Isikhokelo soYilo kunye nokuCwangciswa kweMinwe yeGolide yePCB
I-Gold Finger PCB luhlobo olukhethekileyo lwebhodi yesekethe eprintiweyo, esetyenziswa rhoqo kwizicelo ezifuna ukuthembeka okuphezulu kunye nokumelana nokuguguleka, njengeebhodi zebhodi zekhompyutha, amakhadi emizobo kunye nezinye izixhobo ze-elektroniki. Eli nqaku liza kujonga inkcazo, iindlela zonyango lomphezulu kunye nezinto eziqwalaselwayo kuyilo lwee-PCB zeminwe yegolide.
Uluhlu lweNqaku
Ⅰ. Inkcazo yomnwe wegolide
II. Iindlela zokugqiba umphezulu wee-PCB zeminwe yegolide
III. Amanyathelo okuzikhusela kwiMinwe yeGolide
IV. Amanyathelo okukhusela ekucutshungulweni kweminwe yegolide
Imibuzo neempendulo ezibuzwa rhoqo
1. Inkcazo yoMnwe weGolide
I-Gold finger, eyaziwa ngokuba yi-edge connector, sisixhobo esifaka isiphelo esinye se-PCB kwindawo yokudibanisa. Isebenzisa ii-connector pin njengendawo yokukhupha uqhagamshelo lwangaphandle lwe-PCB ukuze ifezekise ukuhanjiswa kombane phakathi kwe-solder pad okanye i-copper sheet kunye nee-position pin ezihambelanayo. Ukuze yonyuse ukuhanjiswa kwayo, ukumelana ne-oxidation kunye nokumelana nokuguguleka, iminwe yegolide idla ngokuphathwa nge-nickel gold plating okanye i-ENIG. Ngenxa yokuma kwayo okufana nomnwe, ibizwa ngokuba yiGold Finger.
2. Iindlela zokugqiba umphezulu wee-PCB zeminwe yegolide
Indlela yokugqiba umphezulu weGold Finger PCB ibalulekile ekusebenzeni kwayo nakwiindawo zokusetyenziswa kwayo. Ezi zilandelayo ziindlela ezimbini eziqhelekileyo:
1) Ukubekwa kwegolide yeNickel
I-Nickel gold plating yindlela eqhelekileyo yokugqiba umphezulu, kwaye ubukhulu bayo bunokufikelela kwi-3-50 micro intshi. Inokuqhuba kakuhle, ukumelana ne-oxidation kunye nokumelana nokuguguleka, ngoko ke isetyenziswa kakhulu kwi-gold finger PCBs ezifuna ukufakwa nokususwa rhoqo okanye ii-PCBs ezifuna ukungqubana rhoqo koomatshini. Nangona kunjalo, ngenxa yexabiso eliphezulu legolide, i-nickel gold plating idla ngokusetyenziselwa kuphela unyango lweendawo zasekuhlaleni ezifana ne-gold fingers. Umphezulu wale ndlela yokugqiba umphezulu umhlophe ngesilivere, kodwa ukunyibilika kwayo kuphantsi kancinci.
2) IYAVUMELANA
I-ENIG yenye indlela eqhelekileyo yokugqiba umphezulu, enobukhulu obuqhelekileyo be-1 micro intshi ukuya kuthi ga kwi-3 micro intshi. I-ENIG inokuqhuba kakuhle, ukuguda komphezulu kunye nokunyibilikisa, okwenza ukuba isetyenziswe kakhulu kwi-PCB ezichanekileyo kakhulu ezineedizayini ezifana ne-keyway, i-IC ebotshelelweyo, i-BGA, njl. Kwii-PCB zeminwe yegolide ezingadingi ukumelana nokuguda okuphezulu, inkqubo ye-ENIG yonke yephaneli nayo inokukhethwa, enexabiso eliphantsi kakhulu. Umphezulu we-ENIG egqityiweyo utyheli ngegolide.
3. Amanyathelo okuzikhusela kwiGold Finger Designn
Xa kuyilwa i-PCB yeminwe yegolide, kukho amanqaku athile abalulekileyo ekufuneka aqatshelwe ngokukodwa:
1) Ukumelana nokunxitywa komnwe wegolide
Kwii-PCB ezifuna ukufakwa nokususwa rhoqo, ukuze kwandiswe ukumelana nokuguguleka kweminwe yegolide, kudla ngokufuneka kusetyenziswe i-electroplating yegolide eqinileyo.
2) Ukuqhekeka komnwe wegolide
Iminwe yegolide idla ngokufuna ukuxutywa, nge-engile yokuxutywa ngokubanzi ye-45°. Ubukho bee-chamfer bunokunciphisa iingozi ezinokubakho, njengoko kubonisiwe kumfanekiso.
3) Ukuvulwa kwefestile yemaski yesolder
Iphedi yokunyibilikisa yomnwe wegolide kufuneka ivulwe ngefestile yonke yebloko yemaski yokunyibilikisa, ngaphandle kwesidingo se-mesh yentsimbi.
