Amaqhinga asebenzayo okuthintela iiSekethe ezimfutshane kwiNdibano ye-SMT PCB
Kwindibano ye-PCB ye-SMT (Surface Mount Technology), ukuthintela ii-short circuits kubalulekile ukuqinisekisa ukuthembeka nokusebenza kwemveliso yokugqibela. Ii-short circuits azichaphazeli nje kuphela ukusebenza kodwa zinokukhokelela kwiimveliso ezineziphene, iindleko zokuvelisa ezinyukileyo, kunye nokuphinda zisebenze. Eli nqaku liphonononga amaqhinga aliqela okuthintela ngempumelelo ii-short circuits ngexesha lenkqubo yokuhlanganisa i-SMT PCB.
1. Ukukhethwa kweCandelo kunye nokuhlolwa
Umgangatho wezinto ezisetyenzisiweyo unxulumene ngqo nemiba yesekethe emfutshane. Iingxaki ezinje ngee-pad ezinkulu okanye ezincinci, iilead zezixhobo ezigobileyo, kunye neziphene zangaphakathi zinokubangela ukungasebenzi kakuhle kwesekethe, nto leyo ebangela ii-short circuits. Ukuze kuncitshiswe le mingcipheko, abavelisi kufuneka bakhethe izinto ezisetyenzisiweyo kubathengisi abathembekileyo baze benze uhlolo olungqongqo lokulawula umgangatho wezinto ezisetyenzisiweyo.
Hlola inkangeleko, ubungakanani, kunye neentsimbi zezixhobo ukuqinisekisa ukuba azinaziphene.
Yenza iisampulu ezingacwangciswanga ukuqinisekisa ukuba izixhobo ziyahlangabezana nemigangatho yomgangatho ngaphambi kokuba zihlanganiswe.
Ngokuqinisekisa ukuba izinto ezisemgangathweni ophezulu zisebenza, abavelisi banokuthintela ii-short circuits ezibangelwa zizinto ezineziphene okanye ezingaphantsi komgangatho.
2. Ukuphucula iindlela zokunyibilikisa isinyithi
Ukutshixa okungafanelekanga yimbangela enkulu yeesekethe ezimfutshane kwindibano ye-SMT. Izinto ezinje ngobushushu obugqithisileyo okanye obunganelanga bokutshixa, okanye ixesha elingafanelekanga lokutshixa, zinokuchaphazela kakubi umgangatho weejoyinti ze-solder, nto leyo ekhokelela kwiisekethe ezimfutshane. Iiparameter ezifanelekileyo zokutshixa kufuneka zimiselwe ngokweempawu zecandelo ukuze kuthintelwe le micimbi.
Gcina amaqondo obushushu ahambelanayo kunye namaxesha okunyibilikisa asekelwe kwiinkcukacha zecandelo.
Lungisa rhoqo kwaye ugcine izixhobo zokutywina ukuqinisekisa ukusebenza okuzinzileyo.
Sebenzisa izinto ezisetyenziswa kwi-solder ezikumgangatho ophezulu ukuthintela iingxaki ezifana nokuhamba kwamanzi amaninzi okanye ukungabikho kokubopha ngokwaneleyo.
Iindlela zokunyibilikisa ezilungiselelweyo zinceda ekudaleni iindawo zokunyibilikisa ezinokwethenjelwa neziqinileyo, nto leyo enciphisa umngcipheko weesekethe ezimfutshane.
3. Ulawulo lweNkqubo yoKuhlanganisa
Ukubekwa gwenxa kwezixhobo ngexesha lenkqubo ye-SMT nako kunokubangela ii-short circuits. Ukulungelelaniswa kwezixhobo okanye ukusetyenziswa gwenxa kwe-solder paste kunokubangela ukudibana phakathi kwee-solder pads. Kwizixhobo ezithambileyo ezifana nee-IC (ii-Integrated Circuits), ukubekwa gwenxa kwezixhobo kunokukhokelela kwiibridges ze-solder kwaye kubangele ii-short circuits.
Sebenzisa izixhobo zokubeka izinto ngendlela echanekileyo ukuqinisekisa ukuba iindawo ezisetyenziswayo zibekwe ngokuchanekileyo.
Lawula ngokungqongqo ukuphakama kunye nee-engile zokubekwa ukuze uthintele ukudilika okanye ukubhidlika kwe-solder paste.
Qinisekisa ukuba uyilo lwestencil kunye nobukhulu bomngxuma ziyahlangabezana neemfuno zokusetyenziswa kwepeyinti echanekileyo yesolder.
