Ukukhiqizwa kwe-PCB kanye ne-PCBA
I-workshop
Hlola izindawo zethu zokukhiqiza zesimanje kanye nezinqubo zokukhiqiza ezithuthukisiwe
Uhlu Lwemishini Yokukhiqiza ye-PCB
Imishini yokukhiqiza engaphezu kuka-200 enembile kakhulu, okuhlanganisa imishini yokubhoboza engu-50 enezingqimba eziyisithupha, imishini yokubhoboza nge-laser engu-10, kanye nemishini engu-20 ye-AOI, enikeza umugqa wokukhiqiza ozenzakalelayo ngokuphelele.
I/L — Ukufanekisa Izendlalelo Zangaphakathi kanye ne-AOI
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| Ukuhlanza kwangaphambili (inki) | I-Orbotech, Schmid | 3 | Hlanza amaphaneli angaphakathi ngaphambi kokumboza |
| I-Roller Coater (Eqondile) | Schmid, KCE | 2 | Ukugqoka okuqondile kwe-photoresist |
| I-Roller Coater (Evundlile) | Schmid, KCE | 1 | Ukumbozwa okuvundlile/ukuvinjelwa kwe-photoresist |
| I-DES (Develop/Etch/Strip) | I-Atotech, Manz, HOYA, YangBo (TW) | 3 | Ukuthuthukiswa kwengqimba yangaphakathi–ukuqopha–umcu |
| Ukuvezwa Okuzenzakalelayo (inki) | I-Orbotech, i-Maskless Lithography, Isikrini | 5 | Ukuvezwa okuzenzakalelayo kwezingqimba zangaphakathi |
| Ukuvezwa Ngesandla | I-Colight, i-OLEC | 1 | Ukuchayeka ngesandla kwezindawo ezincane/izibonelo |
| Ukutholwa kwe-I/L AOI | I-Orbotech | 6 | Ukutholwa kwesici se-AOI esendlalelo sangaphakathi |
| Isiteshi Sokuvuselela i-V-Smart | I-Orbotech | 5 | Ukuqinisekiswa/ukulungiswa kabusha kwamaphutha e-AOI ngesandla |
| I/L AOI Spiron | I-Orbotech | 3 | Isibuyekezo se-AOI + esihlanganisiwe sesendlalelo sangaphakathi |
| I/L AOI Inspire | I-Orbotech | 1 | I-AOI engaphakathi enembile kakhulu |
| I-OPE (Isibhakela Esingaphakathi) | I-LPKF, iSchmoll, iMitsubishi | 2 | Ukufaka amathuluzi/ukubhoboza ukubhaliswa kwe-lamination |
Cindezela — I-Lamination kanye ne-Oxide Ensundu
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| I-Oxide Ensundu Evundlile ye-Bondfilm | ChuangKe, DengTai | 2 | Ukulungisa ubuso ngaphambi kokubopha |
| Ukucindezela Okuvamile (Okushisayo Okubili + Okubandayo Oku-1) | I-HuoQuan | 2 | Ukuvikela |
| I-Electronical Press (ADARA 48 / 73) | I-CEDATE (e-Italy) | 4 | Ukuvikela ngokunemba |
| I-RBM Thermal Fusion (Hot-Melt) | I-HuoQuan; MuNuo | 4+2, 12 | Usizo lokugeleza kwe-resin |
| Ukubeka Okuzenzakalelayo/Ngesandla (I-Stacker) | I-CEDATE (e-Italy) | 4 | Ukubekwa kwe-lamination |
| Isisiki Esizenzakalelayo se-PP | I-ZhengYe | 4 | Ukusika kwangaphambilini kwe-PP |
| Ukubhoboza nge-X-ray (Amathuluzi) | I-DeLiFu; HaoShuo | 4 | Ukubhalisa kanye nokubhoboza okuqondiwe |
| Ukuhlolwa kwe-X-ray | I-Aisida | 2 | Ukuqinisekiswa kokubhaliswa ngemuva kokucindezelwa |
I-RF — I-Rigid-Flex Lamination kanye ne-Flex Core
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| I-Regal-Flex Press | — | 10 | I-lamination eqinile neguquguqukayo |
| I-PLASMA (ye-Regal-Flex) | — | 2 | Ukusebenza komphezulu kokunamathela kwe-flex |
| Isihlanzi Sepuleti Lensimbi | — | 2 | Amapuleti e-lamination ahlanzekile |
