Ukugqitywa komphezulu wePCB
| Umphezulu wokugqiba | Ixabiso eliqhelekileyo | Umthengisi |
| ISebe loMlilo lamavolontiya | 0.3~0.55µm, 0.25~0.35µm | I-Enthone |
| Shikoku Chemical | ||
| VUMELANA | Okanye: 0.03~0.12um, Ni: 2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENIG ekhethiweyo | Okanye: 0.03~0.12um, Ni: 2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENEPIC | I-Au: 0.05~0.125µm, i-Pd: 0.05~0.3µm | Chuang Zhi |
| Kwi: 3 ~ 10um | ||
| Igolide Eqinileyo | Au : 0.127~1.5um , Ni : min 2.5um | Umhlawuli/EEJA |
| Igolide ethambileyo | Au : 0.127~0.5um , Ni : min 2.5um | IINTLANZI |
| Itini yokuntywiliselwa | Ubuncinci: 1um | Itekhnoloji ye-Enthone / ATO |
| Isilivere yokuntywiliselwa | 0.127~0.45um | IMacdermid |
| I-HASL engenalo i-lead | 1 ~ 25um | Nihon Superior |
Ngenxa yokuba ubhedu lukhona ngendlela yee-oxides emoyeni, luchaphazela kakhulu ukunyibilika kunye nokusebenza kombane kwee-PCB. Ke ngoko, kuyimfuneko ukwenza ukugqitywa komphezulu wee-PCB. Ukuba umphezulu wee-PCB awugqitywanga, kulula ukubangela iingxaki zokunyibilika ezibonakalayo, kwaye kwiimeko ezinzima, ii-solder pads kunye nezinto azinakuhlanganiswa. Ukugqitywa komphezulu we-PCB kubhekisa kwinkqubo yokwenza umaleko womphezulu kwi-PCB. Injongo yokugqitywa kwe-PCB kukuqinisekisa ukuba i-PCB inokuguquguquka okuhle okanye ukusebenza kombane. Kukho iintlobo ezininzi zokugqitywa komphezulu wee-PCB.
Ukulinganisa i-Hot Air Solder (HASL)
Yinkqubo yokufaka i-solder yentsimbi enyibilikisiweyo phezu komphezulu we-PCB, ukuyithambisa (ukuyivuthela) ngomoya ocinezelweyo oshushu kwaye yenze umaleko wengubo omelana ne-oxidation yobhedu kwaye ubonelela ngokutyibilika okuhle. Ngexesha lale nkqubo, kuyimfuneko ukuba ube nobuchule kwezi parameter zilandelayo zibalulekileyo: ubushushu bokutyibilika, ubushushu bomoya oshushu, uxinzelelo lomoya oshushu, ixesha lokuntywiliselwa, isantya sokuphakamisa, njl.njl.
Inzuzo ye-HASL
1. Ixesha elide lokugcina.
2. Ukumanzisa kakuhle kwephedi kunye nokufakwa kobhedu.
3. Uhlobo olusetyenziswa kakhulu olungenalo ilothe (oluhambelana neRoHS).
4. Iteknoloji evuthiweyo, ixabiso eliphantsi.
5. Ifanelekile kakhulu ekuhlolweni okubonakalayo kunye novavanyo lombane.
Ubuthathaka be-HASL
1. Ayifanelekanga ukubopha ucingo.
2. Ngenxa ye-meniscus yendalo ye-solder enyibilikisiweyo, i-flatness ayilunganga.
3. Ayisebenzi kwiiswitshi zokuchukumisa ezisebenza nge-capacitive.
4. Kwiiphaneli ezincinci kakhulu, i-HASL isenokungafaneleki. Ubushushu obuphezulu bebhafu bunokubangela ukuba ibhodi yesekethe igobe.
2. ISebe loMlilo lamavolontiya
I-OSP sisifinyezo se-Organic Solderability Preservative, esaziwa ngokuba yi-per solder. Ngamafutshane, i-OSP yileyo ifafazwa phezu kwee-copper solder pads ukuze inike ifilimu ekhuselayo eyenziwe ngeekhemikhali ze-organic. Le filimu kufuneka ibe neepropati ezinje ngokuxhathisa i-oxidation, ukumelana nokutsha kwe-thermal shock kunye nokuxhathisa ukufuma ukukhusela umphezulu we-copper ekubeni ugqwale (i-oxidation okanye i-vulcanization, njl.njl.) kwiindawo eziqhelekileyo. Nangona kunjalo, kwi-soldering elandelayo yobushushu obuphezulu, le filimu ekhuselayo kufuneka isuswe ngokulula yi-flux ngokukhawuleza, ukuze umphezulu we-copper ococekileyo ovezweyo ukwazi ukudibana ngoko nangoko ne-solder enyibilikisiweyo ukuze kwenziwe i-solder joint enamandla ngexesha elifutshane kakhulu. Ngamanye amazwi, indima ye-OSP kukusebenza njengomqobo phakathi kobhedu nomoya.