Ngokusebenzisa ulawulo olungqongqo kwinkqubo yokuhlanganisa, abavelisi banokunciphisa amathuba okuba iinxalenye zingabikho kakuhle kunye nokudibanisa i-solder, ezizizizathu eziqhelekileyo zemijikelezo emfutshane.
4. Ulawulo lweNdawo yoLwakhiwo lweMveliso
Indawo yemveliso ikwadlala indima ebalulekileyo ekuthinteleni ii-short circuits. Izinto ezinje ngokufuma okuphezulu kunye nongcoliseko oluvela eluthulini okanye kumasuntswana angaphandle zinokubangela iziphene kwinkqubo yokuhlanganisa. Umzekelo, ukufuma okugqithisileyo kunokukhokelela ekufunxweni komswakama ngamacandelo, okubangela iingxaki zokunyibilikisa njenge-voids okanye amaqamza abangela ii-short circuits.
Lawula amanqanaba okufuma kwindawo yokuvelisa, kungcono ukuba phakathi kwama-40% nama-60%, ukuze kuthintelwe ukufunxwa komswakama ngamacandelo.
Coca izixhobo zemveliso kunye neendawo zokusebenza rhoqo ukuze unciphise uthuli kunye nongcoliseko lwamasuntswana.
Qinisekisa ukuba ubushushu kunye nomswakama zihlala zizinzile ukuze kugcinwe umgangatho wokutywina ohambelanayo.
Indawo yokwenziwa kwemveliso elawulwayo inceda ekunciphiseni umngcipheko wongcoliseko kwaye iqinisekisa ukutywinwa komgangatho ophezulu, okunokuthintela imijikelo emfutshane.
5. Ukufumanisa kunye nokusombulula iingxaki zesekethe emfutshane
Nangona kuthathwe amanyathelo okuthintela, ii-short circuits zisenokwenzeka ngexesha lokuhlanganiswa kwe-SMT PCB. Ukusebenzisa iindlela zokuchonga kunye nokusombulula iingxaki ngokufanelekileyo kubalulekile ekuchongeni nasekulungiseni ii-short circuits ngokukhawuleza.
Ukuhlolwa ngesandla: Emva kokuhlanganiswa, sebenzisa i-multimeter ukujonga iisekethe ezibalulekileyo ukuze ubone ukuqhubeka kwazo kwaye ubone iisekethe ezimfutshane ezinokubakho.
Ukusombulula iingxaki zokwahlulahlulaUkuba kufumaneka ii-short circuits kwiibhodi ezininzi, yahlula iindawo zebhodi ukuze ufumane umthombo wengxaki.
Izixhobo zeSazisi esifutshane: Sebenzisa izixhobo zokufumanisa i-short circuit ukuze ubone indawo echanekileyo ye-short ngokulinganisa umbane kunye ne-voltage kwi-circuit.
Uvavanyo oluqhelekileyo kunye nokusombulula iingxaki kunceda ekufumaneni ii-short circuits kwasekuqaleni kwenkqubo yemveliso, ukuthintela ezinye iziphene kunye nokulibaziseka.
6. Ukuphathwa kweCandelo eliKhethekileyo
Kwizinto ezikhethekileyo ezifana neetships zeBGA (Ball Grid Array), ezigqunywe ngumzimba wetships kwaye kunzima ukuzihlola ngenxa yoyilo lwazo lwePCB oluneeleya ezininzi, kufuneka amanyathelo okhuseleko ongezelelweyo ukuthintela ii-short circuits.
Kwisigaba soyilo, yahlula amandla kunye nemigangatho yomhlaba kwitshiphu nganye, usebenzisa ii-magnetic beads okanye ii-resistor zero-ohm ukuze kube lula ukubhaqwa ukuba kukho i-short.
Sebenzisa ukuhlolwa kwe-X-ray ngokuzenzekelayo ukujonga iingxaki ezifihlakeleyo zokutywina phantsi kwecandelo.
Ukuphathwa ngokukodwa kwezi zinto zintsonkothileyo kuqinisekisa ukuba ii-short circuits ziyathintelwa nokuba kuyilo olunzima, nto leyo ephucula ukuthembeka kwe-PCB iyonke.
