Uhlalutyo olupheleleyo lweTekhnoloji yeBhodi yeSekethe ePrintiweyo (i-PCB): Iintlobo, izixhobo, usetyenziso, kunye neendlela zexesha elizayo
Njengenxalenye ebalulekileyo yezixhobo ze-elektroniki, iPrinted Circuit Board (PCB) isebenza njengeziko lemithambo-luvo yenkqubo ye-elektroniki, isenza imisebenzi ebalulekileyo yokubonelela ngenkxaso yoomatshini kunye noqhagamshelo lombane lwezixhobo ze-elektroniki. Ngophuhliso olukhawulezayo lwetekhnoloji ye-elektroniki, ukusuka ekuthwaleni okuncinci nokukhaphukhaphu kwee-smartphones ukuya kwikhompyutha esebenza kakhulu kwiziko ledatha, ukusuka ekudlulisweni kwesantya esiphezulu kunxibelelwano lwe-5G ukuya kulawulo oluntsonkothileyo ekuqhubeni ngemoto ngokuzimela, iimeko ezahlukeneyo zesicelo zibeka iimfuno ezahlukeneyo zokusebenza, ulwakhiwo, kunye nenkqubo yee-PCB. Oku kukhokelele ekuveleni kweentlobo ngeentlobo ze-PCB. Ukuqonda ngokupheleleyo iimpawu ezahlukeneyo ze-PCB kubalulekile kwiinjineli ze-elektroniki, abaphandi kunye nabaphuhlisi, kunye neengcali kumashishini anxulumene noko, ukuphucula uyilo lwe-elektroniki kunye nokuphucula ukusebenza kwemveliso.
Uhlalutyo lobuchwephesha lwee-PCB ezihlelwe ngokwezixhobo ze-substrate
(一) Ii-PCB eziqinileyo
Ii-PCB eziqinileyo, ezizinzileyo kwaye zinamandla oomatshini, ziye zaba lolona khetho luphambili kwizixhobo ezininzi ze-elektroniki. Izixhobo zefayibha yeglasi, ezifana ne-E-glass kunye ne-S-glass, zisetyenziswa kakhulu ekwenzeni ii-PCB eziqinileyo ngenxa yeempawu zazo zobushushu ezibalaseleyo kunye namandla oomatshini. Phakathi kwazo, ifayibha ye-E-glass inika ukusebenza kakuhle kweendleko kwaye ifumaneka rhoqo kwiimveliso ze-elektroniki ngokubanzi; ifayibha ye-S-glass, kwelinye icala, inamandla aphezulu kunye ne-modulus, okwenza ukuba ifaneleke kwiindawo ezineemfuno ezingqongqo zeempawu zoomatshini.
Ii-PCB eziqinileyo ezenziwe ngezinto ze-polyimide (PI) zineempawu ezifana nokumelana nobushushu obuphezulu (ezikwaziyo ukusebenza ngokuqhubekayo ngaphezulu kwama-200°C), ubushushu obuphezulu (ezine-dielectric constant ephantsi njenge-3), kunye nozinzo oluhle kakhulu lweekhemikhali. Zihlala zisetyenziswa kwiimeko ezifunwa kakhulu ezifana ne-aerospace kunye ne-electronics yomkhosi. I-FR-4, njengeyona nto isetyenziswa kakhulu kwi-substrate kwi-PCB eziqinileyo, yenziwe nge-epoxy resin-impregnated glass fiber cloth. Ineempawu ezilungileyo zombane (ezinokumelana nomthamo ongaphezulu kwe-10^14Ω·cm) kunye nokunganyamezelani komlilo (okuhlangabezana nomgangatho wokunganyamezelani komlilo we-UL94V-0), kwaye isetyenziswa kakhulu kwiimveliso ze-elektroniki ezifana neekhompyutha kunye nezixhobo zonxibelelwano.
Njengee-laminate ezifakwe ubhedu ezisisiseko esidityanisiweyo, i-CEM-1 kunye ne-CEM-3 zineempawu zazo. I-CEM-1, eyenziwe ngomxube weglasi kunye nesiseko sephepha, inexabiso eliphantsi kunye neempawu ezithile zombane, okwenza ukuba ifaneleke kwiimveliso ze-elektroniki zabathengi ezinobunzima obuphezulu. I-CEM-3, esekelwe kwisiseko sefayibha yeglasi, igqwesile ekusebenzeni kancinci kunye nokusebenza koomatshini, kwaye idla ngokusetyenziswa kwizixhobo ze-elektroniki ezincinci.
(二) 、Flexible PCBs (FPCs)
Ii-PCB eziguquguqukayo (ii-FPC), ezinokugobeka nokubhitya kwazo okukhethekileyo, zibambe indawo ebalulekileyo kwizixhobo ze-elektroniki ezinesithuba esincinci. I-Polyimide (PI) yenye yezinto eziphambili ze-FPC. Inokuguquguquka okugqwesileyo (iyakwazi ukumelana nezigidi zemijikelo yokugoba), ukumelana nobushushu obuphezulu (enobushushu bokusebenza obungaphezulu kwe-150°C), kunye neempawu ezilungileyo zombane (ene-dielectric loss tangent ephantsi njenge-0.002).
