Ibhodi Eliqinile Eliguquguqukayo
Ubuchwepheshe Obuthuthukisiwe Obusebenza Kakhulu kanye Nesixazululo Esiphelele.
Izinzuzo zeBhodi Eliqinile Eliguquguqukayo
Kulezi zinsuku, ukuklama kuya ngokuya kuphishekela ukwenziwa kube lula, izindleko eziphansi kanye nesivinini esikhulu semikhiqizo, ikakhulukazi emakethe yamadivayisi eselula, okuvame ukuhilela amasekethe kagesi anabantu abaningi. Ukusebenzisa amabhodi e-Rigid-Flex kuzoba ukukhetha okuhle kakhulu kwamadivayisi angaphandle axhunywe nge-IO. Izinzuzo eziyisikhombisa ezinkulu ezilethwa yizidingo zokuklama zokuhlanganisa izinto zebhodi eziguquguqukayo nezinto zebhodi eqinile enkambisweni yokukhiqiza, ukuhlanganisa izinto ezimbili ze-substrate ne-prepreg, bese kufinyelela uxhumano lukagesi oluphakathi kwezingqimba zama-conductor ngokusebenzisa izimbobo noma ama-vias angaboni/angcwatshwe yilezi ezilandelayo:
Ukuhlanganiswa kwe-3D ukunciphisa amasekethe
Ukuthembeka kokuxhumeka okungcono
Nciphisa inani lezingxenye nezingxenye
Ukungaguquguquki okungcono kwe-impedance
Ingaklama isakhiwo sokubeka esiyinkimbinkimbi kakhulu
Sebenzisa umklamo wokubukeka olula kakhulu
Yehlisa usayizi
I-rigid-flex ibhodi ehlanganisa ukuqina nokuguquguquka, icubungula kokubili ukuqina kwebhodi eqinile kanye nokuguquguquka kwebhodi eguquguqukayo.
I-Semi-FPC
Imephu Yomgwaqo Wamakhono
| Into | I-Flex - Iqinile | I-Regal | I-Semi-Flex |
| Umfanekiso |  |  |  |
| Izinto Eziguquguqukayo | I-Polyimide | I-FR4 + I-Coverlay (i-Polyimide) | FR4 |
| Ubukhulu obuguquguqukayo | 0.025~0.1mm (Akubandakanyi ithusi) | 0.05~0.1mm (Akubandakanyi ithusi) | Ubukhulu Obusele: 0.25+/‐0.05mm (Izinto Ezinikezelwe: EM825(I)) |
| I-engeli yokugoba | Ubuningi obungu-180° | Ubuningi obungu-180° | Ubuningi obungu-180°(Isendlalelo esiguquguqukayo≤2) Ubuningi obungu-90°(Isendlalelo esiguquguqukayo>2) |
| Ukukhuthazela Okuguquguqukayo; IPC‐TM‐650, Indlela 2.4.3. | | |
LOKHO | |
| Ukuhlolwa Kokugoba; 1) Ububanzi be-Mandrel: 6.25mm | |||
| Isicelo | I-Flex yokufaka kanye ne-Dynamic (Uhlangothi olulodwa) | I-Flex yokufaka | I-Flex yokufaka |
| Ukuqedwa Komphezulu | Inani Elijwayelekile | Umhlinzeki | |
| UMnyango Womlilo Wokuzithandela |  | 0.2~0.6um;0.2~0.35um | I-Enthone Shikoku chemical |
| NGIYAVUMA |  | Noma:0.03~0.12um, Ingabe:2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENIG ekhethiwe |  | Noma:0.03~0.12um, Ingabe:2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENEPIC |  | I-Au: 0.05~0.125um, i-Pd: 0.05~0.125um, i-Ni:5~10um | Chuang Zhi |
| Igolide Eliqinile |  | Au:0.2~1.5um, Ni: ubuncane 2.5um | Umkhokhi |
| Igolide Elithambile |  | Au:0.15~0.5um, Ni:min 2.5um | INHLANZI |
| Ithini Lokucwilisa |  | Ubuncane: 1um | Ubuchwepheshe be-Enthone / ATO |
| Isiliva Sokucwiliswa |  | 0.15~0.45um | I-Macdermid |
| I-HASL (OS) engena-lead ne-HASL (OS) |  | 1 ~ 25um | I-Nihon Superior |
Uhlobo lwe-Au/Ni
● I-Gold plating ingahlukaniswa ibe yigolide elincane kanye negolide elijiyile ngokwe-thickness. Ngokuvamile, igolide elingaphansi kuka-4u”(0.41um) libizwa ngegolide elincane, kanti igolide elingaphezu kuka-4u” libizwa ngegolide elijiyile. I-ENIG ingenza igolide elincane kuphela, hhayi igolide elijiyile. I-Gold plating kuphela engenza igolide elincane nelijiyile. Ubukhulu obukhulu begolide elijiyile ebhodini eliguquguqukayo bungaba ngaphezu kuka-40u”. Igolide elijiyile lisetshenziswa kakhulu ezindaweni zokusebenza ezinezidingo zokubopha noma zokumelana nokuguguleka.
