DPC Ceramic Substrate: sarudzo yakanaka yekurongedza machipisi eLiDAR emotokari
Basa reLiDAR (Light Detection and Ranging) nderekuburitsa masaini e-infrared laser uye kuenzanisa masaini anoratidzwa mushure mekusangana nezvipingamupinyi nezviratidzo zvinoburitswa, kuitira kuti uwane ruzivo rwakadai senzvimbo, daro, kurongeka, kumhanya, maitiro, uye chimiro chechinangwa. Iyi tekinoroji inogona kudzivirira zvipingamupinyi kana kufamba kwega. Sesensor ine kunyatsojeka, LiDAR inoonekwa zvakanyanya sekiyi yekuwana kutyaira kwega kwega kwepamusoro, uye kukosha kwayo kuri kuramba kuchionekwa.
Manyuko echiedza cheLaser anoonekwa pakati pezvikamu zvikuru zveLiDAR yemotokari. Parizvino, VCSEL (vertical cavity surface emitting laser) light source ndiyo yave sarudzo inofarirwa yehybrid solid-state LiDAR neflash LiDAR mumotokari nekuda kwemutengo wayo wakaderera wekugadzira, kuvimbika kwayo kwakanyanya, small divergence angle, uye nyore kubatanidzwa kwe2D. Chip yeVCSEL inogona kuwana daro refu rekuona, kunyatsoona kwakasimba, uye kutevedzera mitemo yakasimba yekuchengetedza maziso muLiDAR yemotokari yehybrid solid-state. Pamusoro pezvo, zvinoita kuti Flash LiDAR iwane maonero akachinjika uye akafara, uye ine mabhenefiti makuru emutengo.
Zvigadziko zveceramic zvave chinhu chakanakira kurongedza chips pakushandisa LiDAR mumotokari.
Zvigadziko zvesimbi zveDPC (Direct Copper Plating) zvine thermal conductivity yakanyanya, insulation yakanyanya, high circuit accuracy, high surface smooth, uye thermal expansion coefficient inoenderana ne chip. Zvinopawo vertical interconnection kuti ienderane nezvinodiwa zveVCSEL pakurongedza.
1. Kupisa kwakanaka kwazvo
DPC ceramic substrate ine vertical interconnectivity, ichigadzira nzira dzemukati dzinofambisa magetsi dzakazvimiririra. Nekuda kwekuti ceramics zvese zviri zviviri zvinodzivirira kupisa uye zvinofambisa kupisa, zvinogona kuita kuti thermoelectric separation uye zvinobudirira kugadzirisa dambudziko rekupisa kwemachipisi eVCSEL.
2. Kuvimbika kwakanyanya
Simba remachipisi eVCSEL rakakwira zvikuru, uye kusawirirana kwekuwedzera kwekupisa pakati pechipisi nesubstrate kunogona kukonzera matambudziko ekushushikana. Kuwanda kwekuwedzera kwekupisa kwesubstrate dzeceramic kunoenderana zvikuru neVCSEL. Pamusoro pezvo, masubstrate eDPC ceramic anogona kubatanidza mafuremu esimbi nesubstrate dzeceramic kuti agadzire cavity yakavharwa, ine chimiro chakabatana, isina layer yepakati, uye yakasimba yemhepo.
3. Kubatana kwakamira
Kurongedza kweVCSEL kunoda kuiswa kwelenzi pamusoro pechip, saka gomba re3D rinofanira kuiswa mu substrate. DPC ceramic substrates dzine mukana wekubatana kwakamira uye kwakavimbika zvakanyanya, izvo zvakakodzera vertical eutectic bonding.
Mukufunga nezvekuvandudzwa kwemotokari dzakangwara, zvinhu zvesimbi zviri kuramba zvichitamba basa guru mukuvandudzwa kwemotokari itsva dzine simba. Sezvo iri hwaro hwese hwe tekinoroji, kuvandudzwa kuri kuitwa muhunyanzvi hwezvinhu kwakakosha pakutsigira kubudirira kwebasa rese.