4) Umgama phakathi kwemaski yesolder kunye nomnwe wegolide
Umgama phakathi kwephedi yokudibanisa kunye nomnwe wegolide kufuneka uhambelane nemigaqo yoyilo, ngokuqhelekileyo ufuna ukuba iphedi yokudibanisa ibe yi-1mm ubuncinane ukusuka kwindawo yomnwe wegolide, kuquka neephedi zokudibanisa.
5) Ukugqitywa komphezulu womnwe wegolide
Umphezulu womnwe wegolide akufuneki ugutyungelwe yithusi.
6) Unyango lokusika ubhedu
Zonke iileya zomaleko wangaphakathi womnwe wegolide zifuna unyango lokusika ubhedu, ngesiqhelo ububanzi bokusika ubhedu obumalunga ne-3mm. Oku kunokunciphisa umahluko we-impedance phakathi komnwe wegolide kunye nomgca we-impedance, ngelixa kukwanceda i-ESD.
Ezi zinto zingentla zizinto ezininzi ezifuna ingqwalasela ekhethekileyo xa kuyilwa i-PCB yeminwe yegolide ukuqinisekisa ukuthembeka nokusebenza komnwe wegolide.
4. Amanyathelo okukhusela xa kusetyenzwa ngeminwe yegolide
Ukuba uceba ukusebenzisa i-gold finger PCB, nantsi eminye imiqathango ekufuneka ithathwe ngexesha lokucubungula i-Rich Full Joy's PCB:
1. Uluhlu lobukhulu bePCB olunokujijwa yi-1.2mm ukuya kwi-2.4mm. IiPCB ezinobukhulu obungekho ngaphakathi kolu luhlu azinakujijwa.
2. Ubunzulu kunye ne-engile yomphetho ojikeleziweyo zihlala ziphakathi kwama-20° nama-45°. Umgama phakathi komnwe wegolide nomphetho we-PCB kufuneka wanele, ngokubanzi kucetyiswa ukuba ube yi-0.6m ukuya kwi-1.5mm, ukuze kuthintelwe ukonakalisa umnwe wegolide.
I-Rich Full Joy igxile ekucubunguleni ii-PCB zeminwe yegolide ukuqinisekisa umgangatho ophezulu kunye nokuthembeka. Inkqubo yethu inokuhlangabezana neemfuno ezahlukeneyo zoyilo kwaye ibonelele ngokusebenza okuhle kakhulu kwiprojekthi yakho.
Ii-PCB zeminwe yegolide zidlala indima ebalulekileyo kwicandelo le-elektroniki lanamhlanje, kwaye ukuthembeka nokusebenza kwazo kuxhomekeke kwiindlela zokugqiba umphezulu kunye neenkcukacha zoyilo. Ngokukhetha iindlela ezifanelekileyo zokucubungula kunye nokunikela ingqalelo kwizinto eziphambili zoyilo, kunokwenzeka ukuqinisekisa ukusebenza kakuhle kwee-PCB zeMinwe yegolide kwizicelo ezahlukeneyo. Ukuba ufuna iinkonzo zokucubungula ii-PCB zeminwe yegolide ezikumgangatho ophezulu, nceda uqwalasele iRuizhi Xinfeng, kwaye siya kukuvuyela ukukunika inkxaso.
Imibuzo neempendulo
1. Yintoni iGold Finger PCB?
I-Gold finger PCB luhlobo olukhethekileyo lwebhodi yesekethe eprintiweyo, esetyenziswa kakhulu kwizicelo ze-elektroniki ezifuna ukuthembeka okuphezulu kunye nokumelana nokuguguleka, ebizwa ngokuba yimo yayo efana nomnwe.
2. Zeziphi iindlela zokugqiba umphezulu we-PCB yeminwe yegolide?
Iindlela eziqhelekileyo zokugqiba umphezulu we-PCB zeminwe yegolide ziquka i-electroplating yegolide ye-nickel kunye ne-ENIG, ezineenzuzo ezahlukeneyo kunye nokusetyenziswa kwazo.
3. Ungayonyusa njani ukumelana nokuguguleka komnwe wegolide?
Ukwandisa ukumelana nokuguguleka kweminwe yegolide, kudla ngokufuneka kusetyenziswe i-electroplating yegolide eqinileyo ukuphucula ubulukhuni bomphezulu wayo.
4. Ngawaphi amanyathelo okhuseleko ekufuneka athathwe xa kuyilwa i-PCB yeminwe yegolide?
Xa uyila i-PCB yeminwe yegolide, kubalulekile ukuqwalasela imiba ephambili efana nokutshixa, ukuvulwa kweefestile zemaski ye-solder, umgama phakathi kwee-solder pads kunye neminwe yegolide, kunye nokugqitywa komphezulu weminwe yegolide.
5. Ungaqinisekisa njani umgangatho we-PCB yeminwe yegolide?
Sisebenzisa ubuchwepheshe obuphambili kunye nolawulo oluqinileyo lomgangatho ukuqinisekisa ukubonelelwa kweemveliso ezikumgangatho ophezulu nezithembekileyo.