● Igolide elicwebezelayo lingahlukaniswa libe yigolide elithambile negolide eliqinile ngohlobo. Igolide elithambile liyigolide elihlanzekile elivamile, kanti igolide eliqinile liyigolide eliqukethe i-cobalt. Kungenxa yokuthi i-cobalt yengezwe ukuthi ubulukhuni besendlalelo segolide bukhula kakhulu budlula i-150HV ukuze kuhlangatshezwane nezidingo zokumelana nokuguguleka.
| Uhlobo Lwezinto | Izakhiwo | Umhlinzeki | |
| Izinto Eziqinile | Ukulahlekelwa Okuvamile | DK>4.2, DF>0.02 | I-NanYa / EMC / TUC / ITEQ / ShengYi / Isola / Doosan njll. |
| Ukulahlekelwa Okuphakathi | DK>4.1, DF:0.015~0.02 | I-NanYa / EMC / TUC / ITEQ njll. | |
| Ukulahlekelwa Okuphansi | I-DK:3.8~4.1, DF:0.008~0.015 | I-EMC / NanYa / TUC / Isola / Panasonic njll. | |
| Ukulahlekelwa Okuphansi Kakhulu | I-DK:3.0~3.8, DF:0.004~0.008 | I-EMC / Panasonic / Rogers / TUC / Isola / ITEQ / NanYa njll. | |
| Ukulahlekelwa Okuphansi Kakhulu | I-DK | Rogers / TUC / ITEQ / Panasonic / Isola njll. | |
| I-BT | Umbala: Omhlophe / Omnyama | MGC / Hitachi / NanYa / ShengYi njll. | |
| I-Copper Foil | Okujwayelekile | Ubulukhuni (RZ) = 6.34um | NanYa, KB, LCY |
| I-RTF | Ubulukhuni(RZ)=3.08um | NanYa, KB, LCY | |
| I-VLP | Ubulukhuni(RZ)=2.11um | I-MITSUI, i-Circuit Foil | |
| I-HVLP | Ubulukhuni(RZ)=1.74um | I-MITSUI, i-Circuit Foil | |
| Uhlobo Lwezinto | I-DK/DF evamile | I-DK/DF ephansi | |||
| Izakhiwo | Umhlinzeki | Izakhiwo | Umhlinzeki | ||
| Izinto Eziguquguqukayo | I-FCCL (Nge-ED kanye ne-RA) | I-Polyimide Ejwayelekile DK:3.0~3.3 DF:0.006~0.009 | I-Thinflex / i-Panasonic / i-Taiflex | I-DK ye-Polyimide eguquliwe:2.8~3.0 DF:0.003~0.007 | I-Thinflex / Taiflex |
| Isembozo (Esimnyama/Esiphuzi) | I-Adhesive DK Ejwayelekile: 3.3~3.6 Df: 0.01~0.018 | I-Taiflex / Dupont | I-Adhesive Eguquliwe DK:2.8~3.0 DF:0.003~0.006 | I-Taiflex / i-Arisawa | |
| I-Bond‐film (Ubukhulu: 15/25/40 um) | I-Epoxy DK evamile: 3.6~4.0 DF: 0.06 | I-Taiflex / Dupont | I-Epoxy Eguquliwe DK:2.4~2.8 DF:0.003~0.005 | I-Taiflex / i-Arisawa | |
| Uyinki we-S/M | Imaski yomthengisi; Umbala: Oluhlaza okwesibhakabhaka / Omnyama / Omhlophe / Ophuzi / Obomvu | I-Epoxy Ejwayelekile DK:4.1 DF:0.031 | I-Taiyo / OTC / AMC | I-Epoxy Eguquliwe DK:3.2 DF:0.014 | I-Taiyo |
| Uyinki wenganekwane | Umbala Wesikrini: Omnyama / Omhlophe / Ophuzi Umbala we-Inkjet: Omhlophe | I-AMC | |||
| Ezinye Izinto Zokusebenza | I-IMS | Izingxenyana Zensimbi Ezifakwe Ukushisa (ezine-Al noma i-Cu) | I-EMC / i-Ventec | ||
| Ukushisa Okuphezulu Okushisayo | 1.0 / 1.6 / 2.2 (W/M*K) | I-ShengYi / Ventec | |||
| Mina | I-foil yesiliva (SF‐PC6000‐U1 / SF‐PC8600‐C) | Tatsuta | |||