Izixhobo zefilimu yepolyester ezifana ne-polyethylene terephthalate (PET) kunye ne-polyethylene naphthalate (PEN) nazo zisetyenziswa kakhulu kwi-FPCs. Zineengenelo zexabiso eliphantsi kunye nokusebenziseka kakuhle, kodwa zingaphantsi kancinci kwi-PI ngokubhekiselele ekumelaneni nobushushu obuphezulu kunye neempawu zombane. Iiparameter eziphambili zokulinganisa ukusebenza kwe-FPCs, njenge-radius yokugoba kunye nenani lemijikelo yokugoba enokuyinyamezela, zichaphazela ngokuthe ngqo ukuthembeka kunye nobomi benkonzo ye-FPCs kwizicelo ezisebenzayo.
(三) Ii-PCB eziqinileyo neziguquguqukayo
Ii-PCB eziqinileyo neziguquguqukayo zidibanisa ngobuchule iingenelo zee-PCB eziqinileyo kunye nee-PCB eziguquguqukayo. Kwiindawo eziqinileyo, izinto ezifanayo ze-substrate nezo zisetyenziswa kwii-PCB eziqinileyo, ezifana neebhodi eziqinileyo ze-FR-4 okanye ze-PI, zihlala zisetyenziselwa ukubonelela ngenkxaso yoomatshini kunye nokuzinza kwebhodi yesekethe, ukuqinisekisa ukufakwa okuthembekileyo kwezinto ze-elektroniki kunye noqhagamshelo lombane. Kwiindawo eziguquguqukayo, izinto ze-substrate eziguquguqukayo, ezifana neefilimu eziguquguqukayo ze-PI, zisetyenziselwa ukufezekisa ukugoba kwebhodi yesekethe.
Itekhnoloji ephambili yee-PCB eziqinileyo neziguquguqukayo ikwinkqubo yokudibanisa phakathi kweendawo eziqinileyo neziguquguqukayo. Iindlela zokudibanisa eziqhelekileyo ziquka ukuwelda nge-laser kunye nokuncamathisela okunamathelayo. Ukuthembeka kweendawo zokudibanisa kunye noyilo lokunciphisa uxinzelelo zizinto ezibalulekileyo zokuqinisekisa ukusebenza kwee-PCB eziqinileyo. Uyilo olufanelekileyo lunokuthintela ngempumelelo iingxaki ezinje ngokusilela konxibelelwano okanye ukuhanjiswa kwesignali okungaqhelekanga ngexesha lenkqubo yokugoba.
Iimpawu zobugcisa ze-PCB ezihlelwe ngokwenani leeLayers eziqhubayo
(一) Ii-PCB ezinecala elinye
Njengohlobo olusisiseko lwe-PCB, i-PCB enecala elinye ine-copper foil kwicala elinye kuphela kwaye ifezekisa imisebenzi yesekethe ngokusebenzisa i-wiring enecala elinye. Ulwakhiwo lwayo lwesekethe lulula, nto leyo eyenza ukuba ifaneleke kwezinye izixhobo ze-elektroniki ezineemfuno eziphantsi zokusebenza, ezifana neebhodi zokulawula izixhobo zasekhaya ezilula kunye neebhodi zesekethe zokudlala. Inkqubo yokuvelisa ii-PCB ezinecala elinye ilula kakhulu, ikakhulu ibandakanya amanyathelo anjengokugrumba i-copper foil, ukuprinta imaski ye-solder, kunye nokuprinta oonobumba, kwaye ixabiso liphantsi kakhulu. Nangona kunjalo, ngenxa yendawo encinci yokufakelwa kwentambo, ubunzima besekethe kunye nokwandiswa kokusebenza kwee-PCB ezinecala elinye kunqunyelwe kancinci.
(二) Ii-PCB Ezinamacala Amabini
I-PCB enamacala amabini ine-copper foil kumacala omabini ebhodi yesekethe kwaye ifezekisa unxibelelwano lombane phakathi kwamacala omabini nge-vias (ii-vias ezenziwe ngesinyithi). Inkqubo yokuvelisa ii-vias idla ngokuquka amanyathelo anjengokubhoboza, i-electroless copper plating, kunye ne-electroplating ukuqinisekisa ukuqhuba kakuhle kombane eludongeni lwangaphakathi lwee-vias. Ubunzima besekethe kunye nokukwazi ukusebenza kwee-PCB ezinamacala amabini kuphucuke kakhulu xa kuthelekiswa nee-PCB ezinamacala omabini, kwaye zingasetyenziswa kwiibhodi zomama zekhompyutha, kwezinye iimodyuli zezixhobo zonxibelelwano, njl.njl.
Kuyilo lwee-PCB ezinamacala amabini, ucwangciso lwentambo kunye noyilo lwe-via zezona zinto zibalulekileyo. Uyilo olufanelekileyo lunokunciphisa ngempumelelo ukuphazamiseka kwesignali kwaye luphucule ukuthembeka kunye nokuzinza kokudluliselwa kwesignali.
(三) Ii-PCB ze-Multilayer
Ii-PCB ze-Multilayer zineeleya ezininzi eziqhubayo (ngesiqhelo iileya ezi-4 nangaphezulu), ezahlulwe ziileya ezikhuselayo (ezifana namaphepha e-prepreg, amaphepha e-PP). Ukongeza kwimingxuma eqhelekileyo, ubuchwepheshe be-blind via kunye ne-bidded via nazo zisetyenziswa kakhulu kwii-PCB ze-multilayer. I-blind via ngumngxuma oqhubayo osuka kumphezulu webhodi yesekethe ukuya kumaleko athile angaphakathi kwaye awungeni kwibhodi yesekethe yonke; i-bidden via ngumngxuma oqhubayo odibanisayo phakathi kweeleya zangaphakathi kwaye awuvezwa kumphezulu webhodi yesekethe.
