Ukuqedwa Komphezulu we-PCB
| Ukuqedwa Komphezulu | Inani Elijwayelekile | Umhlinzeki |
| UMnyango Womlilo Wokuzithandela | 0.3~0.55µm, 0.25~0.35µm | I-Enthone |
| Shikoku Chemical | ||
| NGIYAVUMA | Noma: 0.03~0.12um, Ni: 2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENIG ekhethiwe | Noma: 0.03~0.12um, Ni: 2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENEPIC | I-Au: 0.05~0.125µm, i-Pd: 0.05~0.3µm | Chuang Zhi |
| Ku: 3 ~ 10um | ||
| Igolide Eliqinile | Noma : 0.127~1.5um , Ni : min 2.5um | Umkhokhi/i-EEJA |
| Igolide Elithambile | Noma : 0.127~0.5um , Ni : min 2.5um | INHLANZI |
| Ithini Lokucwilisa | Ubuncane: 1um | Ubuchwepheshe be-Enthone / ATO |
| Isiliva Sokucwiliswa | 0.127~0.45um | I-Macdermid |
| I-HASL engenalo i-lead | 1 ~ 25um | I-Nihon Superior |
Ngenxa yokuthi ithusi likhona ngesimo sama-oxide emoyeni, lithinta kakhulu ukushintshwa kanye nokusebenza kukagesi kwama-PCB. Ngakho-ke, kubalulekile ukwenza ukushintshwa kobuso kwama-PCB. Uma ubuso bama-PCB bungaqedwanga, kulula ukubangela izinkinga zokushintshwa okubonakalayo, futhi ezimweni ezinzima, ama-solder pad kanye nezingxenye azikwazi ukushintshwa. Ukushintshwa kobuso be-PCB kubhekisela enkambisweni yokwakha ungqimba lobuso ngokwenziwa ku-PCB. Inhloso yokushintshwa kwe-PCB ukuqinisekisa ukuthi i-PCB inokushintshwa okuhle noma ukusebenza kukagesi. Kunezinhlobo eziningi zokushintshwa kobuso kwama-PCB.
Ukulinganisa Umoya Oshisayo (HASL)
Kuyinqubo yokufaka i-solder ye-tin lead encibilikisiwe ebusweni be-PCB, ukuyifutha ngomoya ocindezelwe ofudumele bese kwakheka ungqimba lwengubo olumelana nokushiswa kwethusi futhi olunikeza ukushiswa okuhle. Phakathi nale nqubo, kubalulekile ukwazi kahle lezi zinhlaka ezibalulekile ezilandelayo: izinga lokushisa lokushiswa, izinga lokushisa lommese womoya oshisayo, ingcindezi yommese womoya oshisayo, isikhathi sokucwiliswa, isivinini sokuphakamisa, njll.
Inzuzo ye-HASL
1. Isikhathi eside sokugcina.
2. Ukumanzisa kahle amaphedi kanye nokumbozwa kwethusi.
3. Uhlobo olusetshenziswa kabanzi olungenalo i-lead (oluhambisana ne-RoHS).
4. Ubuchwepheshe obuvuthiwe, izindleko eziphansi.
5. Ifaneleka kakhulu ekuhlolweni okubonakalayo kanye nokuhlolwa kukagesi.
Ubuthakathaka be-HASL
1. Akufanele ukubopha ngentambo.
2. Ngenxa ye-meniscus yemvelo ye-solder encibilikisiwe, ukuthamba kwayo kubi.
3. Akusebenzi kumaswishi okuthinta asebenza kahle.
4. Kumaphaneli amancane kakhulu, i-HASL ingase ingafaneleki. Izinga lokushisa eliphezulu lebhavu lingabangela ukuthi ibhodi lesifunda ligobe.
2. UMnyango Womlilo Wokuzithandela
I-OSP yisifinyezo se-Organic Solderability Preservative, esaziwa nangokuthi i-per solder. Ngamafuphi, i-OSP iwukufafazwa ebusweni bama-copper solder pads ukuze kuhlinzekwe ifilimu evikelayo eyenziwe ngamakhemikhali e-organic. Le filimu kumele ibe nezakhiwo ezifana nokumelana ne-oxidation, ukumelana nokushaqeka kokushisa kanye nokumelana nomswakama ukuvikela ubuso bethusi ekugqwaleni (i-oxidation noma i-vulcanization, njll.) ezindaweni ezijwayelekile. Kodwa-ke, ekufakweni kwe-solder okushisa okuphezulu okulandelayo, le filimu evikelayo kumele isuswe kalula yi-flux ngokushesha, ukuze ubuso bethusi obuhlanzekile obuveziwe bukwazi ukuhlangana ngokushesha ne-solder encibilikisiwe ukuze kwakheke i-solder joint eqinile ngesikhathi esifushane kakhulu. Ngamanye amazwi, indima ye-OSP ukusebenza njengesivikelo phakathi kwethusi nomoya.
