Ukuhlaziywa Okuphelele Kobuchwepheshe Bebhodi Yesekethe Ephrintiwe (i-PCB): Izinhlobo, Izinto Zokusebenza, Izicelo, kanye Nemikhuba Yesikhathi Esizayo
Njengengxenye ebalulekile yamadivayisi kagesi, i-Printed Circuit Board (PCB) isebenza njengesikhungo semizwa sohlelo lwe-elekthronikhi, yenza imisebenzi ebalulekile yokuhlinzeka ngokusekelwa kwemishini kanye nokuxhumeka kukagesi kwezingxenye ze-elekthronikhi. Ngokuthuthuka okusheshayo kobuchwepheshe be-elekthronikhi, kusukela ekuthwaleni okuncane nokulula kwama-smartphone kuya ekubalweni kokusebenza okuphezulu ezikhungweni zedatha, kusukela ekudlulisweni kwesivinini esikhulu ekuxhumaneni kwe-5G kuya ekulawuleni okuyinkimbinkimbi ekushayeleni okuzenzakalelayo kwezimoto, izimo ezahlukene zohlelo lokusebenza ziletha izidingo ezahlukahlukene zokusebenza, isakhiwo, kanye nenqubo yama-PCB. Lokhu kuholele ekuveleni kwezinhlobo eziningi ze-PCB. Ukuqonda okuphelele izici ezahlukahlukene zama-PCB kubalulekile konjiniyela be-elekthronikhi, abacwaningi kanye nabathuthukisi, kanye nochwepheshe ezimbonini ezihlobene, ukuze bathuthukise imiklamo ye-elekthronikhi futhi bathuthukise ukusebenza komkhiqizo.
Ukuhlaziywa Kobuchwepheshe Kwama-PCB Ahlukaniswe Ngezinto Ezingaphansi Kwe-Substrate
(一) Ama-PCB aqinile
Ama-PCB aqinile, ngokuqina kwawo okumangalisayo kwemishini kanye namandla awo, abe yisinqumo esiyisisekelo samadivayisi amaningi kagesi. Izinto zefayibha yengilazi, njenge-E-glass kanye ne-S-glass, zisetshenziswa kabanzi ekukhiqizweni kwama-PCB aqinile ngenxa yezakhiwo zawo ezinhle kakhulu zokushisa kanye namandla emishini. Phakathi kwazo, ifayibha ye-E-glass inikeza ukusebenza kahle okuphezulu futhi ivame ukutholakala emikhiqizweni ejwayelekile ye-elekthronikhi; ifayibha ye-S-glass, ngakolunye uhlangothi, inamandla aphezulu kanye ne-modulus, okwenza ifaneleke ezinkambeni ezinezidingo eziqinile zezakhiwo zemishini.
Ama-PCB aqinile enziwe ngezinto ze-polyimide (PI) anezici ezifana nokumelana nokushisa okuphezulu (okukwazi ukusebenza ngokuqhubekayo ngaphezu kuka-200°C), ukufudumala okuphezulu (okune-dielectric constant ephansi cishe cishe ku-3), kanye nokuqina kwamakhemikhali okuhle kakhulu. Avame ukusetshenziswa ezimweni ezifunwa kakhulu njengezindiza kanye ne-electronics yezempi. I-FR-4, njengezinto ezisetshenziswa kakhulu ze-substrate zama-PCB aqinile, ihlanganiswe ngendwangu yefayibha yengilazi efakwe i-epoxy resin. Inezakhiwo ezinhle zikagesi (ezinokumelana nomthamo okungaphezu kuka-10^14Ω·cm) kanye nokumelana nomlilo (okuhlangabezana nebanga le-UL94V-0 flame retardant), futhi isetshenziswa kabanzi emikhiqizweni ye-elekthronikhi yomphakathi efana namakhompyutha namadivayisi okuxhumana.
Njengezingqimba ze-laminate ezimbozwe ngethusi, i-CEM-1 ne-CEM-3 zinezici zazo. I-CEM-1, eyakhiwe ngenhlanganisela yomata weglasi nesisekelo sephepha, inezindleko eziphansi kanye nezakhiwo ezithile zikagesi, okwenza ifaneleke emikhiqizweni kagesi yabathengi ebiza kakhulu. I-CEM-3, esekelwe ku-core fiber yengilazi, ihamba phambili ekusebenzeni kokunciphisa nokucubungula ngomshini, futhi ivame ukusetshenziswa kumadivayisi kagesi amancane.
(igama) 、 Ama-PCB Aguquguqukayo (ama-FPC)
Ama-PCB aguquguqukayo (ama-FPC), anokugoba kwawo okuhlukile kanye nokuncane, abambe isikhundla esibalulekile kumadivayisi kagesi anesikhala esilinganiselwe. I-Polyimide (PI) ingenye yezinto eziyinhloko zama-FPC. Inokuguquguquka okuhle kakhulu (ikwazi ukumelana nezigidi zemijikelezo yokugoba), ukumelana nokushisa okuphezulu (enezinga lokushisa lokusebenza lesikhathi eside elingaphezu kuka-150°C), kanye nezakhiwo ezinhle zikagesi (ene-tangent yokulahlekelwa kwe-dielectric ephansi njengo-0.002).