Ukusetyenziswa kweteknoloji ye-blind via kunye ne-bidded via kunciphisa ngempumelelo inani lee-vias kumphezulu webhodi yesekethe kwaye kuphucula uxinano lwentambo kunye nokusebenza kokudluliselwa kwesignali. Ii-PCB ze-Multilayer zinokufikelela kuthumelo lwentambo oluxineneyo kunye nothumelo lwesignali olusebenzayo kakhulu, kwaye zisetyenziswa kakhulu kwizixhobo ze-elektroniki eziphezulu, ezifana nee-motherboards zeseva, ii-motherboards ze-smartphone, kunye namakhadi emizobo asebenza kakhulu. Kwinkqubo yokuvelisa ii-PCB ze-multilayer, izinto ezifana nenkqubo ye-lamination, ukuchaneka kokubhola, kunye nomgangatho we-electroplating zinempembelelo enkulu ekusebenzeni nasekuthembekeni kwebhodi yesekethe.
Ntathu,Amanqaku aPhambili oBugcisa eePCB aHlolwe ngokweeNkqubo ezikhethekileyo
(一) Ii-PCB eziQhelekileyo kakhulu
Ii-PCB ezisebenzisa i-frequency ephezulu zisetyenziswa kakhulu kwizixhobo ze-elektroniki ezisingatha imiqondiso esebenzisa i-frequency ephezulu, njengonxibelelwano olungenazingcingo, i-radar, kunye nezinye iindawo. Ngexesha lokudluliselwa kwemiqondiso esebenzisa i-frequency ephezulu, iingxaki ezifana nokulahleka kwesignali kunye nokuphazamiseka kwesigaba ziyabonakala kakhulu. Ke ngoko, ii-PCB ezisebenzisa i-frequency ephezulu kufuneka zisebenzise izixhobo ezikhethekileyo ukunciphisa ukulahleka kwesignali kunye nokuphucula umgangatho wokudluliselwa kwesignali.
Izinto zeRogers zezinye zezinto ezisetyenziswa kakhulu kwi-substrate kwi-PCBs ezine-frequency ephezulu. Zine-dielectric constant ephantsi kakhulu (i-Dk inokuba phantsi malunga ne-2.2) kunye ne-loss tangent (i-Df ingaphantsi kwe-0.0009), nto leyo enokunciphisa ngempumelelo ukulahleka kwesignali kunye nokuphazamiseka ngexesha lenkqubo yokudlulisela. I-Polytetrafluoroethylene (PTFE) kunye nezinto zayo ezizalisiweyo zikwasetyenziswa rhoqo kwi-PCBs ezine-frequency ephezulu, njengoko zineempawu ezilungileyo zombane ezine-frequency ephezulu kunye nozinzo lweekhemikhali.
Kwinkqubo yoyilo kunye nokuveliswa kwee-PCB ezisebenzisa i-frequency ephezulu, ukongeza ekukhetheni izinto, uyilo lwezinto ezifana noyilo lwesekethe, ukuhambelana kwe-impedance, kunye nokukhusela i-electromagnetic nako kubalulekile. Uyilo lwesekethe olufanelekileyo lunokunciphisa ukuphazamiseka phakathi kwezibonakaliso, ukuhambelana kwe-impedance ngokuchanekileyo kunokuqinisekisa ukuhanjiswa kwesignali ngokufanelekileyo, kwaye ukukhuselwa kwe-electromagnetic ngokufanelekileyo kunokuthintela izibonakaliso ezisebenzisa i-frequency ephezulu ukuba zingaphazamisi iisekethe ezingqongileyo.
(二) IiPCB ezisekelwe kwisinyithi
Ii-PCB ezisekwe kwisinyithi, kunye nokusebenza kwazo okuhle kakhulu kokusasaza ubushushu, ziye zaba lukhetho olufanelekileyo kwizixhobo ze-elektroniki ezinamandla aphezulu. Izinto eziqhelekileyo ze-substrate zesinyithi ziquka ezisekwe kwi-aluminium kunye nezobhedu. I-substrate esekelwe kwi-aluminium inamandla amahle okusasaza ubushushu kwaye ixabisa kancinci, kwaye isetyenziswa kakhulu kwiindawo ezifana nokukhanya kwe-LED kunye neemodyuli zamandla. I-substrate esekelwe kwi-copper ine-conductivity ephezulu yobushushu (malunga ne-1.6 ngokuphindwe kayi-aluminium) kwaye ifanelekile kwiimeko ezineemfuno eziphezulu kakhulu zokusasaza ubushushu, ezifana neesekethe ze-motor drive ezinamandla aphezulu.
