| Into | I-PCB eqinile (i-HDI) | I-PCB eguquguqukayo | I-PCB Eqinile Eguquguqukayo |
| Isendlalelo Esiphezulu | 2-68L | 12L | 68L |
| Isendlalelo Sangaphakathi Esincane Sokulandelela/Isikhala | 1.4/1.4mil | 2/2mil | 2/2mil |
| Isendlalelo Esingaphandle Ukulandelela Okuncane/Isikhala | 1.4/1.4mil | 3/3mil | 3/3mil |
| Isendlalelo Sangaphakathi Esiphezulu Sethusi | 6oz | 2oz | 6oz |
| Isendlalelo Esingaphandle Sethusi Eliphezulu | 6oz | 3oz | 6oz |
| Ukubhola Okungenani Kwemishini | 0.15mm/6mil | 0.15mm | 0.15mm |
| Ukubhola Okuncane Nge-Laser | 0.05mm/3mil | 0.05mm | 0.05mm |
| Isilinganiso Esiphezulu Sokubukeka (Ukubhola Kwemishini) | 20:1 | / | 20:1 |
| Isilinganiso Esiphezulu Sokubukeka (Ukubhola Nge-Laser) | 1:1 | 1:1 | 1:1 |
| Ukuqondanisa Kwezingqimba Eziphakathi | +/-0.254mm(1mil) | ± 0.05mm | ± 0.05mm |
| Ukubekezelelana kwe-PTH | ± 0.075mm | ± 0.075mm | ± 0.075mm |
| Ukubekezelelana kwe-NPTH | ± 0.05mm | ± 0.05mm | ± 0.05mm |
| Ukubekezelelana Kwesinki Esiphikisayo | +0.15mm | ± 0.15mm | ± 0.15mm |
| Ubukhulu bebhodi | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Ukubekezelelana Kobukhulu Bebhodi ( |
± 0.1mm | ± 0.05mm | ± 0.1mm |
| Ukubekezelelana Kobukhulu Bebhodi (≥1.Omm) | ±8% | / | ±10% |
| Usayizi Omncane Webhodi | 10*10mm | 5*5mm | 10*10mm |
| Usayizi Omkhulu Webhodi | 1200mm*750mm | 500*1200mm | 500*500mm |
| Ukuqondanisa Uhlaka | +/-0.075mm(3mil) | ± 0.05mm | ± 0.1mm |
| I-BGA yami | 0.125mm (5mil) | 7mil | 7mil |
| I-SMT yami | 0.177*0.254mm(7*10mil) | 7*10mil | 7*10mil |
| Ukususwa Kwemaski Encane Yesolder | 1.5mil | 2mil | 1.5mil |
| Idamu Lami Lemaski Yesolder | 3mil | 3mil | 3mil |
| Inganekwane | Omhlophe, Omnyama, Obomvu, Ophuzi | Omhlophe, Omnyama, Obomvu, Ophuzi | Omhlophe, Omnyama, Obomvu, Ophuzi |
| Ububanzi/Ukuphakama Kwenganekwane Encane | 4/23mil | 4/23mil | 4/23mil |
| Irediyasi Encane Yokugoba (Ibhodi Elilodwa) | / | 3-6 x Ubukhulu bebhodi | Ubukhulu bebhodi eliguquguqukayo obungu-3-7 x |
| Irediyasi Encane Yokugoba (Ibhodi Eliseceleni Eliphindwe Kabili) | / | 6-10 x Ubukhulu bebhodi | Ubukhulu beBhodi Eliguquguqukayo 6-11 x |
| Irediyasi Encane Yokugoba (Ibhodi Lezendlalelo Eziningi) | / | 10-15 x Ubukhulu bebhodi | Ubukhulu beBhodi Eliguquguqukayo obuyi-10-16 x |
| Irediyasi Encane Yokugoba (Ukugoba Okunamandla) | / | 20-40 x Ubukhulu bebhodi | 20-40 × Ubukhulu bebhodi |
| Ububanzi be-Strain Fillet | / | 1.5+0.5mm | 1.5+0.5mm |
| Ukukhothama Nokujika | 0.005 | / | 0.0005 |
| Ukubekezelelana kwe-Impedance | Okuphele Kodwa: ±5Ω(≤50Ω)，±7%(＞50Ω) | Okuphele Kodwa: ±5Ω(≤50Ω),±10%(＞50Ω) | Okuphele Kodwa: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Ukubekezelelana kwe-Impedance | Umehluko: ±5Ω(≤50Ω)，±7%(＞50Ω) | Umehluko: ±5Ω(≤50Ω),±10%(＞50Ω) | Umehluko: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Imaski Yokusoda | Oluhlaza, Omnyama, Oluhlaza okwesibhakabhaka, Obomvu, Oluhlaza okwesibhakabhaka, Ophuzi, Omhlophe, Ophuzi | Imaski Eluhlaza Okwesibhakabhaka/I-PI Emnyama/I-PI Ephuzi | Okuluhlaza okotshani, Okumnyama, Okuluhlaza okwesibhakabhaka, Okubomvu, Okuluhlaza okotshani |
| Ukuqedwa Komphezulu | I-Eiectronic gold plating, i-ENIG, i-Hard gold plating, i-Gold Finger, i-Immersion Silver, i-ImmersionTin, i-HASL LF, i-OSP, i-ENEPIG, i-Soft gold plating | Ukugoqwa kwegolide kagesi, i-ENIG, Ukugoqwa kwegolide okuqinile, Umunwe wegolide, Isiliva lokucwiliswa, Ithini lokucwiliswa, i-OSP, i-ENEPIG, Ukugoqwa kwegolide okuthambile | Ukugoqa igolide nge-elekthronikhi, i-ENIG, Ukugoqa igolide eliqinile, Umunwe wegolide, Isiliva lokucwiliswa, I-Immersio Tin, i-HASL LF, i-OSP, i-ENEPIG, Ukugoqa igolide elithambile |
| Inqubo Ekhethekile | Kungcwatshwe/kuphuphuthekile nge-thread, i-step groove, ubukhulu obukhulu, ukumelana/umthamo ongcwatshiwe, ingcindezi exubile, i-RF, umunwe wegolide, isakhiwo se-N+N, ithusi elijiyile, ukubhoboza ngemuva, i-HDI(5+2N+5) | umunwe wegolide, i-lamination, ingcina eqhubayo, ifilimu evikelayo, i-dome yensimbi | Kungcwatshwe/kuphuphuthekile, umsele wesinyathelo, ubukhulu obukhulu, ukumelana/umthamo ogqitshiwe, ingcindezi exubile, i-RF, umunwe wegolide, isakhiwo se-N+N, ithusi elijiyile, ukubhoboza ngemuva |
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