Imibuzo ebuzwa rhoqo enxulumene nokuthintela ukujikeleza okufutshane kwindibano ye-SMT PCB:
1. Ziziphi izizathu eziqhelekileyo zeesekethe ezimfutshane kwindibano ye-SMT PCB?
Izizathu eziqhelekileyo ziquka ukutywinwa okungafanelekanga (ukunyibilika okugqithisileyo okanye okunganelanga), ukulahleka kwenxalenye, izinto ezikumgangatho ophantsi, ungcoliseko kwindawo yokwenziwa, kunye nokusetyenziswa okungalunganga kwentlama yokutywinwa. Ukujongana nale micimbi ngeendlela ezilungisiweyo zokutywinwa, ukuhlolwa kwenxalenye, kunye nolawulo oluchanekileyo lokuhlanganisa kunokunciphisa kakhulu umngcipheko weesekethe ezimfutshane.
2. Umswakama uchaphazela njani ukuthintela ukujikeleza okufutshane kwindibano yePCB?
Ukufuma okuphezulu kunokubangela ukufunxwa komswakama zizinto ezithile, nto leyo ekhokelela kwiingxaki zokunyibilikisa i-solder ezifana neebridges ze-solder okanye i-voids, nto leyo enokubangela ii-short circuits. Ukuthintela oku, abavelisi kufuneka balawule amanqanaba okufuma kwindawo yemveliso kwaye baqinisekise ukuba ahlala kuluhlu olufanelekileyo lwe-40% ukuya kwi-60%.
3. Kutheni ukuphathwa kwecandelo le-BGA (Ball Grid Array) kubalulekile ekuthinteleni ii-short circuits?
Izixhobo ze-BGA zihlala kunzima ukuzihlola kuba amalungu azo e-solder afihliwe phantsi komzimba wecandelo. Ukuphathwa okukhethekileyo, njengokwahlula amandla kunye neenqwelo-moya zomhlaba kunye nokusebenzisa ii-magnetic beads okanye ii-resistor ze-zero-ohm ukuze kufunyanwe iimpazamo ngokulula, kubalulekile. Ukuhlolwa kwe-X-ray okuzenzakalelayo kukwacetyiswa ukuqinisekisa ukutywinwa ngokufanelekileyo kunye nokuphepha ii-short circuits.
4. Zeziphi iindlela ezilungileyo zokuphucula iindlela zokunyibilikisa isinyithi ukuze kuthintelwe ii-short circuits?
Iindlela ezilungileyo zokwenza izinto ziquka ukugcina amaqondo obushushu ahambelanayo kunye namaxesha asekelwe kwiinkcukacha zecandelo, ukusebenzisa izixhobo ze-solder ezikumgangatho ophezulu, kunye nokulinganisa rhoqo izixhobo ze-solder. Ukuphucula ezi parameters kuqinisekisa ukuba iindawo ze-solder ziqinile kwaye zithembekile ngaphandle kokuhamba kakhulu okanye ukubopha okubi okunokubangela ukuba kubekho ii-short circuits.
5. Ndingazibona njani ii-short circuits kwangethuba kwinkqubo yokuhlanganisa i-SMT PCB?
Iisekethe ezimfutshane zinokufunyanwa kusetyenziswa iindlela ezahlukeneyo: ukuhlolwa ngesandla nge-multimeter, ukwahlulahlula ibhodi ukuze kulungiswe iingxaki, kunye nokusebenzisa izixhobo zokufumana iisekethe ezimfutshane. Kwiindibano ezintsonkothileyo, ukuhlolwa kwe-X-ray okuzenzakalelayo okanye izixhobo zokuvavanya ezikhethekileyo zinokuchonga iziphene ezifihlakeleyo, okuvumela ukungenelela ngokukhawuleza kunye nokunciphisa amathuba eemveliso ezineziphene.
Ukuthintela ii-short circuits kwi-SMT PCB assembly kufuna indlela ebanzi equka ukukhethwa kwezinto ngononophelo, iindlela zokudibanisa ezilungisiweyo, ulawulo oluchanekileyo lwe-assembly, ulawulo lokusingqongileyo, kunye neendlela zokufumanisa eziqinileyo. Ngokusebenzisa la maqhinga, abavelisi banokunciphisa kakhulu ukwenzeka kwee-short circuit, baphucule umgangatho wemveliso, kwaye baphucule ukusebenza kakuhle kwemveliso.
Ngokuthatha amanyathelo asebenzayo kwinkqubo yokuhlanganisa, abavelisi banokuqinisekisa ukuba ii-PCB zabo zithembekile kwaye banike abathengi babo iimveliso ezingcono.