Izinto zefilimu ye-polyester ezifana ne-polyethylene terephthalate (PET) kanye ne-polyethylene naphthalate (PEN) nazo zivame ukusetshenziswa kuma-FPC. Zinezinzuzo zezindleko eziphansi kanye nokucutshungulwa okuhle, kodwa ziphansi kancane kune-PI maqondana nokumelana nokushisa okuphezulu kanye nezakhiwo zikagesi. Amapharamitha abalulekile okulinganisa ukusebenza kwama-FPC, njengerediyasi yokugoba kanye nenani lemijikelezo yokugoba engayibekezelela, athinta ngqo ukuthembeka kanye nokuphila kwenkonzo kwama-FPC ekusetshenzisweni okungokoqobo.
(三) Ama-PCB Aqinile Aguquguqukayo
Ama-PCB aqinile ahlanganisa ngobuhlakani izinzuzo zama-PCB aqinile nama-PCB aguquguqukayo. Ezindaweni eziqinile, izinto ezifanayo ze-substrate njengalezo ezisetshenziswa kuma-PCB aqinile, njengebhodi eliqinile le-FR-4 noma le-PI, zivame ukusetshenziswa ukuhlinzeka ngokusekelwa okudingekile komshini kanye nokuzinza kwebhodi lesifunda, ukuqinisekisa ukufakwa okuthembekile kwezingxenye ze-elekthronikhi kanye nokuxhumeka kukagesi. Ezindaweni eziguquguqukayo, izinto ze-substrate eziguquguqukayo, njengefilimu eziguquguqukayo ze-PI, zisetshenziselwa ukufeza ukugoba kwebhodi lesifunda.
Ubuchwepheshe obuyinhloko bama-PCB aqinile aguquguqukayo busenqubweni yokuxhuma phakathi kwezindawo eziqinile neziguquguqukayo. Izindlela ezivamile zokuxhuma zifaka phakathi ukushisela nge-laser kanye nokubopha okunamathelayo. Ukuthembeka kwezingxenye zokuxhuma kanye nomklamo wokunciphisa ukucindezeleka kuyizinto ezibalulekile zokuqinisekisa ukusebenza kwama-PCB aqinile. Umklamo onengqondo ungavimbela ngempumelelo izinkinga ezifana nokwehluleka kokuxhuma noma ukudluliselwa kwesignali okungavamile ngesikhathi senqubo yokugoba.
Izici Zobuchwepheshe Zama-PCB Ahlukaniswe Ngenani Lezendlalelo Eziqhuba Ugesi
(一) Ama-PCB Anezinhlangothi Ezilodwa
Njengohlobo oluyisisekelo lwe-PCB, i-PCB enohlangothi olulodwa ine-foil yethusi ohlangothini olulodwa futhi igcwalisa imisebenzi yesekethe ngokusebenzisa izintambo zohlangothi olulodwa. Isakhiwo sayo sesekethe silula, okwenza ifaneleke kwamanye amadivayisi kagesi anezidingo eziphansi zokusebenza, njengamabhodi okulawula amadivayisi asekhaya alula kanye namabhodi wesekethe yamathoyizi. Inqubo yokukhiqiza ama-PCB anohlangothi olulodwa ilula kakhulu, ikakhulukazi ifaka phakathi izinyathelo ezifana nokusika i-foil yethusi, ukuphrinta imaski ye-solder, kanye nokuphrinta izinhlamvu, futhi izindleko ziphansi kakhulu. Kodwa-ke, ngenxa yesikhala sokuxhuma esilinganiselwe, ubunzima besekethe kanye nokwanda kokusebenza kwama-PCB anohlangothi olulodwa kunqunyelwe kancane.
(二) Ama-PCB Anezinhlangothi Ezimbili
I-PCB enamacala amabili ine-foil yethusi kuzo zombili izinhlangothi zebhodi lesifunda futhi ifinyelela ukuxhumana kagesi phakathi kwezinhlangothi ezimbili ngama-via (ama-via ensimbi). Inqubo yokukhiqiza ama-via ivame ukufaka izinyathelo ezifana nokubhoboza, ukufaka i-copper plating engenawo ugesi, kanye nokufaka i-electroplating ukuqinisekisa ukuhanjiswa kahle kukagesi kodonga lwangaphakathi lwama-via. Ubunzima besekethe kanye nekhono lokusebenza elisebenzayo lama-PCB anamacala amabili kuthuthuke kakhulu uma kuqhathaniswa nama-PCB anamacala amabili, futhi angasetshenziswa kuma-motherboard ekhompyutha, kwamanye amamojula amadivayisi okuxhumana, njll.
Ekwakhiweni kwama-PCB anezinhlangothi ezimbili, ukuhlela izintambo kanye nokuhlelwa nge-via kuyizinto ezibalulekile. Umklamo onengqondo unganciphisa ngempumelelo ukuphazamiseka kwesignali futhi uthuthukise ubuqotho kanye nokuzinza kokudluliswa kwesignali.