Umgaqo wokusasaza ubushushu wee-PCB ezisekwe kwisinyithi kukuqhuba ngokukhawuleza ubushushu obuveliswa zizixhobo ze-elektroniki nge-substrate yesinyithi. Ukuphucula ukusebenza kakuhle kokusasaza ubushushu, umaleko wokukhusela oqhuba ubushushu, njenge-silicone pad eqhuba ubushushu okanye i-adhesive eqhuba ubushushu, uhlala wongezwa phakathi kwe-substrate yesinyithi kunye nezixhobo ze-elektroniki. Kwinkqubo yokuvelisa ii-PCB ezisekwe kwisinyithi, ulawulo lobukhulu bomaleko wokukhusela kunye namandla okubopha kunye ne-substrate yesinyithi zizinto ezibalulekileyo zokuqinisekisa ukusebenza kwazo.
(三) Ii-HDI PCB (ii-High-Density Interconnect PCBs)
Ii-HDI PCB (ii-High-Density Interconnect PCBs), ezineempawu zazo zocingo oluxineneyo kunye ne-miniaturization, ziyahlangabezana neemfuno ezingqongqo zezixhobo ze-elektroniki zanamhlanje ukuze kubekho indawo kunye nokusebenza. Ubuchwepheshe obuphambili bee-HDI PCB bulele ekwenziweni kwee-micro-vias (ii-Micro-Vias) kunye nokukrola imigca emincinci. Ububanzi bee-micro-vias buhlala bungaphantsi kwe-0.1mm kwaye benziwa kusetyenziswa ubuchwepheshe obuphambili obufana nokubhola nge-laser okanye ukukrola nge-plasma.
Ukugrumba kwemigca emincinci kufuna izixhobo zokugrumba ezichanekileyo kakhulu kunye nolawulo lwenkqubo ukuze kufezekiswe iingcingo ezincinci ezinobubanzi bomgca/umgca ongaphantsi kwe-30μm/30μm. Ii-PCB ze-HDI zihlala zisebenzisa itekhnoloji yokwakha, zifezekisa unxibelelwano oluxineneyo ngokudibanisa iileya zokuthintela kunye neeleya eziqhubayo umaleko ngomaleko ngomaleko ngomaleko. Ii-PCB ze-HDI zisetyenziswa kakhulu kwizixhobo ze-elektroniki ezincinci ezifana nee-smartphones, iitablet, kunye nezixhobo ezinokunxitywa, kwaye zezinye zezona teknoloji ziphambili zokufezekisa ukusebenza okuphezulu kunye nokunciphisa ezi zixhobo.
Ii-substrates ze-IC (iiBhodi zoMthwali we-IC)
Ii-substrates ze-IC (iibhodi zokuthwala ze-IC) zisetyenziswa kakhulu ekupakisheni iitshiphusi, ezifana nokupakisha kwe-BGA (Ball Grid Array), ukupakisha kwe-QFN (Quad Flat No-Lead), kunye nokupakisha kwe-FC (Flip Chip), njl. Ii-substrates ze-IC kufuneka zibe neempawu zokunxibelelana okuphezulu kunye nokuchaneka okuphezulu ukuze kufezekiswe unxibelelwano oluthembekileyo phakathi kwetshiphusi kunye nesekethe yangaphandle.
Ii-substrates ze-IC zihlala zisebenzisa uyilo lwebhodi eneziteya ezininzi, kwaye kukho iimfuno ezingqongqo zokuchaneka komgca, ngobukhulu, kunye nokuchaneka kwendawo ngexesha lenkqubo yokuvelisa. Kwangaxeshanye, ii-substrates ze-IC nazo kufuneka ziqwalasele ulawulo lokusasazwa kobushushu kunye nokusebenza kombane ukuqinisekisa uzinzo kunye nokuthembeka kwe-chip ngexesha lokusebenza. Ngophuhliso oluqhubekayo lwetekhnoloji ye-chip, iimfuno zokusebenza kunye nokuchaneka kwe-substrates ze-IC nazo ziyanda rhoqo.
Iimpawu zobugcisa ze-PCB ezihlelwe ngokweSakhiwo se-Conductive Vias
(一) Iibhodi Ezingena Kwimingxunya
Ibhodi enomngxuma odlulayo yenye yezona ntlobo zixhaphakileyo zeePCB. Ii-vias zayo eziqhubayo zingena ukusuka kumaleko aphezulu ukuya kumaleko asezantsi ebhodi yesekethe, kwaye unxibelelwano lombane phakathi kwee-layers lufezekiswa ngenkqubo ye-via electroplating. Ububanzi be-via kunye nobukhulu bobhedu bodonga lwe-via lwebhodi enomngxuma odlulayo ziiparameter ezibalulekileyo ezichaphazela ukusebenza kwayo kombane kunye namandla oomatshini.
Ububanzi obukhulu be-via buluncedo ekufakeni izinto ze-plug-in, kodwa buya kuthatha indawo enkulu yocingo; ukungoneli kobhedu eludongeni lwe-via kunokukhokelela ekuqhagamshelweni kombane okungathembekanga. Ngexesha lenkqubo yokwenziwa kwebhodi edlulayo, ukuchaneka kokubhola kwe-vias kunye nomgangatho we-electroplating kunempembelelo ebalulekileyo ekusebenzeni kwebhodi yesekethe. Ukongeza, ibhodi edlulayo ingathatha inkqubo yokuzalisa nge-via, njengokuzalisa i-resin, ukuphucula ukuthembeka kwayo kunye nokumelana nokufuma.
