Liphiri tsa ho Kopanya PCB tse Fetotsoeng: Meaho e le 'Ngoe ho isa ho e 4 e Hlalositsoeng (Tataiso ea PI/PET)
Ho utloisisa tokelo Ho bokellana ha PCB e Flex e bohlokoa bakeng sa ho leka-lekanya tshebetso, ditjeo le botshepehi. Tataiso ena e senola mokhoa wa ho kgetha e ntle ka ho fetisisa sebopeho sa lera, thepale melao ea moralo bakeng sa lipotoloho tse tenyetsehang ho pholletsa le liindasteri ho kenyeletsoa likoloi, bongaka, lisebelisoa tsa elektroniki tsa bareki le lisebelisoa tse aparoang.
I. PCB e Flex ea Lera le le Leng: Tshebetso e Tsamaiswang ke Botenya
| Mofuta | Sebaka se ka tlas'a lefatše | Botenya | Molemo oa Bohlokoa | Nyeoe e Molemohali ea Tšebeliso | Kotsi ea ho Hlōleha Ntle le |
|---|---|---|---|---|---|
| E le 'Ngoe e Tloaelehileng | PI | 25μm | Theko e Tlase ka ho Fetisisa | Li-smartphone, Matlapa | Meokho e kobehileng ka matla |
| E teteaneng haholo | PI | 50μm | >2X Khanyetso ea Meokho | Lihokelo tsa Liindasteri | Ha e fumanehe (Ho tšoarella ho ntlafetseng) |
| Bontšang | PET | 36μm | >85% Phetiso ea Leseli | Li-strips tsa LED, Lipontšo | Ho senyeha ha mahlaseli a kotsi a UV |
Keletso ea Moenjiniere: PET 36μm e bitsa ~30% ka tlase ho PI empa e theoha ka holimo ho 105°C. Kamehla netefatsa litlhaloso tsa mocheso pele o khethoa.
II. PCB e Fetohang ea Mealo e 'Meli: Ho Leka-lekanya Lithapo le ho Tšoarella
| Mofuta | Molao oa Moralo o Bohlokoa | Khothaletso ea Koporo |
|---|---|---|
| 2L e tloaelehileng | Sekoahelo se ikhethela bakeng sa lits'ebetso tse sa fetoheng | Koporo ea ED (Tlhokomeliso ea Litšenyehelo) |
| 2L e teteaneng haholo | Sekoahelo se tlamang bakeng sa taolo ea impedance | Koporo ea RA (≥100K flex) |
| 2L e bonaletsang | Qoba limaske tse sotheloang; sebelisa likhomaretsi tse bonaletsang | Koporo e Menoang |
Thuto ea Nyeoe: Sesebelisoa se aparoang sa OEM se fokoditse phapang ya impedance ka 62% ho sebediswa sebopeho sa PI 50μm + coverlay.
III. Li-PCB tse Flex tse nang le Mekhahlelo e 4 le e nang le Mekhahlelo e mengata
1. Tšehetso ea Botenya ba Koporo
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·Mealo e ka Hare: 1/3oz (18μm), 0.5oz (35μm), 1oz (70μm)
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·Mealo e ka Ntle: Ho tšoana le ka holimo, ka qeto ea ENIG kapa Immersion Tin
2. Meaho ea Lamination
| Mofuta oa Stack | Letšoao la Boitsebiso | Na ho Sebelisitsoe Sekoahelo? | Nyeoe e Tloaelehileng ea Tšebeliso |
|---|---|---|---|
| 4L e tloaelehileng | – | Tjhe | Meralo ea bareki e amang litšenyehelo haholo |
| 4L e Tšepahalang Haholo | R | E | Likoloi le maemo a bongaka |
Bohlokoa: Bakeng sa koporo e ka hare ea 1oz, sekoahelo sea hlokahala ho fihlela maemo a IPC-2223. Ho hloleha ho e kenyelletsa hangata ho lebisa ho qhekelloeng ha koporo.
3. Li-Stack-Up tse Ikhethileng
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·Litlhophiso tse tšehelitsoeng: Li-stack tsa hybrid tsa 6-layer rigid-flex, PI/PET
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·Bonyane ba Bend Radius: Botenya ba boto kaofela ba 6 × (mohlala, 0.3mm bakeng sa meaho ea 4L)
IV. Khetho ea Thepa: Litekanyetso tsa Tshebetso ea Letšoao
| Thepa | Letšoao le Phahameng | Molemo oa Bohlokoa | Litšenyehelo ka m² | Moeli oa Thempereichara |
|---|---|---|---|---|
| PI 25μm | DuPont Pyralux | Botšepehi ba maemo a khauta | $18 | 200°C |
| PI 50μm | Tamida | Ho se tsamaisane ho tlase ha CTE | $24 | 240°C |
| PET 36μm | Mitsubishi | Ho hanyetsa mahlaseli a kotsi a UV, ho boloka litšenyehelo | $11 | 105°C |
Sephetho sa Teko: Taimide PI 50μm e phela lipotolohong tse 200,000 tse feto-fetohang, e leng se fetang haholo karolelano ea indasteri ea lipotoloho tse 50,000.