(三) Ama-PCB Anezingqimba Eziningi
Ama-PCB anezingqimba eziningi eziqhuba umoya (ngokuvamile izingqimba ezine noma ngaphezulu), ezihlukaniswa yizingqimba ezivikela umoya (njengamashidi okulungiselela, amashidi e-PP). Ngaphezu kwezimbobo ezivamile, ubuchwepheshe obusebenzisa i-blind via kanye ne-bread via busetshenziswa kabanzi kuma-PCB anezingqimba eziningi. I-blind via imbobo yokuqhuba umoya esukela ebusweni bebhodi lesifunda iye kungqimba oluthile lwangaphakathi futhi ayingeni kulo lonke ibhodi lesifunda; i-bread via imbobo yokuqhuba umoya exhumanisayo phakathi kwezingqimba zangaphakathi futhi ayivezwa ebusweni bebhodi lesifunda.
Ukusetshenziswa kobuchwepheshe be-blind via kanye ne-bread via kunciphisa ngempumelelo inani lama-via ebusweni bebhodi lesifunda futhi kuthuthukisa ubuningi bezintambo kanye nokusebenza kokudlulisa isignali. Ama-PCB e-Multilayer angafinyelela ukudluliselwa kwezintambo eziphezulu kanye nokusebenza okuphezulu kwesignali, futhi asetshenziswa kabanzi kumadivayisi kagesi aphezulu, njengama-motherboard eseva, ama-motherboard e-smartphone, kanye namakhadi ehluzo asebenza kahle. Enqubweni yokukhiqiza ama-PCB e-multilayer, izici ezifana nenqubo ye-lamination, ukunemba kokubhoboza, kanye nekhwalithi ye-electroplating zinomthelela omkhulu ekusebenzeni nasekuthembekeni kwebhodi lesifunda.
ezintathu,Amaphuzu Abalulekile Obuchwepheshe bama-PCB Ahlukaniswe Ngezinqubo Ezikhethekile
(一) Ama-PCB Anemvamisa Ephakeme
Ama-PCB anemvamisa ephezulu asetshenziswa kakhulu kumadivayisi kagesi aphatha izimpawu ezinemvamisa ephezulu, njengokuxhumana okungenantambo, i-radar, nezinye izinkambu. Ngesikhathi sokudluliswa kwezibonakaliso ezinemvamisa ephezulu, izinkinga ezifana nokulahlekelwa yisignali kanye nokuphambuka kwesigaba zibonakala kakhulu. Ngakho-ke, ama-PCB anemvamisa ephezulu adinga ukusebenzisa izinto ezikhethekile ukunciphisa ukulahleka kwesignali nokuthuthukisa ikhwalithi yokudluliswa kwesignali.
Izinto zikaRogers zingenye yezinto ezisetshenziswa kakhulu kuma-PCB anemvamisa ephezulu. Zine-dielectric constant ephansi kakhulu (i-Dk ingaba ngaphansi cishe ngo-2.2) kanye ne-loss tangent (i-Df iphansi njengo-0.0009), okunganciphisa ngempumelelo ukulahleka kwesignali kanye nokuphambuka ngesikhathi senqubo yokudlulisa. I-Polytetrafluoroethylene (PTFE) kanye nezinto zayo ezigcwalisiwe zivame ukusetshenziswa kuma-PCB anemvamisa ephezulu, njengoba zinezakhiwo ezinhle zikagesi ezinemvamisa ephezulu kanye nokuqina kwamakhemikhali.
Enqubweni yokuklama nokukhiqiza ama-PCB asebenza ngesivinini esiphezulu, ngaphezu kokukhethwa kwezinto ezibonakalayo, ukwakheka kwezici ezifana nokuhlelwa kwesekethe, ukufaniswa kwe-impedance, kanye nokuvikela nge-electromagnetic nakho kubalulekile. Ukuhlelwa kwesekethe okunengqondo kunganciphisa ukuphazamiseka phakathi kwezibonakaliso, ukufaniswa kwe-impedance okunembile kungaqinisekisa ukudluliswa kwesignali okusebenzayo, kanye nokuvikela nge-electromagnetic okusebenzayo kungavimbela izimpawu ezisebenza ngesivinini esiphezulu ukuthi zingaphazamisi izifunda ezizungezile.
(二) Ama-PCB Asekelwe Ensimbi
Ama-PCB asekelwe ensimbi, anokusebenza kwawo okuhle kakhulu kokushabalalisa ukushisa, abe yisinqumo esifanele samadivayisi kagesi anamandla aphezulu. Izinto ezivamile ze-substrate yensimbi zifaka phakathi i-aluminium-based kanye ne-copper-based. I-substrate esekelwe e-aluminium inamandla amahle okushabalalisa ukushisa kanye nezindleko eziphansi, futhi isetshenziswa kabanzi emikhakheni efana nokukhanya kwe-LED kanye namamojula kagesi. I-substrate esekelwe ethusi inokushisa okuphezulu (cishe izikhathi ezingu-1.6 kune-aluminium) futhi ifaneleka ngezikhathi ezinezidingo eziphezulu kakhulu zokushabalalisa ukushisa, njengezifunda ze-motor drive ezinamandla aphezulu.
