Ulawulo Oluchanekileyo Lobushushu Be-SMT Reflow Oven Ukuze Kuphuculwe Umgangatho Wokuwelda

Ngaba Unengxaki Yokulawula Ubushushu Be-Oven Ebuyayo Ngexesha Lokuvelisa? Lo Mgangatho Wokuseta Uza Kunceda

Kwinkqubo yokuvelisa i-SMT (Surface Mount Technology), ukuchaneka kolawulo lobushushu be-oven ephinda iphume kumisela ngokuthe ngqo umgangatho we-welding kunye nokusebenza kwemveliso ye-elektroniki. Nokuba ukuphambuka okuncinci kunokukhokelela kwiziphene ezifana namalungu e-solder abandayo, i-voids, okanye umonakalo wecandelo.

I-RICH FULL JOY Electronics, esekelwe kumava amaninzi okuvelisa i-PCBA kunye nobuchule bobuchwephesha, iphuhlise "i-Reflow Oven Temperature Profile Setting Standard," inika isikhokelo sesayensi, esicwangcisiweyo, nesisebenzayo sokulawula ubushushu be-oven ye-SMT reflow.

Isishwankathelo Esiqhelekileyo

Lo mgangatho usebenza kuzo zonke ii-ovens eziphinda zisetyenziswe kwi-workshop yethu ye-SMT, apho iinjineli ze-SMT ezingoochwephesha zinoxanduva lokuseta nokulawula iiprofayili zobushushu ukuqinisekisa ulawulo oluchanekileyo lobushushu ngexesha lokuwelda.

Ukulungiselela Izixhobo

Ukuze ulinganise ngokuchanekileyo kwaye usete iiprofayili zobushushu, kufuneka ezi zixhobo zilandelayo: Isivavanyi sePROFILE, iingcingo ze-thermocouple, iibhodi ze-PCB zokwenyani zokulinganisa, iiglavu zokukhusela, kunye neenkcukacha ze-solder paste.

Ukubeka iMigangatho

1. Isiseko seReferensi
Misela iiparameter ezifana nesantya sokunyuka, ubushushu bokufudumeza kwangaphambili, kunye nobushushu bokuphinda ubuye ngokusekelwe kwiimpawu zeepaste ezahlukeneyo ze-solder (umz., iipaste ze-solder ezingenalo i-lead, iipaste ze-solder ezine-lead).

2. Isiseko sokulinganisa
Iiprofayili zobushushu mazilinganiswe kwiibhodi zePCB zokwenyani ukuze zibonise ngokuchanekileyo imiphumo yeemeko zokwenyani zemveliso ekudluliseleni ubushushu.

3. Imigangatho Jikelele

·Isantya sokunyuka: 1–4℃/s

·Indawo yokuFudumeza kwangaphambili: 150–200℃, 60–120s

·Indawo Yokujika Komoya: ≥220℃ kwimizuzwana engama-30–60

·Ubushushu obuphezulu: 235–250℃

·Izinga lokuphola:

4. Iimfuno ezikhethekileyo
Lungisa iprofayili ngokuguquguqukayo ngokusekelwe kwingxelo yomgangatho wemveliso okanye ulandele ngokungqongqo iimfuno zabathengi ezenzelwe wena.

5.I-Glue Ukunyanga iiParameters
Ubushushu bokuncamathelisa iglu yi-120℃, ixesha lokuncamathelisa liphakathi kwemizuzwana engama-90-150, kwaye umda ophezulu yi-170℃.

Ukulumkela

1. Uvavanyo lwemihla ngemihla
Uvavanyo olupheleleyo lweprofayili yobushushu kufuneka lwenziwe kwaye lurekhodwe emva kokutshintsha kombane okanye umgca wemveliso yonke imihla.

2. Igunya lokusebenza
Iinjineli ze-SMT ezingoochwephesha kuphela ezigunyazisiweyo ukutshintsha useto lweprofayili yobushushu.

3. Ukuthobela iMigqaliselo yoMthengi
Misela ngokungqongqo iiparameter zenkqubo ngokweemfuno zokuphinda zisetyenziswe ngumthengi.

4. Ukugcinwa kwezixhobo
Yenza uvavanyo lokuhamba komoya kwinkqubo yokukhupha umoya kwi-oven ephinda iphume rhoqo emva kweenyanga ezintandathu, uqinisekise ukuba isebenza ngokuzinzileyo. Umahluko kumaqondo obushushu phakathi kweendawo akufuneki udlule kwi-70℃.

Isiphelo

Ngokusebenzisa i-"Reflow Oven Temperature Profile Setting Standard," i-RICH FULL JOY Electronics iqinisekisa ukuwelda kwe-SMT esemgangathweni ophezulu, iphucula ukuthembeka kwemveliso kunye nokusebenza kwemveliso, kwaye inceda abathengi ukuba bakhawulezise ixesha lokuthengisa kunye nokufumana iingenelo zokukhuphisana.