(二) Iibhodi zeMicro-Via
Iibhodi ze-Micro-via zisebenzisa ii-vias eziqhubayo ezinobubanzi obuncinci (ngesiqhelo zingaphantsi kwe-0.15mm), njengee-micro-vias ezingaboniyo kunye nee-micro-vias ezingcwatyiweyo. Ukwenziwa kwee-micro-vias kudla ngokusebenzisa ubuchwepheshe bokugrumba nge-laser okanye i-plasma etching, kwaye ezi teknoloji zinokufezekisa ukwenziwa kwee-micro-vias ngokuchanekileyo okuphezulu ukuhlangabezana neemfuno zentambo ephezulu.
Ii-micro-vias zeebhodi ze-micro-via zine-diameters ezincinci kunye nenani elikhulu, elinokufezekisa uqhagamshelo lombane olungaphezulu kwindawo encinci kwaye liphucule inqanaba lokudibanisa kunye nokusebenza kwebhodi yesekethe. Ngexesha lenkqubo yoyilo kunye nokuveliswa kweebhodi ze-micro-via, iinkqubo zokuzalisa kunye nonyango lomphezulu wee-micro-vias kufuneka ziqwalaselwe ukuqinisekisa ukusebenza kombane kunye nokuthembeka kwee-micro-vias.
(III) Iibhodi ezisebenzisa iiBlind Via
Ii-vias eziqhubayo zeebhodi ezisebenzisa i-blind via zisuka kumphezulu webhodi yesekethe ziye kumaleko othile wangaphakathi kwaye azingeni kuyo yonke ibhodi yesekethe. Ukubakho kwee-vias ezisebenzisa i-blind via kunokunciphisa inani lee-vias kumphezulu webhodi yesekethe, kwandise uxinano lweentambo, kwaye kunciphise nokuphazamiseka kwemiqondiso ngexesha lenkqubo yokudlulisa.
Iinkqubo zokwenziwa kwee-blind vias ziquka ukubhola nge-laser, ukubhola nge-electroplating emva kokubhola ngoomatshini, njl. Iindlela ezahlukeneyo zenkqubo zinempembelelo eyahlukileyo kumgangatho kunye nexabiso lee-blind vias. Kuyilo lwee-blind via boards, indawo kunye nobungakanani bee-blind vias kufuneka kucwangciswe ngokufanelekileyo ukuze kusetyenziswe ngokupheleleyo izibonelelo zazo kwaye kuphuculwe ukusebenza kwebhodi yesekethe.
(四) Iibhodi ze-High-Density Interconnect (HDI)
Iibhodi ze-High-Density Interconnect (HDI) ziphawulwa ngokudibanisa okuxineneyo, ububanzi obuncinci, kunye nemigca emincinci, kwaye zezinye zeendlela zobuchwepheshe eziphambili zokufezekisa ukusebenza okuncinci kunye nokusebenza okuphezulu kwezixhobo ze-elektroniki. Ukongeza ekusebenziseni ii-vias ezincinci eziqhubayo, iibhodi ze-HDI zikwafumana ukufakelwa kweentambo ezincinci nge-line width/line pitch engaphantsi kwe-30μm/30μm ngetekhnoloji yokukrola imigca emincinci.
Iibhodi ze-HDI zihlala zisebenzisa itekhnoloji yokwakha, zifezekisa uqhagamshelo oluphezulu ngokudibanisa iileya zokukhusela kunye neeleya zokuqhuba umaleko ngomaleko ngomaleko. Ngexesha lenkqubo yokuvelisa iibhodi ze-HDI, iimfuno zezixhobo, izixhobo, kunye neenkqubo ziphezulu kakhulu, kwaye umgangatho wekhonkco ngalinye kufuneka ulawulwe ngokungqongqo ukuqinisekisa ukusebenza kunye nokuthembeka kwebhodi yesekethe.
Isiphelo
Njengesiseko esibalulekileyo sobuchwepheshe be-elektroniki, ukwahluka kweentlobo kunye nobunzima betekhnoloji yeebhodi zesekethe eziprintiweyo zibonelela ngenkxaso eqinileyo yokuvelisa izinto ezintsha kunye nophuhliso lwezixhobo ze-elektroniki. Ukususela ekukhetheni izixhobo ze-substrate ukuya kuyilo lweeleya eziqhuba umbane, ukusuka ekusetyenzisweni kweenkqubo ezikhethekileyo ukuya ekuqwalaselweni kweendlela zonyango lomphezulu, kwaye emva koko ukuya kwiimfuno zobugcisa zamacandelo ahlukeneyo okusetyenziswa kunye neempawu zesakhiwo see-vias eziqhuba umbane, ikhonkco ngalinye liqulethe intsingiselo etyebileyo yobugcisa.
Ngenkqubela phambili eqhubekayo yetekhnoloji ye-elektroniki, njengophuhliso olukhawulezayo lwetekhnoloji entsha efana nobukrelekrele bokwenziwa, i-Intanethi yezinto, kunye nedatha enkulu, kuza kubekwa phambili iimfuno eziphezulu zokusebenza kunye nemisebenzi yee-PCB. Kwixesha elizayo, itekhnoloji ye-PCB iya kuphuhliswa ijolise kwicala loxinano oluphezulu, ukusebenza okuphezulu, iindleko eziphantsi, kunye nokukhuselwa okukhulu kokusingqongileyo, ikhuthaza ngokuqhubekayo ukwenziwa kwezinto ezincinci, ubukrelekrele, kunye nophuhliso oluphezulu lwezixhobo ze-elektroniki. Iinjineli ze-elektroniki kunye neengcali kumashishini anxulumene nazo kufuneka ziqwalasele ngokusondeleyo iindlela zophuhliso lwetekhnoloji ye-PCB, ziqhubeke ziphuhlisa kwaye ziphucule uyilo ukuze zihlangabezane neemfuno zemarike ezikhulayo kunye nemingeni yobugcisa.