Inzuzo ye-OSP
1. Kulula futhi kuyathengeka; Ukuphela kobuso kumane nje kuyi-spray coating.
2. Ubuso bephedi yokudayisa bubushelelezi kakhulu, bunobucaba obufana ne-ENIG.
3. Ayinawo umthofu (ihambisana nezindinganiso ze-RoHS) futhi inobungani nemvelo.
4. Ingaphinde isetshenziswe.
Ubuthakathaka be-OSP
1. Ukungamanzi kahle.
2. Ukucaca nokuncane kwefilimu kusho ukuthi kunzima ukulinganisa ikhwalithi ngokuhlola okubonakalayo nokwenza ukuhlolwa online.
3. Impilo yesevisi emfushane, izidingo eziphezulu zokugcina nokuphatha.
4. Ukuvikelwa okungekuhle kwemigodi embozwe ngepulasitiki.
Isiliva Sokucwiliswa
Isiliva linezakhiwo zamakhemikhali ezizinzile. I-PCB ecutshungulwa ubuchwepheshe bokucwiliswa kwesiliva isenganikeza ukusebenza okuhle kukagesi ngisho noma ivezwe ezindaweni ezishisa kakhulu, ezinomswakama nezingcolile, kanye nokugcina ukushintshwa okuhle ngisho noma ingase ilahlekelwe ukukhanya kwayo. I-Immersion Silver iyindlela yokusabela lapho ungqimba lwesiliva elihlanzekile lufakwa ngqo ethusi. Ngezinye izikhathi, isiliva lokucwiliswa lihlanganiswa nezingubo ze-OSP ukuvimbela isiliva ukuthi lingasabelani nama-sulfide emvelweni.
Inzuzo Yokucwiliswa Kwesiliva
1. Ukushintshwa okuphezulu.
2. Ubuso obuhle obuyisicaba.
3. Izindleko eziphansi futhi azinawo umthofu (uhambisana nezindinganiso ze-RoHS).
4. Kusebenza ekubophweni kwentambo ye-Al.
Ubuthakathaka Bokucwiliswa Kwesiliva
1. Izidingo zokugcina izinto ziphezulu futhi kulula ukuzingcolisa.
2. Isikhathi esifushane sokuhlanganiswa ngemva kokukhipha ephaketheni.
3. Kunzima ukwenza ukuhlolwa kukagesi.
Ithini Lokucwilisa
Njengoba yonke i-solder isekelwe ku-tin, ungqimba lwe-tin lungalingana nanoma yiluphi uhlobo lwe-solder. Ngemva kokufaka izithasiselo eziphilayo kusisombululo sokucwiliswa kwe-tin, isakhiwo sengqimba ye-tin sibonisa isakhiwo esihlanganisiwe, sinqoba izinkinga ezibangelwa ama-whiskers e-tin kanye nokufuduka kwe-tin, kuyilapho futhi sinokuzinza okuhle kokushisa kanye nokushiswa.
Inqubo ye-Immersion Tin ingakha i-flat copper tin intermetallic compounds ukuze i-immersion tin ibe nokushintshwa okuhle ngaphandle kwezinkinga zokusabalala noma ukusabalala kwe-intermetallic compound.
Inzuzo ye-Immersion Tin
1. Kusebenza emigqeni yokukhiqiza evundlile.
2. Kusebenza ekucutshungulweni kwentambo encane kanye nokushiswa kwensimbi okungenalo umthofu, ikakhulukazi kusebenza enkambisweni yokugoqa.
3. Ukuthamba kuhle kakhulu, kusebenza ku-SMT.
Ubuthakathaka be-Immersion Tin
1. Isidingo esiphezulu sokugcina, singabangela ukuthi izigxivizo zeminwe zishintshe umbala.
2. Amadevu ethini angabangela izinkinga zama-short circuits kanye nama-solder joint, ngaleyo ndlela anciphise isikhathi sokuphila kwawo.