Izinto Ezisheshayo Nezimvamisa Eziphezulu (Eziguquguqukayo)
| I-DK | Df | Uhlobo Lwezinto | |
| I-FCCL (i-Polyimide) | 3.0~3.3 | 0.006~0.009 | Uchungechunge lwe-Panasonic R‐775; Uchungechunge lwe-Thinflex A; Uchungechunge lwe-Thinflex W; Uchungechunge lwe-Taiflex 2up |
| I-FCCL (i-Polyimide) | 2.8~3.0 | 0.003~0.007 | Uchungechunge lwe-Thinflex LK; uchungechunge lwe-Taiflex 2FPK |
| I-FCCL (LCP) | 2.8~3.0 | 0.002 | Uchungechunge lwe-Thinflex LC; uchungechunge lwe-Panasonic R‐705T se; uchungechunge lwe-Taiflex 2CPK |
| Isembozo | 3.3~3.6 | 0.01~0.018 | Uchungechunge lwe-Dupont FR; uchungechunge lwe-Taiflex FGA; uchungechunge lwe-Taiflex FHB; uchungechunge lwe-Taiflex FHK |
| Isembozo | 2.8~3.0 | 0.003~0.006 | Uchungechunge lwe-Arisawa C23; uchungechunge lwe-Taiflex FXU |
| Ishidi Lokubopha | 3.6~4.0 | 0.06 | Uchungechunge lwe-Taiflex BT; uchungechunge lwe-Dupont FR |
| Ishidi Lokubopha | 2.4~2.8 | 0.003~0.005 | Uchungechunge lwe-Arisawa A23F; uchungechunge lwe-Taiflex BHF |
Ubuchwepheshe Bokubhoboza Emuva
● Imikhondo ye-microstrip akufanele ibe nama-via, kumele ihlolwe kusukela ohlangothini lomkhondo.
● Umkhondo ohlangothini lwesibili kufanele uhlolwe kusukela ohlangothini lwesibili (Uhlangothi lokuqalisa kufanele lube kulolo hlangothi).
● Umklamo omuhle ukuthi imikhondo ye-stripline kufanele ihlolwe kunoma yiluphi uhlangothi olunciphisa kakhulu i-via stub.
● Imiphumela emihle kakhulu ye-stripline izotholakala ngokusebenzisa ama-vias amafushane afakwe i-backdrilled.
Isicelo Somkhiqizo: Inzwa yeradar yezimoto
Imininingwane Yomkhiqizo:
I-PCB enezingqimba ezi-4 enezinto ezihlanganisiwe (i-Hydrocarbon + i-FR4 ejwayelekile)
Ukuhlanganiswa: 4L HDI / Asymmetric
Inselele:
Izinto ezivame kakhulu ezine-Standard FR4 Lamination
Ukubhola okujulile okulawulwayo
Isicelo Somkhiqizo: Inzwa yeradar yezimoto
Imininingwane Yomkhiqizo:
I-PCB enezingqimba ezi-4 enezinto ezihlanganisiwe (i-Hydrocarbon + i-FR4 ejwayelekile)
Ukuhlanganiswa: 4L HDI / Asymmetric
Inselele:
Izinto ezivame kakhulu ezine-Standard FR4 Lamination
Ukubhola okujulile okulawulwayo
Isicelo Somkhiqizo:
Isiteshi sesisekelo
Imininingwane Yomkhiqizo:
Izendlalelo ezingu-30 (Izinto ezifanayo)
Ukuqongelela: Inani lezingqimba eziphezulu / Ukulingana
Inselele:
Ukubhaliswa kwezendlalelo ngayinye
Isilinganiso esiphezulu se-PTH
Ipharamitha ye-Critical lamination
Isicelo Somkhiqizo:
Inkumbulo
Imininingwane Yomkhiqizo:
Ukuqongelela: Izingqimba eziyi-16 Noma yimuphi ungqimba
Ukuhlolwa kwe-IST: Isimo: 25‐190℃ Isikhathi: 3 min, 190‐25℃ Isikhathi: 2 min, 1500 Cycles. Izinga lokushintsha kokumelana≤10%, Indlela yokuhlola: IPC‐TM650‐2.6.26. Umphumela: Ukuphumelela.