Imibuzo Ebuzwa Rhoqo:
Umbuzo 1. Zeziphi izinto ze-substrate eziqhelekileyo ze-PCB eziqinileyo?
Izinto eziqhelekileyo ze-substrate ze-PCB eziqinileyo ziquka imicu yeglasi (njenge-E-glass, i-S-glass, njl.njl.), i-polyimide (PI), i-FR-4 (i-laminate egqunywe yi-copper-clad ethintela ilangabi eyenziwe yi-epoxy resin kunye nelaphu le-glass fiber), i-CEM-1 (i-laminate egqunywe yi-copper-clad equlathe i-glass mat kunye ne-paper base), kunye ne-CEM-3 (i-laminate egqunywe yi-copper-clad equlathe i-glass fiber core).
Umbuzo 2. Kutheni ii-PCB eziguquguqukayo zifanelekile kwizixhobo ezinxitywayo?
Ii-PCB eziguquguqukayo zifanelekile kwizixhobo ezinxitywayo kuba izinto zazo eziphambili ezifana ne-polyimide (PI), i-polyethylene terephthalate (PET), njl. zibenza babe nokuguquguquka okuhle, okubenza bakwazi ukugoba, ukugoba, nokujika ngaphakathi koluhlu oluthile, olunokulungela iimilo ezintsonkothileyo zezixhobo ezinxitywayo ezihambelana nomzimba womntu. Kwangaxeshanye, zikwanazo neempawu zokuba zincinci kwaye zilula, kwaye aziyi kubeka umthwalo omkhulu kumntu ozinxibileyo, zihlangabezana neemfuno zezixhobo ezinxitywayo ukuze kubekho indawo kunye nentuthuzelo.
Umbuzo 3. Zithini imisebenzi yendawo eqinileyo kunye nendawo eguquguqukayo kwi-PCB eqinileyo?
Kwindawo eqinileyo ye-PCB eqinileyo, izixhobo ze-substrate eziqinileyo ezifana neebhodi ze-FR-4 okanye ze-PI eziqinileyo zisetyenziswa kakhulu ukubonelela ngenkxaso yoomatshini kunye nokuzinza, ukuqinisekisa amandla olwakhiwo lwebhodi yesekethe ngexesha lokufakwa nokusetyenziswa. Kwelinye icala, indawo eguquguqukayo isebenzisa izixhobo ze-substrate eziguquguqukayo ezifana neefilimu eziguquguqukayo ze-PI ukufezekisa umsebenzi wokugoba, ukuze ivumelane notshintsho lwesimo sesixhobo kwiimeko ezahlukeneyo zokusetyenziswa kwaye ihlangabezane neemfuno zokusebenza okuntsonkothileyo koomatshini kunye nombane.
Umbuzo 4. Ngowuphi umahluko ophambili phakathi kwee-PCB ezimacala mabini kunye nee-PCB ezimacala mabini?
I-PCB enecala elinye ine-foil yobhedu kwicala elinye kuphela kwaye isetyenziselwa ukufakelwa kwentambo kwicala elinye. Ubunzima bayo besekethe buphantsi kakhulu, kwaye ifanelekile kwizixhobo ze-elektroniki ezilula. Inkqubo yokuvelisa ilula kwaye iindleko ziphantsi, kodwa imisebenzi yayo kunye nendawo yokufakelwa kwentambo zincinci. I-PCB enecala elinye ine-foil yobhedu kumacala omabini, kwaye unxibelelwano lombane phakathi kwamacala omabini lufezekiswa ngee-vias (ngokuqhelekileyo ii-vias ezenziwe ngesinyithi). Ubunzima besekethe buphakathi, kwaye bunokufezekisa imisebenzi emininzi ngoluhlu olubanzi lwezicelo, njengeebhodi zomama zekhompyutha, izixhobo zonxibelelwano, njl.
Umbuzo 5. Zithini imisebenzi yee-vias ezingaboniyo kunye nee-vias ezingcwatywe kwii-PCB ezininzi?
Ii-vias ezingaboniyo kwii-PCB ezineeleya ezininzi ziimingxuma eziqhuba umbane ezisuka kumphezulu ziye kumaleko athile angaphakathi kwaye azingeni kwibhodi yesekethe yonke. Zingasetyenziselwa uqhagamshelo lombane phakathi kweeleya ezithile, ukunciphisa ukuphazamiseka kwesignali kunye nokuphucula ukuthembeka kwesignali. Ii-vias ezingcwatywe zizixhumanisi phakathi kweeleya zangaphakathi kwaye azibonakali kumphezulu. Zinokufikelela kuqhagamshelo phakathi kweeleya ngaphandle kokuthatha indawo yomphezulu, nto leyo enceda ekufezekiseni iingcingo ezinoxinano oluphezulu kunye nokuphucula ukusebenza kunye nenqanaba lokudibanisa lebhodi yesekethe.