3. Kunzima ukwenza ukuhlolwa kukagesi.
4. Le nqubo ihilela izinto ezibangela umdlavuza.
NGIYAVUMA
I-ENIG (i-Electroless Nickel Immersion Gold) iyisimbozo esisetshenziswa kabanzi sokuqeda ubuso esakhiwe ngezingqimba ezimbili zensimbi, lapho i-nickel ifakwa ngqo ethusini bese ama-athomu egolide efakwa phezu kwethusi ngokusebenzisa ukusabela kokuguquguquka. Ubukhulu besendlalelo sangaphakathi se-nickel ngokuvamile buyi-3-6um, kanti ubukhulu bokufakwa kwesendlalelo sangaphandle segolide ngokuvamile buyi-0.05-0.1um. I-nickel yakha isendlalelo esivimbelayo phakathi kwe-solder nethusi. Umsebenzi wegolide ukuvimbela ukubola kwe-nickel ngesikhathi sokugcinwa, ngaleyo ndlela kwandise isikhathi sokuphila kweshalofu, kodwa inqubo yokucwiliswa kwegolide ingakhiqiza futhi ukuthamba okuphezulu kwendawo.
Ukugeleza kokucubungula kwe-ENIG yilokhu: ukuhlanza-->ukuqopha-->isithalisi-->ukufaka i-nickel yamakhemikhali-->ukufakwa kwegolide-->ukuhlanza izinsalela
Izinzuzo ze-ENIG
1. Kufanelekela ukushiswa kwensimbi okungenalo i-lead (okuhambisana ne-RoHS).
2. Ububushelelezi obuhle kakhulu bomphezulu.
3. Isikhathi eside sokuphila eshalofini kanye nobuso obuqinile.
4. Ifanele ukubopha ngentambo ye-Al.
Ubuthakathaka be-ENIG
1. Kubiza kakhulu ngenxa yokusebenzisa igolide.
2. Inqubo eyinkimbinkimbi, okunzima ukuyilawula.
3. Kulula ukukhiqiza i-black pad phenomenon.
I-Electrolytic Nickel/Gold (igolide eliqinile/igolide elithambile)
Igolide le-nickel le-electrolytic lihlukaniswe ngokuthi “igolide eliqinile” kanye “negolide elithambile”. Igolide eliqinile linobumsulwa obuphansi futhi livame ukusetshenziswa eminweni yegolide (izixhumi zomphetho we-PCB), oxhumana nabo be-PCB noma kwezinye izindawo ezingagugi. Ubukhulu begolide bungahluka ngokuya ngezidingo. Igolide elithambile linobumsulwa obuphezulu futhi livame ukusetshenziswa ekubophweni kwentambo.
Inzuzo ye-Electrolytic Nickel/Gold
1. Isikhathi eside sokugcinwa.
2. Ifanelekela ukushintshana kokuxhumana kanye nokubopha ucingo.
3. Igolide eliqinile lifanele ukuhlolwa ngogesi.
4. Ayinawo umthofu (ihambisana ne-RoHS)
Ubuthakathaka be-Electrolytic Nickel/Gold
1. Ukuqeda okubiza kakhulu kobuso.
2. Iminwe yegolide efakwa ngogesi idinga izintambo ezengeziwe eziqhubayo.
3. Igolide elibekiwe alikwazi ukushintshwa kalula. Ngenxa yobukhulu begolide, izingqimba ezijiyile kunzima kakhulu ukuzishintshwa.
I-ENEPIC
I-Electroless Nickel I-Electroless Palladium Immersion Gold noma i-ENEPIG isetshenziswa kakhulu ekuqedeni ubuso be-PCB. Uma kuqhathaniswa ne-ENIG, i-ENEPIG yengeza ungqimba olwengeziwe lwe-palladium phakathi kwe-nickel negolide ukuze ivikele ungqimba lwe-nickel ekugqwaleni futhi ivimbele ukukhiqiza ama-pad amnyama akhiwa kalula enkambisweni yokuqeda ubuso be-ENIG. Ubukhulu be-nickel bungaba ngu-3-6um, ubukhulu be-palladium bungaba ngu-0.1-0.5um kanti ubukhulu begolide bungu-0.02-0.1um. Nakuba ubukhulu begolide buncane kune-ENIG, i-ENEPIG ibiza kakhulu. Kodwa-ke, ukwehla kwamuva kwezindleko ze-palladium kwenze intengo ye-ENEPIG yaba ngethengekayo.
Inzuzo ye-ENEPIG
1. Inazo zonke izinzuzo ze-ENIG, ayikho into eyenzeka nge-black pad.
2. Kufaneleka kakhulu ukubopha intambo kune-ENIG.
3. Akukho bungozi bokugqwala.
4. Isikhathi eside sokugcina, esingenalo i-lead (ihambisana ne-RoHS)
Ubuthakathaka be-ENEPIG
1. Inqubo eyinkimbinkimbi, okunzima ukuyilawula.
2. Izindleko eziphezulu.
3. Kuyindlela entsha futhi ayikavuthwa.