Umgomo wokushabalalisa ukushisa kwama-PCB asekelwe ensimbi ukuhambisa ngokushesha ukushisa okukhiqizwa yizingxenye ze-elekthronikhi nge-substrate yensimbi. Ukuze kuthuthukiswe ukusebenza kahle kokushabalalisa ukushisa, ungqimba lokuvikela ukushisa oluqhuba ukushisa, njenge-silicone pad eqhuba ukushisa noma i-insulation eqhuba ukushisa, kuvame ukungezwa phakathi kwe-substrate yensimbi nezingxenye ze-elekthronikhi. Enqubweni yokukhiqiza ama-PCB asekelwe ensimbi, ukulawulwa kobukhulu bengqimba yokuvikela ukushisa kanye namandla okubopha ne-substrate yensimbi kuyizinto ezibalulekile zokuqinisekisa ukusebenza kwazo.
(三) Ama-HDI PCB (Ama-High-Density Interconnect PCB)
Ama-HDI PCB (ama-High-Density Interconnect PCB), anezimpawu zokuxhumanisa okuphezulu kanye nokunciphisa amandla, ahlangabezana nezidingo eziqinile zamadivayisi kagesi esimanje ukuze kube nesikhala nokusebenza kahle. Ubuchwepheshe obuyinhloko bama-HDI PCB busekukhiqizweni kwama-micro-via (ama-Micro-Vias) kanye nokuqoshwa kwemigqa emincane. Ububanzi bama-micro-via buvame ukuba ngaphansi kuka-0.1mm futhi bukhiqizwa kusetshenziswa ubuchwepheshe obuthuthukisiwe njengokugaya nge-laser noma ukuqoshwa kwe-plasma.
Ukuqoshwa kwemigqa emincane kudinga imishini yokuqoshwa enembile kakhulu kanye nokulawulwa kwenqubo ukuze kufezwe izintambo ezincane ngephimbo lobubanzi bomugqa/lomugqa elingaphansi kuka-30μm/30μm. Ama-PCB e-HDI avame ukusebenzisa ubuchwepheshe bokwakha, afinyelele ukuxhumana okuphezulu ngokufaka izingqimba zokufaka umswakama kanye nezingqimba eziqhubayo ungqimba ngengqimba. Ama-PCB e-HDI asetshenziswa kabanzi kumadivayisi kagesi amancane afana nama-smartphone, amaphilisi, namadivayisi agqokwayo, futhi angobunye bobuchwepheshe obubalulekile bokufeza ukusebenza okuphezulu kanye nokwenza la madivayisi abe mancane.
Ama-substrate e-IC (Amabhodi Okuthwala e-IC)
Ama-substrate e-IC (amabhodi okuthwala e-IC) asetshenziswa kakhulu ekupakisheni ama-chip, njengokupakisha kwe-BGA (Ball Grid Array), ukupakisha kwe-QFN (Quad Flat No-Lead), kanye nokupakisha kwe-FC (Flip Chip), njll. Ama-substrate e-IC kudingeka abe nezici zokuxhumanisa okuphezulu kanye nokunemba okuphezulu ukuze kufezwe ukuxhumana okuthembekile phakathi kwe-chip kanye nesekethe yangaphandle.
Ama-substrate e-IC avame ukusebenzisa umklamo webhodi elinezingqimba eziningi, futhi kunezidingo eziqinile zokunemba komugqa, ngobukhulu, kanye nokunemba kwesikhundla ngesikhathi senqubo yokukhiqiza. Ngesikhathi esifanayo, ama-substrate e-IC nawo kudingeka acabangele ukuphathwa kokushabalalisa ukushisa kanye nokusebenza kukagesi ukuqinisekisa ukuzinza nokuthembeka kwe-chip ngesikhathi sokusebenza. Ngokuthuthuka okuqhubekayo kobuchwepheshe be-chip, izidingo zokusebenza nokunemba kwama-substrate e-IC nazo ziyanda njalo.
Izici Zobuchwepheshe Zama-PCB Ahlukaniswe Ngokwesakhiwo Se-Conductive Vias
(一) Amabhodi Angena Ngemigodi
Ibhodi elisebenzisa imbobo edlulayo lingenye yezinhlobo ezivame kakhulu zama-PCB. Ama-vias alo aqhubayo angena kusukela kungqimba ephezulu kuya kungqimba engezansi yebhodi lesifunda, futhi ukuxhumana kukagesi phakathi kwezingqimba kufinyelelwa ngenqubo ye-electroplating nge-via. Ububanzi be-via kanye nobukhulu bethusi bodonga lwe-via lwebhodi elisebenzisa imbobo edlulayo kuyimingcele ebalulekile ethinta ukusebenza kwayo kagesi kanye namandla omshini.
Ububanzi obukhulu be-via buwusizo ekufakweni kwezingxenye ze-plug-in, kodwa kuzothatha isikhala esiningi sezintambo; ukujiya kwethusi okunganele kodonga lwe-via kungaholela ekuxhumekeni kukagesi okungathembekile. Ngesikhathi senqubo yokukhiqiza ibhodi elisebenzisa imbobo, ukunemba kokubhoboza kwe-via kanye nekhwalithi ye-electroplating kunomthelela obalulekile ekusebenzeni kwebhodi lesifunda. Ngaphezu kwalokho, ibhodi elisebenzisa imbobo lingasebenzisa inqubo yokugcwalisa nge-via, njengokugcwalisa i-resin, ukuthuthukisa ukuthembeka kwayo kanye nokumelana nomswakama.
