| Into | I-PCB eqinileyo (HDI) | I-PCB eguquguqukayo | I-PCB eguquguqukayo eqinileyo |
| Umgangatho ophezulu | 2-68L | 12L | 68L |
| Umaleko wangaphakathi uMkhondo omncinci/Isithuba | 1.4/1.4mil | 2/2ml | 2/2ml |
| Umgca Ongaphandle Umncinci Wokulandelela/Isithuba | 1.4/1.4mil | 3/3ml | 3/3ml |
| Umaleko wangaphakathi u-Max Copper | 6oz | 2oz | 6oz |
| Umaleko ongaphandle weCopper ephezulu | 6oz | 3oz | 6oz |
| Ukubhola okuncinci koomatshini | 0.15mm/6mil | 0.15mm | 0.15mm |
| Ukubhola ngeLaser encinci | 0.05mm/3mil | 0.05mm | 0.05mm |
| Umlinganiselo woBume obuPhezulu (Ukubhola ngoomatshini) | 20:1 | / | 20:1 |
| Umlinganiselo woBume obuphezulu (Ukubhola ngeLaser) | 1:1 | 1:1 | 1:1 |
| Ulungelelwaniso lwe-Interlayer | +/-0.254mm(1mil) | ± 0.05mm | ± 0.05mm |
| Ukunyamezelana kwe-PTH | ± 0.075mm | ± 0.075mm | ± 0.075mm |
| Ukunyamezelana kwe-NPTH | ± 0.05mm | ± 0.05mm | ± 0.05mm |
| Ukunyamezelana kwesinki esichaseneyo | +0.15mm | ± 0.15mm | ± 0.15mm |
| Ubukhulu beBhodi | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Ukunyamezelana koBungqingqwa beBhodi ( |
± 0.1mm | ± 0.05mm | ± 0.1mm |
| Ukunyamezelana koBungqingqwa beBhodi (≥1.Omm) | ± 8% | / | ± 10% |
| Ubungakanani beBhodi obuncinci | 10*10mm | 5*5mm | 10*10mm |
| Ubungakanani beBhodi obuphezulu | 1200mm*750mm | 500*1200mm | 500*500mm |
| Ulungelelwaniso lweMigca | +/-0.075mm(3mil) | ± 0.05mm | ± 0.1mm |
| I-BGA yam | 0.125mm (5mil) | 7mil | 7mil |
| I-SMT yam | 0.177*0.254mm(7*10mil) | 7*10mil | 7*10mil |
| Ukususwa kweMask encinci yeSolder | 1.5ml | 2mil | 1.5ml |
| Idama lam leSolder Mask | 3mil | 3mil | 3mil |
| Intsomi | Mhlophe, Mnyama, Bomvu, Mthubi | Mhlophe, Mnyama, Bomvu, Mthubi | Mhlophe, Mnyama, Bomvu, Mthubi |
| Ububanzi/Ubude beLegend encinci | 4/23mil | 4/23mil | 4/23mil |
| Irediyasi encinci yokugoba (iBhodi enye) | / | 3-6 x Ubukhulu beBhodi | Ubukhulu beBhodi eguquguqukayo obuyi-3-7 x |
| Irediyasi encinci yokugoba (Ibhodi esecaleni kabini) | / | 6-10 x Ubukhulu beBhodi | Ubukhulu beBhodi eguquguqukayo eyi-6-11 x |
| Irediyasi encinci yokugoba (iBhodi yeZilayidi ezininzi) | / | 10-15 x Ubukhulu beBhodi | Ubukhulu beBhodi eguquguqukayo eyi-10-16 x |
| Irediyasi Encinci Yokugoba (Ukugoba Okunamandla) | / | 20-40 x Ubukhulu beBhodi | 20-40 × Ubukhulu beBhodi |
| Ububanzi beFillet yoxinzelelo | / | 1.5+0.5mm | 1.5+0.5mm |
| Ukugoba kunye nokujika | 0.005 | / | 0.0005 |
| Ukunyamezelana kwe-Impedance | Isiphelo Esinye: ±5Ω(≤50Ω)，±7%(＞50Ω) | Isiphelo Esinye: ±5Ω(≤50Ω),±10%(＞50Ω) | Isiphelo Esinye: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Ukunyamezelana kwe-Impedance | Umahluko: ±5Ω(≤50Ω)，±7%(＞50Ω) | Umahluko: ±5Ω(≤50Ω),±10%(＞50Ω) | Umahluko: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Imaski yeSolder | Luhlaza, Mnyama, Luhlaza okwesibhakabhaka, Bomvu, Matt Luhlaza, Mthubi, Mhlophe, Mfusa | Imaski yeSolder eluhlaza/i-PI emnyama/i-PI etyheli | Luhlaza, Mnyama, Luhlaza okwesibhakabhaka, Bomvu, Matt Luhlaza |
| Umphezulu wokugqiba | I-Eiectronic gold plating, ENIG, I-Hard gold plating, Gold Finger, I-Immersion Silver, I-ImmersionTin, HASL LF, OSP, ENEPIG, I-Soft gold plating | Ukugquma ngegolide ye-elektroniki, i-ENIG, ukugquma ngegolide eqinileyo, umnwe wegolide, isilivere yokuntywiliselwa, itini yokuntywiliselwa, i-OSP, i-ENEPIG, ukugquma ngegolide ethambileyo | Ukugquma ngegolide ye-elektroniki, i-ENIG, ukugquma ngegolide eqinileyo, umnwe wegolide, isilivere yokuntywiliselwa, i-Immersio Tin, i-HASL LF, i-OSP, i-ENEPIG, ukugquma ngegolide ethambileyo |
| Inkqubo ekhethekileyo | Ingcwatywe/imfama nge, i-step groove, inkulu kakhulu, ingcwatywe i-resistance/capacity, uxinzelelo oluxutyiweyo, i-RF, umnwe wegolide, isakhiwo se-N+N, ubhedu olujiyileyo, ukubhola umva, i-HDI(5+2N+5) | umnwe wegolide, i-lamination, i-Conductive adhesive, i-Shielding film, i-metal dome | Ingcwatywe/ingaboni nge-blind, i-step groove, inkulu kakhulu, i-infilled resistance/capacity, uxinzelelo oluxutyiweyo, i-RF, umnwe wegolide, isakhiwo se-N+N, ubhedu olujiyileyo, ukubhola ngasemva |
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