Musiyano uripo pakati peCeramic PCBs neTraditional FR4 PCBs
Tisati takurukura nyaya iyi, ngatitangei tanzwisisa kuti maPCB eceramic chii uye kuti maPCB eFR4 chii.
Bhodhi reCeramic Circuit rinoreva rudzi rwebhodhi redunhu rinogadzirwa zvichibva pazvinhu zveceramic, rinozivikanwawo seCeramic PCB (bhodhi redunhu rakadhindwa). Kusiyana nepurasitiki yakajairika yegirazi yakasimbiswa nefiber (FR-4), mabhodhi edunhu receramic anoshandisa mapurasitiki eceramic, anogona kupa kugadzikana kwekupisa kwakanyanya, simba remakanika riri nani, hunhu huri nani hwe dielectric, uye hupenyu hurefu. MaPCB eCeramic anonyanya kushandiswa mumaseketi ane tembiricha yakakwira, mafrequency akakwira, uye ane simba rakawanda, akadai semwenje yeLED, ma amplifiers emagetsi, ma semiconductor lasers, ma RF transceivers, ma sensors, uye zvishandiso zve microwave.
Bhodhi reChikamu rinoreva zvinhu zvekutanga zvezvikamu zvemagetsi, zvinozivikanwawo sePCB kana bhodhi rechikamu rakadhindwa. Inotakura zvinhu zvemagetsi nekudhinda mapatani esimbi pazvikamu zvisingafambise simba, uye kugadzira nzira dzinofambisa simba kuburikidza nemaitiro akadai sekuora kwemakemikari, mhangura yemagetsi, uye kuboora.
Izvi zvinotevera kuenzanisa pakati peCCL yeceramic neFR4 CCL, kusanganisira mutsauko wavo, zvakanakira nezvakaipira.
| Hunhu | Ceramic CCL | FR4 CCL |
| Zvikamu zveZvinhu | Ceramic | Epoxy resin yakasimbiswa negirazi fiber |
| Kufambisa kwemhepo | N | UYE |
| Kufambisa kwekupisa (W/mK) | 10-210 | 0.25-0.35 |
| Hurefu hwehukobvu | 0.1-3mm | 0.1-5mm |
| Dambudziko rekugadzirisa | Yakakwirira | Zvakaderera |
| Mutengo wekugadzira | Yakakwirira | Zvakaderera |
| Zvakanakira | Kugadzikana kwakanaka pakupisa kwepamusoro-soro, kushanda zvakanaka kwe dielectric, simba rakawanda remakanika, uye hupenyu hurefu hwebasa | Zvinhu zvemazuva ano, mutengo wakaderera wekugadzira, kugadziriswa kuri nyore, kwakakodzera kushandiswa kwenguva pfupi |
| Zvakashata | Mutengo wekugadzira wakakwira, kuoma kwekugadzirisa, kwakakodzera chete kumashandisirwo anoitwa kakawanda kana ane simba guru | Kugara kwe dielectric kusina kugadzikana, kuchinja kukuru kwekushisa, simba shoma remuchina, uye kukanganiswa nehunyoro |
| Maitiro | Parizvino, kune mhando shanu dzakajairika dzeCCL dze ceramic thermal, dzinosanganisira HTCC, LTCC, DBC, DPC, LAM, nezvimwewo. | Bhodhi rekutakura reIC, Rigid-Flex board, HDI yakavigwa/bofu kuburikidza nebhodhi, bhodhi rine mativi maviri, bhodhi rine mativi akawanda |
PCB yeCeramic
Minda yekushandisa yezvinhu zvakasiyana-siyana:
Alumina Ceramic (Al2O3): Ine insulation yakanaka kwazvo, kugadzikana pakupisa kwakanyanya, kuomarara, uye simba remakanika kuti ikwanise kushandiswa mumidziyo yemagetsi ine simba guru.
Aluminium Nitride Ceramics (AlN): Iine thermal conductivity yakanyanya uye kugadzikana kwakanaka kwethermal, yakakodzera michina yemagetsi ine simba guru uye minda yemwenje ye LED.