Inselele:
Ukulamina izikhathi ezingaphezu kweziyisithupha
Ukunemba kwe-laser vias
Isicelo Somkhiqizo:
Inkumbulo
Imininingwane Yomkhiqizo:
I-Stack up: Umgodi
Izinto: I-FR4 ejwayelekile
Inselele:
Ukusebenzisa ubuchwepheshe be-De‐cap ku-Rigid PCB
Ukubhaliswa phakathi kwezingqimba
Ukucindezelwa okuncane endaweni yesitebhisi
Inqubo ebalulekile yokumboza i-G/F
Isicelo Somkhiqizo:
Imojuli Yekhamera / Incwadi Yamanothi
Imininingwane Yomkhiqizo:
I-Stack up: Umgodi
Izinto: I-FR4 ejwayelekile
Inselele:
Ukusebenzisa ubuchwepheshe be-De‐cap ku-Rigid PCB
Uhlelo lwe-laser olubucayi kanye namapharamitha enqubweni ye-De-cap
Isicelo Somkhiqizo:
Izibani zezimoto
Imininingwane Yomkhiqizo:
Iqoqo: IMS / Isinki Sokushisa
Izinto: Insimbi + Iglue/Ukulungiselela Ngaphambi Kokuqala + I-PCB
Inselele:
Isisekelo se-aluminium kanye nesisekelo sethusi (ungqimba olulodwa)
Ukuqhuba kwe-thermal
I-FR4+ Glue/Prepreg + Al lamination
Izinzuzo:
Ukushabalalisa Ukushisa Okukhulu
Imininingwane Yomkhiqizo:
Izinto zesivinini esiphezulu (Ezifanayo)
Iqoqo: Uhlamvu lwemali yethusi olufakiwe / oluhambisanayo
Inselele:
Ukunemba kobukhulu bezinhlamvu zemali
Ukunemba kokuvulwa kwe-lamination
Ukugeleza kwe-resin okubucayi
Isicelo Somkhiqizo:
Isiteshi sezimoto / sezimboni / sesisekelo
Imininingwane Yomkhiqizo:
Isisekelo sethusi sesendlalelo sangaphakathi esingu-6OZ
Isisekelo sethusi esingaphandle esingu-3OZ/6OZ Sihlanganisiwe:
Isisindo sethusi esingu-6OZ esendlalelo sangaphakathi
Inselele:
Isikhala sethusi esingu-6OZ sigcwaliswe ngokugcwele nge-epoxy
Akukho ukukhukhuleka ekucutshungulweni kwe-lamination
Isicelo Somkhiqizo:
Ifoni ehlakaniphile / Ikhadi le-SD / i-SSD
Imininingwane Yomkhiqizo:
I-Stack up: HDI / Anylayer
Izinto: I-FR4 ejwayelekile
Inselele:
I-foil ye-Cu ephansi kakhulu/i-RTF
Ukufana kwe-Plating
Ifilimu eyomile enesisombululo esiphezulu
Ukuvezwa kwe-LDI (Isithombe Esiqondile Se-Laser)
Isicelo Somkhiqizo:
Ukuxhumana / Ikhadi le-SD / Imodyuli Yokubona
Imininingwane Yomkhiqizo:
I-Stack up: HDI / Anylayer
Izinto: I-FR4 ejwayelekile
Inselele:
Akukho sikhala emaphethelweni omunwe lapho i-PCB icutshungulwa ngegolide elicwebezelayo
Ifilimu ekhethekile yokumelana
Isicelo Somkhiqizo:
Izimboni
Imininingwane Yomkhiqizo:
I-Stack up: I-Rigid-Flex
Ngino-Eccobond ku-Rigid-Flex transformation
Inselele:
Isivinini esibucayi sokuhamba kanye nokujula komgodi
Ipharamitha yokucindezela komoya okubucayi