(二) Amabhodi e-Micro-Via
Amabhodi e-micro-via asebenzisa ama-vias aqhubayo anobubanzi obuncane (ngokuvamile angaphansi kuka-0.15mm), njenge-blind micro-vias kanye nama-micro-vias afihliwe. Ukwakheka kwama-micro-vias kuvame ukusebenzisa ubuchwepheshe bokubhoboza nge-laser noma ubuchwepheshe bokuchoboza nge-plasma, futhi lobu buchwepheshe bungafeza ukwenziwa kwama-micro-vias ngokunemba okuphezulu ukuze kuhlangatshezwane nezidingo zocingo oluphezulu.
Ama-micro-via amabhodi e-micro-via anobubanzi obuncane kanye nenani elikhulu, okungafinyelela ukuxhumana kukagesi okwengeziwe ngaphakathi kwesikhala esilinganiselwe futhi kuthuthukise izinga lokuhlanganiswa kanye nokusebenza kwebhodi lesifunda. Ngesikhathi senqubo yokuklama nokukhiqiza amabhodi e-micro-via, izinqubo zokugcwalisa kanye nokwelashwa kwendawo yama-micro-via zidinga ukucatshangelwa ukuqinisekisa ukusebenza kukagesi kanye nokuthembeka kwama-micro-via.
(III) Amabhodi Asebenzisa Izimpumputhe
Ama-vias aqhubayo amabhodi asebenzisa i-blind through adlula kuphela kusuka ebusweni bebhodi lesifunda kuya kungqimba oluthile lwangaphakathi futhi awangeni kulo lonke ibhodi lesifunda. Ukuba khona kwama-vias asebenzisa i-blind through kunganciphisa inani lama-vias ebusweni bebhodi lesifunda, kwandise ubuningi bezintambo, futhi kunciphise nokuphazamiseka kwezimpawu ngesikhathi senqubo yokudlulisa.
Izinqubo zokwakheka kwama-blind vias zifaka phakathi ukubhoboza nge-laser, ukubhoboza nge-electroplating ngemva kokubhoboza ngomshini, njll. Izindlela ezahlukene zenqubo zinemiphumela ehlukene ekhwalithini kanye nezindleko zama-blind vias. Ekwakhiweni kwamabhodi e-blind via, indawo kanye nenani lama-blind vias kudingeka kuhlelwe ngokufanele ukuze kusebenze ngokugcwele izinzuzo zawo futhi kuthuthukiswe ukusebenza kwebhodi lesifunda.
(四) Amabhodi Okuxhumanisa Okuphezulu (i-HDI)
Amabhodi e-High-Density Interconnect (HDI) abonakala ngokuxhumana okunobukhulu obuphezulu, ububanzi obuncane obudlulayo, kanye nemigqa emincane, futhi angobunye bobuchwepheshe obubalulekile bokufeza i-miniaturization kanye nokusebenza okuphezulu kwamadivayisi kagesi. Ngaphezu kokusebenzisa ama-vias amancane aqhubayo, amabhodi e-HDI aphinde afeze izintambo ezincane nge-line width/line pitch engaphansi kuka-30μm/30μm ngobuchwepheshe bokuqopha imigqa emincane.
Amabhodi e-HDI avame ukusebenzisa ubuchwepheshe bokwakha, afinyelele ukuxhumana okuphezulu ngokufaka izingqimba zokufaka ugesi kanye nezingqimba zokuhambisa ugesi ungqimba ngengqimba. Ngesikhathi senqubo yokukhiqiza amabhodi e-HDI, izidingo zezinto zokwakha, imishini, kanye nezinqubo ziphakeme kakhulu, futhi ikhwalithi yesixhumanisi ngasinye idinga ukulawulwa ngokuqinile ukuqinisekisa ukusebenza nokuthembeka kwebhodi lesifunda.
Isiphetho
Njengesisekelo esibalulekile sobuchwepheshe be-elekthronikhi, ukuhlukahluka kwezinhlobo kanye nobunzima bobuchwepheshe bamabhodi wesekethe aphrintiwe kunikeza ukwesekwa okuqinile kokusungula izinto ezintsha kanye nokuthuthukiswa kwamadivayisi kagesi. Kusukela ekukhetheni izinto ze-substrate kuya ekwakhiweni kwezingqimba zokuhambisa umoya, kusukela ekusetshenzisweni kwezinqubo ezikhethekile kuya ekucabangeni kwezindlela zokwelapha ubuso, bese kuba yizidingo zobuchwepheshe zamasimu ahlukene okusetshenziswa kanye nezici zesakhiwo se-conductive vias, isixhumanisi ngasinye siqukethe izincazelo zobuchwepheshe ezicebile.