Inzuzo ye-OSP
1. Kulula kwaye kuyafikeleleka; Ukugqitywa komphezulu kukutshiza kuphela.
2. Umphezulu wephedi yesolder uthambile kakhulu, kwaye uthambile ngokufana ne-ENIG.
3. Ayinalo ilothe (ihambelana nemigangatho yeRoHS) kwaye inobuhlobo nokusingqongileyo.
4. Ingaphinda isetyenziswe.
Ubuthathaka be-OSP
1. Ukungamanzi kakuhle.
2. Indlela ecacileyo nencinci ngayo ifilimu ithetha ukuba kunzima ukulinganisa umgangatho ngokujonga ngamehlo nokwenza uvavanyo kwi-intanethi.
3. Ubomi benkonzo obufutshane, iimfuno eziphezulu zokugcina nokuphatha.
4. Ukhuseleko olubi kwimingxuma efakwe ipleyiti.
Isilivere yokuntywiliselwa
Isilivere ineempawu zeekhemikhali ezizinzileyo. I-PCB ecutshungulwa bubuchwepheshe bokuntywiliselwa kwesilivere isenokubonelela ngokusebenza kakuhle kombane nokuba ibekwe kwindawo enobushushu obuphezulu, enomswakama kwaye ingcolisekileyo, kwaye igcine ukunyibilika kakuhle nokuba inokulahlekelwa bukukhanya kwayo. I-Immersion Silver yindlela yokusabela apho umaleko wesilivere ecocekileyo ubekwa ngqo kwi-copper. Ngamanye amaxesha, isilivere yokuntywiliselwa idityaniswa neengubo ze-OSP ukuthintela isilivere ukuba ingasabelani ne-sulfides kwindawo.
Inzuzo yeSilivere yokuntywiliselwa
1. Ukunyibilika okuphezulu.
2. Umphezulu othe tyaba kakuhle.
3. Ixabiso eliphantsi kwaye ayinalo ilothe (ihambelana nemigangatho yeRoHS).
4. Isebenza kwi-Al wire bonding.
Ubuthathaka beSilivere yokuntywiliselwa
1. Iimfuneko zokugcina izinto ziphezulu kwaye kulula ukuzingcolisa.
2. Ixesha elifutshane lokuhlanganisa emva kokukhupha kwiphakheji.
3. Kunzima ukwenza uvavanyo lombane.
Itini yokuntywiliselwa
Ekubeni yonke into enyibilikiswayo isekelwe kwi-tin, umaleko we-tin ungalingana naluphi na uhlobo lwe-solder. Emva kokongeza izongezo eziphilayo kwisisombululo sokuntywiliselwa kwe-tin, isakhiwo somaleko we-tin sibonisa isakhiwo esingqukuva, soyisa iingxaki ezibangelwa ziindevu ze-tin kunye nokufuduka kwe-tin, ngelixa sinozinzo oluhle lobushushu kunye nokunyibilikiswa kwe-solder.
Inkqubo ye-Immersion Tin inokwenza i-flat copper tin intermetallic compounds ukuze i-immersion tin ibe ne-soldering elungileyo ngaphandle kweengxaki zokusila okanye ukusasazeka kwe-intermetallic compound.
Inzuzo ye-Immersion Tin
1. Isebenza kwimigca yemveliso ethe tye.
2. Isebenza ekucutshungulweni kweengcingo ezincinci kunye nokutywinwa okungenalo ilothe, ngakumbi kwinkqubo yokuqhekeka.
3. Ukuthamba kuhle kakhulu, kusebenza kwi-SMT.
Ubuthathaka beTin yokuntywiliselwa
1. Imfuneko ephezulu yokugcina, inokubangela ukuba iminwe itshintshe umbala.
2. Iindevu zetin zinokubangela ii-short circuits kunye neengxaki ze-solder joint, ngaloo ndlela zinciphise ixesha lokuphelelwa.