Zirconia ceramics (ZrO2): ine simba rakawanda, kuomarara kwakanyanya uye kuramba kupfeka, yakakodzera michina yemagetsi ine simba rakawanda.
Minda yekushandiswa kwemaitiro akasiyana:
HTCC (High Temperature Co fired Ceramics): Yakakodzera kushandiswa pakupisa kwakanyanya uye pakupisa kwakanyanya, senge magetsi emagetsi, ndege, kutaurirana nesatellite, kutaurirana kwemaziso, michina yekurapa, magetsi emotokari, petrochemical nedzimwe nzvimbo. Mienzaniso yezvigadzirwa inosanganisira ma LED ane simba guru, ma amplifiers emagetsi, ma inductors, masensa, ma capacitor ekuchengetedza simba, nezvimwewo.
LTCC (Low Temperature Co fired Ceramics): Yakakodzera kugadzirwa kwemidziyo ye microwave yakaita seRF, microwave, antenna, sensor, filter, power divider, nezvimwewo. Pamusoro pezvo, inogonawo kushandiswa mune zvekurapa, zvemotokari, zvemuchadenga, zvekutaurirana, zvemagetsi nezvimwe. Mienzaniso yezvigadzirwa inosanganisira microwave modules, antenna modules, pressure sensors, gas sensors, acceleration sensors, microwave filters, power dividers, nezvimwewo.
DBC (Direct Bond Copper): Yakakodzera kupisa michina ine simba guru (senge IGBT, MOSFET, GaN, SiC, nezvimwewo) ine simba rakanaka rekupisa uye simba remakanika. Mienzaniso yezvigadzirwa inosanganisira mamodule emagetsi, maelectronic emagetsi, macontroller emotokari dzemagetsi, nezvimwewo.
DPC (Direct Plate Copper Multilayer Printed Circuit Board): inonyanya kushandiswa kudzima kupisa kwemwenje ye LED ine simba guru ine hunhu hwesimba guru, kupisa kwakanyanya, uye kushanda kwemagetsi kwakanyanya. Mienzaniso yezvigadzirwa zvinosanganisira mwenje ye LED, ma UV LED, ma COB LED, nezvimwewo.
LAM (Laser Activation Metallization yeHybrid Ceramic Metal Laminate): inogona kushandiswa mukubvisa kupisa uye kugadzirisa mashandiro emagetsi mumwenje ye LED ine simba guru, mamodule emagetsi, mota dzemagetsi, nedzimwe nzvimbo. Mienzaniso yezvigadzirwa inosanganisira mwenje ye LED, mamodule emagetsi, madhiraivha emotokari dzemagetsi, nezvimwewo.
FR4 PCB
Mabhodhi ekutakura eIC, mabhodhi eRigid-Flex uye mapofu eHDI/akavigwa kuburikidza nemabhodhi imhando dzePCB dzinoshandiswa zvakanyanya, dzinoshandiswa mumaindasitiri akasiyana siyana nezvigadzirwa seizvi:
Bhodhi rekutakura reIC: Ibhodhi redunhu rinoshandiswa zvakanyanya, rinonyanya kushandiswa pakuongorora machipisi nekugadzira zvishandiso zvemagetsi. Mashandisirwo akajairika anosanganisira kugadzira masemiconductor, kugadzira zvemagetsi, ndege, zvemauto, nedzimwe nzvimbo.
Bhodhi Rigid-Flex: Ibhodhi rine zvinhu zvakawanda rinosanganisa FPC nePCB yakaoma, rine zvakanakira mabhodhi edunhu anochinjika uye akaomarara. Mashandisirwo akajairika anosanganisira magetsi emagetsi evatengi, michina yekurapa, magetsi emotokari, ndege, nedzimwe nzvimbo.
HDI yakavigwa nebhodhi: Ibhodhi redunhu rakadhindwa rine huwandu hwakawanda hwemitsetse uye diki kuti riwane kurongedza kudiki uye kushanda kwepamusoro. Mashandisirwo akajairika anosanganisira kutaurirana nefoni, makomputa, zvigadzirwa zvemagetsi, nezvimwe.
