Umhlahlandlela Wokuklama Nokucubungula Iminwe Yegolide ye-PCB
I-Gold Finger PCB uhlobo olukhethekile lwebhodi lesifunda eliphrintiwe, elivame ukusetshenziswa ezinhlelweni zokusebenza ezidinga ukuthembeka okuphezulu kanye nokumelana nokuguguleka, njengamabhodi e-computer, amakhadi ehluzo kanye namanye amadivayisi kagesi. Lesi sihloko sizogxila encazelweni, izindlela zokwelapha ubuso kanye nokucabangela ukwakheka kwama-PCB eminwe yegolide.
Uhla Lwezihloko
Ⅰ. Incazelo Yomunwe Wegolide
II. Izindlela zokuqeda ubuso be-PCB yeminwe yegolide
III. Izinyathelo Zokuqapha Ngomklamo Weminwe Yegolide
IV. Izinyathelo Zokuqapha Zokucubungula Iminwe Yegolide
Imibuzo nezimpendulo ezivame ukubuzwa
1. Incazelo Yomunwe Wegolide
Umunwe wegolide, owaziwa nangokuthi isixhumi esinqenqemeni, uyidivayisi efaka umkhawulo owodwa we-PCB endaweni yokuxhuma. Isebenzisa amaphini okuxhuma njengendlela yokukhipha uxhumano lwangaphandle lwe-PCB ukuze kufezwe ukuhanjiswa kwamandla phakathi kwephedi yokushintshanisa noma ishidi lethusi kanye namaphini okuma ahambisanayo. Ukuze kwandiswe ukuhanjiswa kwamandla ayo, ukumelana nokushiswa kwamandla kanye nokumelana nokuguguleka, iminwe yegolide ivame ukuphathwa nge-nickel gold plating noma i-ENIG. Ngenxa yokuma kwayo okufana nomunwe, ibizwa ngokuthi i-Gold Finger.
2. Izindlela zokuqeda ubuso be-PCB zeminwe yegolide
Indlela yokuqeda ubuso be-Gold Finger PCB ibalulekile ekusebenzeni kwayo kanye nasezindaweni zokusetshenziswa. Nazi izindlela ezimbili ezivamile:
1) Ukufakwa Kwegolide Le-Nickel
I-Nickel gold plating iyindlela evamile yokuqeda ubuso, futhi ubukhulu bayo bungafinyelela amasentimitha angu-3-50. Ine-conductivity enhle kakhulu, ukumelana ne-oxidation kanye nokumelana nokuguguleka, ngakho-ke isetshenziswa kabanzi kuma-PCB eminwe yegolide adinga ukufakwa nokususwa njalo noma ama-PCB adinga ukungqubuzana okuvamile komshini. Kodwa-ke, ngenxa yezindleko eziphezulu zegolide, i-nickel gold plating ivame ukusetshenziswa kuphela ekwelapheni izindawo zasendaweni njengeminwe yegolide. Ubuso bale ndlela yokuqeda ubuso bumhlophe ngesiliva, kodwa ukushintshwa kwayo kuphansi kancane.
2) NGIYAVUMA
I-ENIG ingenye indlela evamile yokuqeda ubuso, enobukhulu obuvame ukuba yi-1 micro inch kanye nama-micro ama-intshi ama-3. I-ENIG inomoya omuhle kakhulu, ukushelela kobuso kanye nokukwazi ukunamathela, okwenza isetshenziswe kabanzi kuma-PCB anembe kakhulu anemiklamo efana ne-keyway, i-bound IC, i-BGA, njll. Kuma-PCB eminwe yegolide angadingi ukumelana nokuguguleka okuphezulu, inqubo yonke yephaneli ye-ENIG nayo ingakhethwa, enezindleko eziphansi kakhulu. Ubuso be-ENIG eqediwe buphuzi ngegolide.
3. Izinyathelo Zokuqapha Ngomklamo Weminwe Yegoliden
Lapho uklama i-PCB yeminwe yegolide, kunamaphuzu athile abalulekile okudingeka aqashelwe ngokukhethekile:
1) Ukumelana nokugqokwa komunwe wegolide
Kuma-PCB adinga ukufakwa nokususwa njalo, ukuze kwandiswe ukumelana nokuguguleka kweminwe yegolide, ngokuvamile kuyadingeka ukusebenzisa i-electroplating yegolide eqinile.
2) Ukuqhekeka komunwe wegolide
Iminwe yegolide ivame ukudinga ukuchezulwa, nge-engeli ejwayelekile yokuchezulwa engu-45°. Ukuba khona kwama-chamfer kunganciphisa izingozi ezingaba khona, njengoba kuboniswe esithombeni.
3) Ukuvulwa kwefasitela lemaski yokubopha
Iphedi yokusoda yomunwe wegolide idinga ukuphathwa ngokuvula ifasitela lebhulokhi lonke lemaski yokusoda, ngaphandle kwesidingo se-mesh yensimbi.