Ngokuqhubeka kwentuthuko yobuchwepheshe be-elekthronikhi, njengokuthuthukiswa okusheshayo kobuchwepheshe obusha njengobuhlakani bokwenziwa, i-Intanethi Yezinto, kanye ne-big data, kuzobekwa phambili izidingo eziphakeme zokusebenza kanye nemisebenzi yama-PCB. Esikhathini esizayo, ubuchwepheshe be-PCB buzothuthukela ekuqondeni kobuningi obuphezulu, ukusebenza okuphezulu, izindleko eziphansi, kanye nokuvikelwa kwemvelo okukhulu, kukhuthaze njalo ukuthuthukiswa okuncane, ubuhlakani, kanye nokusebenza okuphezulu kwamadivayisi kagesi. Onjiniyela be-elekthronikhi kanye nochwepheshe bezimboni ezihlobene kudingeka banake kakhulu izitayela zokuthuthukiswa kobuchwepheshe be-PCB, baqhubeke nokuqamba okusha nokuthuthukisa imiklamo ukuze bahlangabezane nezidingo zemakethe ezikhulayo kanye nezinselele zobuchwepheshe.
Imibuzo Evame Ukubuzwa：
Q1. Yiziphi izinto ezivamile ze-substrate zama-PCB aqinile?
Izinto ezivamile ze-substrate zama-PCB aqinile zifaka phakathi imicu yengilazi (njenge-E-glass, i-S-glass, njll.), i-polyimide (PI), i-FR-4 (i-laminate embozwe ngethusi evimbela ilangabi eyakhiwe nge-epoxy resin kanye nendwangu ye-fiber yengilazi), i-CEM-1 (i-laminate embozwe ngethusi equkethe ingilazi kanye nesisekelo sephepha), kanye ne-CEM-3 (i-laminate embozwe ngethusi eyisisekelo ene-core ye-fiber yengilazi).
Umbuzo 2. Kungani ama-PCB aguquguqukayo efanelekile kumadivayisi agqokekayo?
Ama-PCB aguquguqukayo afanelekela amadivayisi agqokwayo ngoba izinto zawo eziyinhloko ze-substrate ezifana ne-polyimide (PI), i-polyethylene terephthalate (PET), njll. ziwanika ukuguquguquka okuhle, okuwenza akwazi ukugoba, ukugoqa, nokugoba ngaphakathi kobubanzi obuthile, obungazivumelanisa nezimo eziyinkimbinkimbi zamadivayisi agqokwayo ahambisana nomzimba womuntu. Ngesikhathi esifanayo, anezici zokuba mancane futhi alula, futhi ngeke abeke umthwalo omkhulu kumuntu ogqokile, ehlangabezana nezidingo zamadivayisi agqokwayo ukuze kube nesikhala nenduduzo.
Umbuzo 3. Yimiphi imisebenzi yendawo eqinile kanye nendawo eguquguqukayo ku-PCB eqinile?
Endaweni eqinile ye-PCB eqinile, izinto zokwakha eziqinile ezifana namabhodi aqinile e-FR-4 noma e-PI zisetshenziswa kakhulu ukuhlinzeka ngokusekelwa kwemishini kanye nokuzinza, ukuqinisekisa amandla esakhiwo sebhodi lesifunda ngesikhathi sokufakwa nokusetshenziswa. Ngakolunye uhlangothi, indawo eguquguqukayo isebenzisa izinto zokwakha eziguquguqukayo ezifana namafilimu aguquguqukayo e-PI ukuze kufezwe umsebenzi wokugoba, ukuze ivumelane nezinguquko zesimo sedivayisi ezimweni ezahlukene zokusetshenziswa futhi ihlangabezane nezidingo zokusebenza okuyinkimbinkimbi kwemishini kanye nogesi.
U-4. Yimuphi umehluko omkhulu phakathi kwama-PCB anohlangothi olulodwa nama-PCB anohlangothi oluphindwe kabili?
I-PCB enohlangothi olulodwa ine-foil yethusi ohlangothini olulodwa futhi isetshenziselwa izintambo zocingo ezinohlangothi olulodwa. Ubunzima bayo besekethe buphansi kakhulu, futhi ifaneleka kumadivayisi alula kagesi. Inqubo yokukhiqiza ilula futhi izindleko ziphansi, kodwa imisebenzi yayo kanye nendawo yokuxhuma ilinganiselwe. I-PCB enohlangothi oluphindwe kabili ine-foil yethusi kuzo zombili izinhlangothi, futhi ukuxhumana kukagesi phakathi kwezinhlangothi ezimbili kufezwa ngama-via (ngokuvamile ama-via ensimbi). Ubunzima besekethe buphakathi nendawo, futhi ingafeza imisebenzi eminingi ngebanga elibanzi lohlelo lokusebenza, njengamabhodi ebhodi ekhompyutha, amadivayisi okuxhumana, njll.
Umbuzo 5. Yimiphi imisebenzi yama-vias angaboni kanye nama-vias angcwatshwe kuma-PCB anezingqimba eziningi?
Ama-vias angaboni kuma-PCB anezingqimba eziningi ayizimbobo ezidonsa umoya ezisuka ebusweni ziye ongqimbeni oluthile lwangaphakathi futhi azingeni ebhodini lesifunda lonke. Angasetshenziswa ekuxhumaneni ngogesi phakathi kwezingqimba ezithile, ukunciphisa ukuphazamiseka kwesignali nokuthuthukisa ubuqotho besignali. Ama-vias angcwatshwe ayizixhumanisi phakathi kwezingqimba zangaphakathi futhi awavezwa ebusweni. Angafinyelela ukuxhumana phakathi kwezingqimba ngaphandle kokuthatha isikhala sobuso, okusiza ekufezeni izintambo eziphezulu futhi kuthuthukiswe ukusebenza kanye nezinga lokuhlanganiswa kwebhodi lesifunda.