Umbuzo 6. Kutheni ii-PCB ezisebenzisa amaxesha amaninzi kufuneka zisebenzise izixhobo ezikhethekileyo?
Ii-PCB ezisebenzisa i-high-frequency zisetyenziswa kakhulu ekucubunguleni imiqondiso ye-high-frequency, njengee-microwave frequency bands kunye nee-millimeter-wave frequency bands, kwaye imiqondiso isengozini yokulahleka ngexesha lenkqubo yokudlulisela. Izixhobo ezikhethekileyo ezifana nezixhobo zeRogers, i-polytetrafluoroethylene (PTFE), kunye nezixhobo ezizaliswe yi-ceramic ziyasetyenziswa kuba ezi zixhobo zineempawu ze-low dielectric constant (Dk) kunye ne-low loss tangent (Df), ezinokunciphisa ngempumelelo ukulahleka kwesignali, ziqinisekise ukuthembeka kwesignali, kwaye zihlangabezane neemfuno zokudluliselwa kwesignali ye-high-frequency.
Umbuzo 7. Zeziphi izixhobo ze-elektroniki ezinamandla aphezulu ezifanelekileyo kwii-PCB ezisekwe kwisinyithi?
Ii-PCB ezisekwe kwisinyithi zifanelekile kwiindidi ezahlukeneyo zezixhobo ze-elektroniki ezinamandla aphezulu. Umzekelo, kwiimodyuli zamandla, ubushushu obuninzi buyaveliswa ngexesha lokusebenza, kwaye ii-PCB ezisekwe kwisinyithi zinokuwususa ubushushu ngokufanelekileyo ukuqinisekisa ukusebenza kwazo okuqhelekileyo. Kwizixhobo zokukhanyisa ze-LED, zinokuwususa ngokukhawuleza ubushushu obuveliswa zii-LED, ziphucule ukusebenza kakuhle kokukhanya kunye nobomi bezibane. Kwiisekethe zokuqhuba iimoto, zinokunceda ekususeni ubushushu obuveliswa ngexesha lokusebenza kweemoto, ziqinisekise ukusebenza okuzinzileyo kwesekethe.
Umbuzo 8. Zeziphi iimpawu zobugcisa eziphambili ze-HDI PCBs?
Iimpawu zobugcisa eziphambili ze-HDI PCB ziquka ukusetyenziswa kwee-tiny via diameters (Micro-Via, ezidla ngokuba ngaphantsi kwe-0.1mm), ezenziwe ngobuchwepheshe obuphambili obufana nokubhola nge-laser kunye nokukrola nge-plasma; ukuba nemigca emincinci (Fine Line), enokwenza i-fine wiring ibe nobubanzi bomgca/umgca ongaphantsi kwe-30μm/30μm; ukusebenzisa iteknoloji yokwakha ukuze kwandiswe inani leeleya kunye nokufezekisa unxibelelwano oluxineneyo; kunye nokuhambelana okuhle nenkqubo yokuhlanganisa iteknoloji yokukhwelisa umphezulu (SMT), efanelekileyo kwiimfuno zezixhobo ze-elektroniki ezincinci.
Umbuzo 9. Zeziphi iintlobo zeengqimba zetin ezingaphezulu ezisetyenziswa kwiiPCB ezitshizwa ngetin?
Iindidi zeeleya zetin ezingaphezulu zePCB ezitshizwa ngetin ziquka i-pure tin (Pure Tin), i-tin-lead alloy (Tin-Lead Alloy), kunye ne-tin-free lead spray, njenge-Sn-Cu (tin-copper alloy), i-Sn-Ag-Cu (tin-silver-copper alloy), njl. I-tin-free lead spray luhlobo oluye lwathandwa kancinci kancinci ukuze luhlangabezane neemfuno zokhuseleko lokusingqongileyo.
Umbuzo 10. Kutheni ii-PCB ezigqunywe ngegolide zisetyenziswa rhoqo kwizixhobo ze-elektroniki ezikumgangatho ophezulu?
IiPCB ezigqunywe ngegolide zihlala zisetyenziswa kwizixhobo ze-elektroniki eziphezulu kuba igolide yesinyithi egqume umphezulu wazo (ezahlulwe zibe yigolide eqinileyo negolide ethambileyo) inokubonelela ngombane oqhuba kakuhle, inciphise ukumelana nokuxinana, kwaye iqinisekise ukuthembeka konxibelelwano lombane. Kwangaxeshanye, igolide inamandla abalaseleyo okulwa ne-oxidation, anokumelana ngempumelelo nokugqwala kwendalo kunye nokugqwala kweekhemikhali, andise ubomi benkonzo yebhodi yesekethe, kwaye ahlangabezane neemfuno ezingqongqo zezixhobo ze-elektroniki eziphezulu ezifana neenqwelo moya, izixhobo zonyango, kunye nezikhululo zonxibelelwano zokuthembeka nokuzinza.
Umbuzo 11. Yintoni ekufuneka iqwalaselwe xa kugcinwa ii-PCB ze-OSP?