4) Ibanga phakathi kwemaski yokubopha kanye nomunwe wegolide
Ibanga eliphakathi kwephedi yokubopha kanye nomunwe wegolide kudingeka lihambisane nemininingwane yomklamo, ngokuvamile lidinga ukuthi iphedi yokubopha ibe okungenani yi-1mm ukusuka endaweni yomunwe wegolide, kufaka phakathi namaphedi okubopha.
5) Ukuphela kobuso bomunwe wegolide
Ubuso bomunwe wegolide akufanele bumbozwe ngethusi.
6) Ukwelashwa kokusika ithusi
Zonke izendlalelo zesendlalelo sangaphakathi somunwe wegolide zidinga ukwelashwa kokusikwa kwethusi, ngokuvamile ngobubanzi bokusika kwethusi obungaba ngu-3mm. Lokhu kunganciphisa umehluko wokungangeni phakathi komunwe wegolide nomugqa wokungangeni, kuyilapho futhi kusiza i-ESD.
Lokhu okungenhla kunezici eziningana ezidinga ukunakwa okukhethekile lapho kuklanywa i-PCB yeminwe yegolide ukuqinisekisa ukuthembeka nokusebenza komunwe wegolide.
4. Izinyathelo Zokuqapha Zokucubungula Iminwe Yegolide
Uma uhlela ukusebenzisa i-gold finger PCB, okulandelayo ezinye zezinyathelo okufanele zithathwe ngesikhathi kucutshungulwa i-Rich Full Joy's PCB:
1. Ububanzi bokujiya kwe-PCB obungagoqwa bungu-1.2mm kuya ku-2.4mm. Ama-PCB anobukhulu obungekho ngaphakathi kwalolu bubanzi awakwazi ukugoqwa.
2. Ukujula kanye ne-engeli yomphetho ogobile ngokuvamile kuphakathi kuka-20° no-45°. Ibanga phakathi komunwe wegolide nomphetho we-PCB kufanele lanele, ngokuvamile kunconywa ukuthi libe ngu-0.6m kuya ku-1.5mm, ukuze kugwenywe ukulimaza umunwe wegolide.
I-Rich Full Joy igxile ekucubunguleni ama-PCB eminwe yegolide ukuqinisekisa ikhwalithi ephezulu nokuthembeka. Inqubo yethu ingahlangabezana nezidingo ezahlukene zomklamo futhi inikeze ukusebenza okuhle kakhulu kwephrojekthi yakho.
Ama-PCB eminwe yegolide adlala indima ebalulekile emkhakheni we-elekthronikhi wesimanje, futhi ukuthembeka kwawo nokusebenza kwawo kuncike ezindleleni zokuqeda ubuso kanye nemininingwane yokuklama. Ngokukhetha izindlela zokucubungula ezifanele nokunaka izinto ezibalulekile zokuklama, kungenzeka ukuqinisekisa ukusebenza okuhle kakhulu kwama-PCB eminwe yegolide ezinhlelweni ezahlukahlukene. Uma udinga izinsizakalo zokucubungula i-PCB yeminwe yegolide esezingeni eliphezulu, sicela ucabangele i-Ruizhi Xinfeng, futhi sizojabula ukukunikeza ukwesekwa.
Imibuzo Nezimpendulo
1. Iyini i-Gold Finger PCB?
I-Gold finger PCB uhlobo olukhethekile lwebhodi lesifunda eliphrintiwe, elivame ukusetshenziswa ezinhlelweni ze-elekthronikhi ezidinga ukuthembeka okuphezulu kanye nokumelana nokuguguleka, eliqanjwe ngesimo salo esifana nomunwe.
2. Yiziphi izindlela zokuqeda ubuso ze-PCB yeminwe yegolide?
Izindlela ezivamile zokuqeda ubuso ze-PCB zeminwe yegolide zifaka phakathi i-electroplating yegolide le-nickel kanye ne-ENIG, ezinezinzuzo ezahlukene kanye nokusebenza kwazo.
3. Ungakwandisa kanjani ukumelana nokuguguleka komunwe wegolide?
Ukuze kwandiswe ukumelana nokuguguleka kweminwe yegolide, ngokuvamile kuyadingeka ukusebenzisa i-electroplating yegolide eliqinile ukuze kuthuthukiswe ubulukhuni bayo bomphezulu.
4. Yiziphi izinyathelo zokuphepha okufanele zithathwe lapho kuklanywa i-PCB yeminwe yegolide?
Uma uklama i-PCB yeminwe yegolide, kubalulekile ukunaka izinkinga ezibalulekile ezifana nokusika, ukuvulwa kwamafasitela emaski ye-solder, ibanga phakathi kwama-solder pads neminwe yegolide, kanye nokuqedwa kobuso beminwe yegolide.
5. Ungaqinisekisa kanjani ikhwalithi ye-PCB yeminwe yegolide?
Sisebenzisa ubuchwepheshe obuthuthukisiwe kanye nokulawula ikhwalithi okuqinile ukuqinisekisa ukuhlinzekwa kwemikhiqizo esezingeni eliphezulu nethembekile.