| Ukusika nge-UV Laser | — | 2 | Ukusika uhlaka olugobile/olumboziwe |
| Umsiki we-Flex-Core | — | 2 | Ukusika okugobile kwe-core |
| Ihhavini Eliqondile | — | 2 | Ukubhaka/ukulungisa okuguquguqukayo |
| I-Laminator Encane Kakhulu | — | 2 | Ukufakwa kwefilimu eyomile okunomongo omncane |
Ukubhoboza — Okwemishini kanye Ne-Laser
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| I-Laser Drill (5Z00U / ML605GTW5) | I-Mitsubishi | 20 | Ukubhoboza nge-laser ye-Microvia |
| Ama-drill emishini anezinti eziyisithupha | I-Hitachi; LongZe; I-DongTai; DaLiang | 150+ | Ukubhoboza ngesivinini esikhulu |
| Ama-Drill Omshini Osebenzisa I-spindle Emibili | XueLong; HuaJian; DaLiang | 8 | Imodeli kanye nokubhoboza endaweni encane |
| Iskena Sendawo Yembobo (CPK) | I-MACHVISION | 2 | Ukuhlolwa kokubhaliswa kwe-drill |
| Isigayo/Isipolishi Somphezulu Esizenzakalelayo | I-ChengZhong (CDZ550) | 12 | Ukulungiswa kokususa i-burr kanye nokulungiswa kwendawo |
Umzila
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| Umshini Wokuhambisa | I-YOWSUN | 12 | Umzila wephrofayela |
| Umshini Wokugoba | — | 4 | Ukukhanya komphetho |
| Umshini Wokushaya | — | 6 | Ukususa amaphaneli |
Ukuhlolwa Kukagesi (ET)
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| Isivivinyo Sokuhlola Ukundiza | I-ATG | 6 | Ukuhlolwa kokuqhubeka kukagesi kanye nokuhlukaniswa |
| Isivivinyo Sezinzipho Zombhede | — | 10 | Ukuhlolwa kokukhiqizwa ngobuningi |
Ukuhlolwa Kokugcina Kokubona (FV)
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| Iziteshi Zokuhlola Okubonakalayo | Ngaphakathi | 40 | Umkhiqizo wokugcina we-QC |
| Izikhulisi | — | 20 | Ukuhlolwa kwesici esihle |
Igumbi Lamafilimu
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| I-Laser Photoplotter | I-Orbotech | 2 | Ukukhishwa kwefilimu |
| Ikhabhinethi Yokugcina Amafilimu | — | 5 | Ukuphathwa kwefilimu okuphephile |
I-FPC (i-Flexible PCB)
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| I-Coverlay Laminator | I-Hitachi | 3 | I-lamination ye-FPC coverlay |
| Umshini Wokusika we-PI | — | 2 | Ukusika kwe-polyimide |
| Ukubhoboza nge-Laser kwe-FPC | — | 2 | Ukubhoboza nge-microvia ukuze ugobe |
I-QA (Ukuqinisekiswa Kwekhwalithi / Ilebhu)
| Igama lesiNgisi | Umthengisi(abathengisi) | Ubuningi | Inhloso |
|---|---|---|---|
| Izinhlelo Zokulinganisa ze-2D/3D | I-OPTEK; ZhengYe | 1 (2D), 1 (isithombe esizenzakalelayo) | Ukuhlolwa kobukhulu |
| Isivivinyo Sokuvinjelwa (CITS800S2) | I-Polar | 1 | Ukulinganiswa kwe-Impedance |
| Ubukhulu Bokumboza Nge-X-ray | I-ZhengYe | 1 | Ubukhulu bokugoqa |
| Isivivinyo Sokungcoliswa Kwe-Ion | I-ZhengYe | 1 | Ukuhlolwa kokuhlanzeka (ionic) |
| Igumbi Lokufafaza Usawoti | — | 1 | Ukuhlolwa kokumelana nokugqwala |
| Igumbi Lokushaqeka Okushisayo | — | 1 | Ukuthembeka (ukushaqeka kwesimo sezulu) |
| I-Microscope ye-Metallographic | I-Olympus | 1 | Ukuhlaziywa kwesigaba esiphambene |