneka kokuvulwa kwe-lamination
Ukuhamba kwe-resin ebalulekileyo
Isicelo seMveliso:
Isitishi seeMoto / zeMizi-mveliso / sesiseko
Iinkcukacha zeMveliso:
Isiseko sobhedu sangaphakathi esingu-6OZ
Isiseko sobhedu esingaphandle esingu-3OZ/6OZ Isingxobo:
Ubunzima bobhedu obuyi-6OZ kumaleko wangaphakathi
Umngeni:
Isithuba sobhedu esingu-6OZ sizaliswe ngokupheleleyo yi-epoxy
Akukho ukushukuma ekucutshungulweni kwe-lamination
Isicelo seMveliso:
Ifowuni ehlakaniphileyo / Ikhadi le-SD / i-SSD
Iinkcukacha zeMveliso:
Ukuxhonywa: HDI / Anylayer
Izinto eziphathekayo: I-FR4 esemgangathweni
Umngeni:
Iprofayili ephantsi kakhulu/i-RTF Cu foil
Ukufana kwesingxobo
Ifilimu eyomileyo enesisombululo esiphezulu
Ukuvezwa kwe-LDI (Umfanekiso othe ngqo weLaser)
Isicelo seMveliso:
Unxibelelwano / Ikhadi le-SD / Imodyuli yokukhanya
Iinkcukacha zeMveliso:
Ukuxhonywa: HDI / Anylayer
Izinto eziphathekayo: I-FR4 esemgangathweni
Umngeni:
Akukho msantsa kumphetho womnwe xa i-PCB ikwinkqubo yegolide yokupeyinta
Ifilimu ekhethekileyo enganyangekiyo
Isicelo seMveliso:
Imizi-mveliso
Iinkcukacha zeMveliso:
Ukuxhoma: I-Rigid-Flex
Ndikunye ne-Eccobond kwi-Rigid-Flex transformation
Umngeni:
Isantya esibalulekileyo sokuhamba kunye nobunzulu bomngxuma
Ipharamitha yoxinzelelo lomoya olubalulekileyo