3. Kunzima ukwenza uvavanyo lombane.
4. Le nkqubo ibandakanya izinto ezibangela umhlaza.
VUMELANA
I-ENIG (i-Electroless Nickel Immersion Gold) yindlela esetyenziswa kakhulu yokugqiba umphezulu eyenziwe ziingqimba ezimbini zesinyithi, apho i-nickel ifakwa ngqo kwi-copper kwaye emva koko ii-athomu zegolide zifakwe kwi-copper ngokusebenzisa ii-displacement reactions. Ubukhulu bengqimba yangaphakathi ye-nickel ngokubanzi yi-3-6um, kwaye ubukhulu bengqimba yangaphandle yegolide ngokubanzi yi-0.05-0.1um. I-nickel yenza umaleko othintelayo phakathi kwe-solder kunye ne-copper. Umsebenzi wegolide kukuthintela i-nickel oxidation ngexesha lokugcinwa, ngaloo ndlela yandisa ubomi beshelufu, kodwa inkqubo yegolide yokuntywiliselwa inokuvelisa ubucaba bomphezulu obuhle kakhulu.
Indlela yokucubungula i-ENIG yile: ukucoca-->ukukrola-->isihluzo-->ukucoca i-nickel yekhemikhali-->ukubekwa kwegolide-->ukucoca intsalela
Iingenelo ze-ENIG
1. Ifanelekile ukunyibilikisa i-solder engenalo i-lead (ehambelana ne-RoHS).
2. Ubuso obuthambileyo obugqwesileyo.
3. Ixesha elide lokugcinwa kunye nomphezulu ohlala ixesha elide.
4. Ifanelekile kwi-Al wire bonding.
Ubuthathaka be-ENIG
1. Ibiza kakhulu ngenxa yokusebenzisa igolide.
2. Inkqubo enzima, kunzima ukuyilawula.
3. Kulula ukuvelisa i-black pad phenomenon.
I-Electrolytic Nickel/Gold (igolide eqinileyo/igolide ethambileyo)
Igolide ye-nickel ye-electrolytic yahlulwe yaba yi-"hard gold" kunye ne-"soft gold". Igolide eqinileyo ayinabumsulwa kwaye isetyenziswa kakhulu kwiminwe yegolide (izihlanganisi ze-PCB edge), ii-PCB contacts okanye ezinye iindawo ezingagugiyo. Ubukhulu begolide bunokwahluka ngokweemfuno. Igolide ethambileyo inobumsulwa obuphezulu kwaye isetyenziswa kakhulu kwi-wire bonding.
Inzuzo ye-Electrolytic Nickel/Gold
1. Ixesha elide lokugcinwa.
2. Ifanelekile kwiswitshi yoqhagamshelwano kunye nokubophelela ucingo.
3. Igolide eqinileyo ifanelekile kuvavanyo lombane.
4. Ayinalo ilothe (ithobela iRoHS)
Ubuthathaka be-Electrolytic Nickel/Gold
1. Eyona nto ibiza kakhulu xa usenza umphezulu.
2. Iminwe yegolide efakelwa ngombane ifuna iingcingo ezongezelelweyo eziqhubayo.
3. Igolide eyosiweyo ayinakutyibilika kakuhle. Ngenxa yobukhulu begolide, kulula kakhulu ukuyityibiliza.
I-ENEPIC
Igolide yokuntywiliselwa kweNickel engenama-Electroless Palladium okanye i-ENEPIG isetyenziswa ngakumbi ekugqityweni komphezulu wePCB. Xa kuthelekiswa ne-ENIG, i-ENEPIG yongeza umaleko owongezelelweyo we-palladium phakathi kwe-nickel kunye negolide ukukhusela ngakumbi umaleko we-nickel ekungcoleni nasekuthinteleni ukuvelisa ii-pads ezimnyama ezikhula ngokulula kwinkqubo yokugqitywa komphezulu we-ENIG. Ubukhulu be-nickel bumalunga ne-3-6um, ubukhulu be-palladium bumalunga ne-0.1-0.5um kwaye ubukhulu begolide buyi-0.02-0.1um. Nangona ubukhulu begolide buncinci kune-ENIG, i-ENEPIG ibiza kakhulu. Nangona kunjalo, ukwehla kwakutshanje kweendleko ze-palladium kwenze ixabiso le-ENEPIG lafikeleleka ngakumbi.
Inzuzo ye-ENEPIG
1. Inazo zonke iingenelo ze-ENIG, akukho nto imbi nge-black pad.
2. Ifanelekile ngakumbi kwi-wire bonding kune-ENIG.
3. Akukho mngcipheko wokugqwala.
4. Ixesha elide lokugcina, akukho lead (ithobela iRoHS)
Ubuthathaka be-ENEPIG
1. Inkqubo enzima, kunzima ukuyilawula.
2. Ixabiso eliphezulu.
3. Yindlela entsha kwaye ayikavuthwa.