Ii-PCB ze-OSP ziphathwa ngefilimu yokugcina izinto ezidityanisiweyo ne-organic solderability. Ubomi bazo bokugcina bufutshane, kwaye kufuneka kuqwalaselwe ukuthintela ukufuma. Kufuneka zigcinwe kwindawo eyomileyo nengenamswakama ukuthintela ukungaphumeleli kwefilimu yokugcina izinto ezidityanisiweyo ne-organic solderability ngenxa yokufuma, okunokuchaphazela ukudityaniseka kwebhodi yesekethe. Kwangaxeshanye, kufuneka kuqwalaselwe nokucoca umphezulu ukuthintela uthuli kunye nokungcola ekungcoliseni umphezulu webhodi yesekethe, okunokuchaphazela ukusebenza kwe-welding kunye nokusetyenziswa okulandelayo.
Umbuzo 12. Zeziphi iimfuno zokusebenza ezinazo iibhodi zekhompyutha kwii-PCB?
Iibhodi zekhompyutha ezifana neebhodi ze-motherboard, amakhadi emizobo, kunye neebhodi zeseva zineemfuno zezakhono zokucubungula idatha kunye nokudlulisa idatha ngesantya esiphezulu see-PCB. Kufuneka zixhase iiprotokholi zokudlulisa isignali ngesantya esiphezulu ezifana nebhasi ye-PCI-E, ii-interfaces ze-USB, kunye nee-interfaces ze-SATA. Kufuneka zibe nokusebenza kakuhle kombane ukuqinisekisa ukuthembeka kwesignali kunye nozinzo. Ibhodi ye-motherboard kufuneka idibanise iindidi ezahlukeneyo zezinto ezibalulekileyo, ezifana ne-chipset, i-chip ye-BIOS, kunye nesekethe yokuhambisa umbane, njl.njl., nto leyo efuna ukuba i-PCB ibe noyilo olufanelekileyo kunye nenqanaba eliphezulu lokudibanisa. Iibhodi zeseva nazo kufuneka zixhase ii-CPU ezininzi kunye nememori enkulu, nto leyo ebeka iimfuno eziphezulu kumthamo wokuthwala kunye nokuthembeka kwe-PCB.
Umbuzo 13. Kutheni iibhodi zeemoto kufuneka zibe nokuthembeka okuphezulu?Iibhodi zeemoto zisetyenziswa kwiinkqubo ze-elektroniki zeemoto. Ngexesha lenkqubo yokuqhuba, izithuthi ziya kujongana neemeko ezahlukeneyo ezintsonkothileyo zokusingqongileyo, ezifana nokungcangcazela, impembelelo, kunye notshintsho kumaqondo obushushu aphezulu naphantsi (ngokuqhelekileyo kufuneka ukuba zisebenze ngokuqhelekileyo ngaphakathi kobubanzi bobushushu obuphakathi kwe--40°C ukuya kwi-125°C). Ukuba ibhodi yeemoto ayinakuthenjwa ngokwaneleyo, oku kunokukhokelela ekusileleni kwenkqubo ye-elektroniki yeemoto, okuchaphazela ukusebenza okuqhelekileyo kwesithuthi kunye nokhuseleko lokuqhuba. Ke ngoko, iibhodi zeemoto kufuneka zibe nokuthembeka okuphezulu ukuqinisekisa ukusebenza okuzinzileyo kwiindawo ezinzima.
Umbuzo 14. Yeyiphi indima edlalwa yi-IC substrate (ibhodi yokuthwala i-IC) ekupakisheni iitshiphusi?
I-substrate ye-IC (ibhodi yokuthwala i-IC) ngokuyintloko idlala indima yokudibanisa i-chip kunye nesekethe yangaphandle kwiphakheji ye-chip. Umzekelo, iindlela zokupakisha ezifana nokupakisha kwe-BGA (Ball Grid Array), ukupakisha kwe-QFN (Quad Flat No-Lead), kunye nokupakisha kwe-FC (Flip Chip) zonke kufuneka zifezekise uqhagamshelo oluthembekileyo nge-substrate ye-IC. Kufuneka ibe neempawu zokunxibelelana okuphezulu kunye nokuchaneka okuphezulu ukuze ihlangabezane neemfuno zenani elikhulu lokudluliselwa kwesignali phakathi kwe-chip kunye nesekethe yangaphandle. Kwangaxeshanye, ulawulo lokusasazwa kobushushu kunye nokusebenza kombane nako kufuneka kuqwalaselwe ukuqinisekisa ukuba ubushushu obuveliswayo ngexesha lokusebenza kwe-chip bunokusasazeka ngokufanelekileyo kwaye isignali inokusasazeka ngokuzinzileyo, ukuqinisekisa ukusebenza okuqhelekileyo kwe-chip.
Umbuzo 15. Zenziwa njani ii-micro-vias zeebhodi ze-micro-via?
Ii-micro-vias zeebhodi ze-micro-via zihlala zenziwe nge-laser drilling okanye iteknoloji ye-plasma etching. Ukubhola nge-laser kusebenzisa i-laser beam enamandla aphezulu ukukhanyisela ibhodi yesekethe, nto leyo ebangela ukuba izinto zitshise ngoko nangoko ukuze zenze ii-micro-vias. Kwelinye icala, ukubhola nge-plasma kusebenzisa i-plasma ukusabela ngokwekhemikhali kunye nezinto eziphezulu zebhodi yesekethe ukususa iindawo ezingafunekiyo, ngaloo ndlela kwakheka ii-diameters ezincinci, ezifana nee-micro-vias ezingaboniyo kunye nee-micro-vias ezingcwatyiweyo, njl.njl., ukuze kufezekiswe i-wiring enoxinano olukhulu.
