Ukwenziwa kwePCB kunye nePCBA
Iworkshop
Hlola izixhobo zethu zokuvelisa ezikumgangatho ophezulu kunye neenkqubo zethu zemveliso eziphambili
Uluhlu lweZixhobo zoMveliso zePCB
Izixhobo zokuvelisa ezichanekileyo kakhulu ezingaphezu kwama-200, kuquka oomatshini bokugrumba abangama-50 abane-axis ezintandathu, oomatshini bokugrumba nge-laser abali-10, kunye noomatshini be-AOI abangama-20, ababonelela ngomgca wemveliso ozenzekelayo ngokupheleleyo.
I/L — Umzobo weLayer yangaphakathi kunye ne-AOI
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| Ukucoca kwangaphambili (inki) | I-Orbotech, Schmid | 3 | Coca iiphaneli zangaphakathi ngaphambi kokuba ugqume |
| I-Roller Coater (Ethe nkqo) | Schmid, KCE | 2 | Ukwaleka okuthe nkqo kwe-photoresist |
| I-Roller Coater (Ethe tyaba) | Schmid, KCE | 1 | Ukwaleka okuthe tye/ukulamina kwe-photoresist |
| I-DES (Uphuhliso/Ukukrola/Ukuqhekeza) | Atotech, Manz, HOYA, YangBo (TW) | 3 | Uphuhliso lwemaleko yangaphakathi–ukuqhekeza–umcu |
| Ukuvezwa Okuzenzakalelayo (inki) | I-Orbotech, i-Maskless Lithography, i-SCREEN | 5 | Ukuvezwa ngokuzenzekelayo kweengqimba zangaphakathi |
| Ukuvezwa ngesandla | Colight, OLEC | 1 | Ukuchaneka ngesandla kwiindawo ezincinci/iiprototypes |
| Ukufunyanwa kwe-I/L AOI | I-Orbotech | 6 | Ukufunyanwa kweziphene ze-AOI ezikwimaleko yangaphakathi |
| Isitishi sokuLungisa i-V-Smart | I-Orbotech | 5 | Ukuqinisekiswa/ukulungiswa ngokutsha kweziphene ze-AOI ngesandla |
| I/L AOI Spiron | I-Orbotech | 3 | Uphononongo lwe-AOI yangaphakathi edibeneyo + |
| I/L AOI Inspire | I-Orbotech | 1 | I-AOI yangaphakathi echanekileyo kakhulu |
| I-OPE (Inner-layer Punch) | LPKF, Schmoll, Mitsubishi | 2 | Izixhobo/ukubhoboza ubhaliso lwe-lamination |
Cinezela — I-Lamination kunye ne-Oxide emdaka
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| I-okside emdaka yeBondfilm ethe tye | ChuangKe, DengTai | 2 | Ukurhawuzelela umphezulu ngaphambi kokulamina |
| I-Press yesiqhelo (2 Ishushu + 1 Ibanda) | HuoQuan | 2 | I-Lamination |
| I-Electronical Press (ADARA 48 / 73) | I-CEDATE (e-Itali) | 4 | Ukugquma ngokuchanekileyo |
| I-RBM Thermal Fusion (i-Hot-Melt) | HuoQuan; MuNuo | 4+2, 12 | Uncedo lokuhamba kweresin |
| Ukubeka ngokuzenzekelayo/ngesandla (iStacker) | I-CEDATE (e-Itali) | 4 | Ukubeka i-lamination |
| Umsiki we-PP Auto | ZhengYe | 4 | Ukusika kwangaphambili kwe-PP |
| Ukubhola ngeX-reyi (Ukusebenzisa Izixhobo) | iDeLiFu; HaoShuo | 4 | Ubhaliso kunye nokubhola ngenjongo |
| Uhlolo lwe-X-reyi | I-Aisida | 2 | Ukuqinisekiswa kobhaliso emva kokushicilelwa |
I-RF — I-Rigid-Flex Lamination kunye ne-Flex Core
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| I-Regal-Flex Press | — | 10 | I-lamination egobile neqinileyo |
| I-PLASMA (yeRegal-Flex) | — | 2 | Ukusebenza komphezulu ukuze kunamathele kwi-flex |
| Isicoci sePlate yeNsimbi | — | 2 | Iipleyiti ze-lamination ezicocekileyo |