Umbuzo 6. Kungani ama-PCB avame kakhulu edinga ukusebenzisa izinto ezikhethekile?
Ama-PCB anemvamisa ephezulu asetshenziswa kakhulu ukucubungula izimpawu zemvamisa ephezulu, njenge-microwave frequency bands kanye ne-millimeter-wave frequency bands, futhi izimpawu zivame ukulahleka ngesikhathi senqubo yokudlulisela. Izinto ezikhethekile ezifana nezinto zikaRogers, i-polytetrafluoroethylene (PTFE), kanye nezinto ezigcwele i-ceramic ziyasetshenziswa ngoba lezi zinto zinezici ze-low dielectric constant (Dk) kanye ne-low loss tangent (Df), ezinganciphisa ngempumelelo ukulahleka kwesignali, ziqinisekise ubuqotho besignali, futhi zihlangabezane nezidingo zokudluliselwa kwesignali enemvamisa ephezulu.
Umbuzo 7. Yimaphi amadivayisi kagesi anamandla aphezulu afanelekela ama-PCB asekelwe ensimbi?
Ama-PCB asekelwe ensimbi afanelekela izinhlobo ezahlukene zamadivayisi kagesi anamandla amakhulu. Isibonelo, kumamojula kagesi, kukhiqizwa ukushisa okuningi ngesikhathi sokusebenza, kanti ama-PCB asekelwe ensimbi angakhipha ukushisa ngempumelelo ukuqinisekisa ukusebenza kwawo okuvamile. Kumadivayisi okukhanyisa e-LED, angasusa ukushisa okusheshayo okukhiqizwa ama-LED, athuthukise ukusebenza kahle kokukhanyisa kanye nesikhathi sokuphila kwezibani. Kumasekethe okushayela ngezimoto, angasiza ekususeni ukushisa okukhiqizwa ngesikhathi sokusebenza kwezimoto, aqinisekise ukusebenza okuzinzile kwesekethe.
Umbuzo 8. Yiziphi izici zobuchwepheshe ezibalulekile zama-HDI PCB?
Izici zobuchwepheshe ezibalulekile zama-HDI PCB zifaka phakathi ukusetshenziswa kwama-diameter amancane (Micro-Via, ngokuvamile angaphansi kuka-0.1mm), akhiwa ngobuchwepheshe obuthuthukisiwe njengokugaya nge-laser kanye nokusika nge-plasma; ukuba nemigqa emincane (Fine Line), engafinyelela izintambo ezincane nge-line width/line pitch engaphansi kuka-30μm/30μm; ukusebenzisa ubuchwepheshe bokwakha ukwandisa inani lezingqimba nokufeza ukuxhumana okuphezulu; kanye nokuhambisana okuhle nenqubo yokuhlanganisa ubuchwepheshe be-surface mount (SMT), efanelekile izidingo zamadivayisi kagesi amancane.
Umbuzo 9. Yiziphi izinhlobo zezingqimba zethini elingaphezulu lama-PCB afuthwe ngethini?
Izinhlobo zezendlalelo zethini elingaphezulu lama-PCB afuthwe ngethini zifaka phakathi ithini elimsulwa (i-Pure Tin), i-tin-lead alloy (i-Tin-Lead Alloy), kanye ne-tin-free lead spray, njenge-Sn-Cu (i-tin-copper alloy), i-Sn-Ag-Cu (i-tin-silver-copper alloy), njll. I-tin-free lead spray uhlobo oluye lwathandwa kancane kancane ukuze luhlangabezane nezidingo zokuvikela imvelo.
Umbuzo 10. Kungani ama-PCB ambozwe ngegolide evame ukusetshenziswa kumadivayisi kagesi asezingeni eliphezulu?
Ama-PCB ambozwe ngegolide avame ukusetshenziswa kumadivayisi kagesi aphezulu ngoba igolide lensimbi elimboze ubuso bawo (elihlukaniswe ngegolide eliqinile negolide elithambile) linganikeza ukuhanjiswa okuhle kukagesi, linciphise ukumelana kokuthintana, futhi liqinisekise ukuthembeka kokuxhumeka kukagesi. Ngesikhathi esifanayo, igolide linokusebenza okuhle kakhulu kokulwa nokubola, okungamelana ngempumelelo nokugqwala kwemvelo kanye nokugqwala kwamakhemikhali, kwandise impilo yesevisi yebhodi lesifunda, futhi kuhlangabezane nezidingo eziqinile zamadivayisi kagesi aphezulu njengezindiza, imishini yezokwelapha, kanye neziteshi zokuxhumana zokuthembeka nokuzinza.
Q11. Yini okufanele inakwe lapho kugcinwa ama-PCB e-OSP?