V. Qoba Liphoso Tse Jang Chelete e Ngata: Melao ea Bohlokoa ea Moralo
1. Ditshebediso tsa ho Koba ka Matla
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·E hlokahala: RA Koporo + PI ≥25μm; qoba libaka tse thata libakeng tse fetohang
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·QobaKoporo ea ED libakeng tse kobehileng - e ka petsoha ka makhetlo a ka tlase ho 5,000
2. Meralo ea Maqhubu a Phahameng
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·Sebelisa Rogers RO3000 letoto le nang le FCCL e se nang sekhomaretsi
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·Hloekisa Mamello ea Dr ka hare ho ±0.05 @10GHz bakeng sa ts'epo ea RF
3. Tšepo ea Kereiti ea Likoloi le ea Bongaka
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Sebelisa nomoro ea "stack-up ID" "R" bakeng sa Ho latela melao ea IPC Class 3
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Netefatsa CTE pakeng tsa mekhahlelo e ka tlase ho 15 ppm/°C ho thibela ho hloleha ha khatello ea mocheso
Lebaka Leo Tataiso ena e Fetang Maqephe a Lintlha a Tloaelehileng
Tlhahlobo ea rona ea Lihlopha tse 172 tsa tlhahiso ea Flex PCB tse hlōlehileng ke fumane hore 68% ea liphoso e tsoa ho:
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1. Ho sebelisa likarolo tsa koporo tse ka hare tsa 1oz ntle le ho koahela (ho tlosa litšila)
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2. Ho sebedisa di-substrate tsa PET dibakeng tsa mocheso (tshenyo ya phallo ya metsi hape)
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3. Ho sebedisa koporo ya ED dibakeng tse fetohang (ho hloleha ha mokhathala pele ho nako)
Ho THABO E TLETSENG E RUILENG, re feta maemo ka:
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·Database ea DNA ea Boitsebiso: Lipotoloho tse fetang 50,000 tsa data ea liteko mabapi le metsoako ea PI/PET
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·Ketane ea Phepelo AI: E bolela esale pele likotsi tsa nako ea ho etella pele bakeng sa Taiflex, DuPont, le ba bang
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·Mohlahlobi oa Stack-Up: Lifolakha li fapana ka mekhahlelo pele ho lisebelisoa kapa tlhahiso
Hlahloba Haholoanyane ka Moralo le Tlhahiso ea PCB e Flex
- ·Litšebeletso tsa Tlhahiso le Kopano ea PCB e Flex – Kakaretso e felletseng ea ts'ebetso ea tlhahiso le bokhoni.
- ·Tataiso ea Moralo oa PCB e Flex - Mekhoa e metle ea ho hlophisa, ho bokella le ho laola impedance.
- ·Lintlha tsa Litšenyehelo le Khoteshene tse Fetotsoeng tsa PCB - Utloisisa lintho tse bakang litšenyehelo le mokhoa oa ho ntlafatsa tekanyetso ea hau.
- ·Khetho ea Lintho tse Flex PCB – Temohisiso mabapi le LCP, PI, mefuta ea sekhomaretsi le lifoile tsa koporo.
- ·PCB e Flex vs Rigid-Flex: Ke Efe eo U ka e Khethang? – Papiso ea tekheniki le litšenyehelo bakeng sa ho etsa liqeto tse betere.
🌐 Lisebelisoa tse Tšepahalang le Maemo a Indasteri
- ·Maemo a IEEE bakeng sa Moralo oa PCB o Potlakileng – Referense bakeng sa botšepehi ba lets'oao le litataiso tsa impedance.
- ·Tekanyetso ea IPC-6013 bakeng sa Lipotoloho tse Tenyetsehang – Litlhokahalo tsa ho tšoaneleha le ho amoheloa bakeng sa lipotoloho tse tenyetsehang.
- ·Patlisiso ea 'Maraka oa Prismark – Ponelopele le temohisiso mabapi le 'maraka oa lisebelisoa tsa elektroniki tse tenyetsehang.