| Ukusika i-UV Laser | — | 2 | Ukusika okugobileyo/okugqumayo |
| Umsiki weFlex-Core | — | 2 | Ukusika okugobileyo okuphakathi |
| I-oven ethe nkqo | — | 2 | Ukubhaka/ukunyanga okuguquguqukayo |
| I-Thin-Core Laminator | — | 2 | I-lamination yefilimu eyomileyo engaphakathi |
Ukubhola — Oomatshini kunye neLaser
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| I-Laser Drill (5Z00U / ML605GTW5) | IMitsubishi | 20 | Ukubhola nge-laser ye-Microvia |
| Iidrill zeMechanical ezine-spindle ezintandathu | eHitachi; LongZe; i-DongTai; DaLiang | Ngaphezulu kwe-150 | Ukubhola ngesantya esiphezulu |
| Iidrill zeMechanical ezine-spindle ezimbini | XueLong; HuaJian; DaLiang | 8 | Iprototype kunye nokugrumba kwindawo encinci |
| Iskena sendawo yomngxuma (CPK) | I-MACHVISION | 2 | Ukuhlolwa kobhaliso lwe-drill |
| Isitshizi/Isipolishi Somphezulu Esizenzekelayo | I-ChengZhong (CDZ550) | 12 | Ukulungiswa kokususa inkunkuma kunye nokulungiswa komphezulu |
Indlela
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| Umatshini Wokuhambisa Indlela | YOWSUN | 12 | Ukuhambisa iprofayili |
| Umatshini wokubeka iBheveli | — | 4 | Ukuhombisa umphetho |
| Umatshini Wokubetha | — | 6 | Ukususwa kweepaneli |
Uvavanyo loMbane (ET)
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| Umvavanyi wePribe yokubhabha | I-ATG | 6 | Uvavanyo lokuqhubeka kombane kunye nolwahlulo |
| Isivavanyeli seBhedi yezipikili | — | 10 | Uvavanyo lwemveliso enkulu |
Uhlolo Lokugqibela Lokubona (FV)
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| Izikhululo zokuhlola ezibonakalayo | Ngaphakathi endlwini | 40 | Imveliso yokugqibela ye-QC |
| Izikhulisi | — | 20 | Ukuhlolwa kweempawu ezintle |
Igumbi leFilimu
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| Ifoto yeLaser | I-Orbotech | 2 | Imveliso yefilimu |
| Ikhabhinethi yokugcina iifilimu | — | 5 | Ukuphathwa kwefilimu ngokukhuselekileyo |
I-FPC (i-Flexible PCB)
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| I-Coverlay Laminator | Hitachi | 3 | I-lamination ye-FPC coverlay |
| Umatshini wokusika we-PI | — | 2 | Ukusika i-polyimide |
| I-Laser Drill ye-FPC | — | 2 | Ukugrumba nge-microvia ukuze ujike |
QA (Uqinisekiso loMgangatho / iLebhu)
| Igama lesiNgesi | Abathengisi | Ubungakanani | Injongo |
|---|---|---|---|
| Iinkqubo zokulinganisa ze-2D/3D | I-OPTEK; ZhengYe | 1 (2D), 1 (umfanekiso ozenzekelayo) | Uvavanyo lobukhulu |
| Isivavanyeli sokungathinteli (CITS800S2) | I-Polar | 1 | Umlinganiselo wokunganyamezelani |
| Ubukhulu beX-reyi yokugquma | ZhengYe | 1 | Ubukhulu besingxobo |
| Isivavanyeli sokuNgcoliswa kwe-Ion | ZhengYe | 1 | Uvavanyo lokucoceka (ionic) |
| Igumbi lokutshiza ityuwa | — | 1 | Uvavanyo lokumelana nokugqwala |
| Igumbi loThuthuzo olushushu | — | 1 | Ukuthembeka (umothuko wobushushu) |
| I-Microscope yeMetallographic | I-Olympus | 1 | Uhlalutyo olunqamlezileyo |