Ama-PCB e-OSP aphathwa ngefilimu yokulondoloza ukushiswa kwezinto eziphilayo. Isikhathi sawo sokugcina sifushane, futhi kufanele kuqashelwe ukuvimbela umswakama. Kufanele agcinwe endaweni eyomile nengenamswakama ukuze kugwenywe ukwehluleka kwefilimu yokulondoloza ukushiswa kwezinto eziphilayo ngenxa yomswakama, okungase kuthinte ukushiswa kwebhodi lesifunda. Ngesikhathi esifanayo, kufanele kuqashelwe nokuhlanza indawo ukuze kuvinjelwe uthuli nokungcola ukuthi kungangcolisi indawo yebhodi lesifunda, okungase kuthinte ukusebenza kokushiswa nokusetshenziswa okulandelayo.
Umbuzo 12. Yiziphi izidingo zokusebenza ezinazo amabhodi ekhompyutha kuma-PCB?
Amabhodi ekhompyutha afana namabhodi e-motherboard, amakhadi ehluzo, namabhodi eseva anezidingo zamakhono okucubungula idatha okusheshayo kanye nokudlulisa idatha kwama-PCB. Adinga ukusekela amaphrothokholi okudlulisa isignali esheshayo njengebhasi le-PCI-E, izixhumi ze-USB, kanye nezixhumi ze-SATA. Kufanele abe nokusebenza kahle kukagesi ukuqinisekisa ubuqotho besignali kanye nokuqina. Ibhodi le-motherboard lidinga ukuhlanganisa izingxenye ezahlukahlukene ezibalulekile, njenge-chipset, i-BIOS chip, kanye nesekethe yokunikezela ngogesi, njll., okudinga ukuthi i-PCB ibe nokwakheka okunengqondo kanye nezinga eliphezulu lokuhlanganisa. Amabhodi eseva nawo adinga ukusekela ama-CPU amaningi kanye nenkumbulo yomthamo omkhulu, okubeka izidingo eziphakeme kumthamo wokuthwala kanye nokuthembeka kwe-PCB.
Umbuzo 13. Kungani amabhodi ezimoto kudingeka abe nokuthembeka okuphezulu?Amabhodi ezimoto asetshenziswa ezinhlelweni zikagesi zezimoto. Ngesikhathi senqubo yokushayela, izimoto zizobhekana nezimo ezahlukahlukene eziyinkimbinkimbi zemvelo, njengokudlidliza, umthelela, kanye nezinguquko emazingeni okushisa aphezulu naphansi (ngokuvamile okudingekayo ukuze zisebenze ngokujwayelekile ngaphakathi kwezinga lokushisa eliphakathi kuka--40°C no-125°C). Uma ibhodi lezimoto lingenalo ukuthembeka okwanele, kungaholela ekwehlulekeni ohlelweni lukagesi lwezimoto, okuthinta ukusebenza okuvamile kwemoto kanye nokuphepha kokushayela. Ngakho-ke, amabhodi ezimoto kudingeka abe nokuthembeka okuphezulu ukuqinisekisa ukusebenza okuzinzile ezindaweni ezinzima.
Umbuzo 14. Iyiphi indima edlalwa yi-substrate ye-IC (ibhodi lokuthwala i-IC) ekupakisheni ama-chip?
I-substrate ye-IC (ibhodi lokuthwala i-IC) idlala indima enkulu yokuxhuma i-chip kanye nesekethe yangaphandle ekupakisheni ama-chip. Isibonelo, izindlela zokupakisha ezifana nokupakisha kwe-BGA (Ball Grid Array), ukupakisha kwe-QFN (Quad Flat No-Lead), kanye nokupakisha kwe-FC (Flip Chip) konke kudinga ukufeza ukuxhumana okuthembekile nge-substrate ye-IC. Kudingeka ibe nezici zokuxhumanisa okuphezulu kanye nokunemba okuphezulu ukuze ihlangabezane nezidingo zenani elikhulu lokudluliselwa kwesignali phakathi kwe-chip kanye nesekethe yangaphandle. Ngesikhathi esifanayo, ukuphathwa kokusatshalaliswa kokushisa kanye nokusebenza kukagesi nakho kudinga ukucatshangelwa ukuqinisekisa ukuthi ukushisa okukhiqizwa ngesikhathi sokusebenza kwe-chip kungasatshalaliswa ngempumelelo futhi isignali ingadluliselwa ngokuzinzile, kuqinisekiswe ukusebenza okuvamile kwe-chip.
Umbuzo 15. Ama-micro-vias amabhodi e-micro-via akheka kanjani?
Ama-micro-via amabhodi e-micro-via avame ukwakheka ngomshini wokubhoboza nge-laser noma ubuchwepheshe bokubhoboza nge-plasma. Ukubhoboza nge-laser kusebenzisa umsebe we-laser onamandla aphezulu ukuze kukhanye ibhodi lesifunda, okwenza ukuthi izinto zishise ngokushesha ukuze zakhe ama-micro-via. Ngakolunye uhlangothi, ukubhoboza nge-plasma kusebenzisa i-plasma ukuze kusebenze ngamakhemikhali ngezinto ezingaphezulu kwebhodi lesifunda ukuze kususwe izingxenye ezingadingekile, ngaleyo ndlela kwakhiwe ama-diameter amancane, njenge-blind micro-vias nama-micro-vias angcwatshwe, njll., ukuze kufezwe izintambo eziphezulu.
