ʻO ka ʻokoʻa ma waena o nā PCB seramika a me nā PCB FR4 kuʻuna
Ma mua o ke kūkākūkā ʻana i kēia kumuhana, e hoʻomaopopo mua kākou i ke ʻano o nā PCB seramika a me nā PCB FR4.
ʻO ka Papa Kaapuni Ceramic e pili ana i kahi ʻano papa kaapuni i hana ʻia ma muli o nā mea keramika, i ʻike ʻia hoʻi he Ceramic PCB (papa kaapuni i paʻi ʻia). ʻAʻole e like me nā substrates plastic i hoʻoikaika ʻia i ke aniani fiber (FR-4) maʻamau, hoʻohana nā papa kaapuni keramika i nā substrates keramika, hiki ke hāʻawi i ke kūpaʻa wela kiʻekiʻe, ka ikaika mechanical ʻoi aku ka maikaʻi, nā waiwai dielectric ʻoi aku ka maikaʻi, a me ke ola lōʻihi. Hoʻohana nui ʻia nā PCB keramika i nā kaapuni wela kiʻekiʻe, alapine kiʻekiʻe, a me ka mana kiʻekiʻe, e like me nā kukui LED, nā amplifiers mana, nā lasers semiconductor, nā transceivers RF, nā sensor, a me nā mea microwave.
ʻO ka Papa Kaapuni e pili ana i kahi mea kumu no nā ʻāpana uila, i ʻike ʻia hoʻi he PCB a i ʻole ka papa kaapuni i paʻi ʻia. He mea lawe ia no ka hōʻuluʻulu ʻana i nā ʻāpana uila ma ka paʻi ʻana i nā ʻano kaapuni metala ma nā substrates non-conductive, a laila hana i nā ala conductive ma o nā kaʻina hana e like me ka pala kemika, ke keleawe electrolytic, a me ka wili ʻana.
Eia ka hoʻohālikelike ʻana ma waena o ka CCL keramika a me ka FR4 CCL, me ko lākou ʻokoʻa, nā pono a me nā hemahema.
| Nā ʻano | CCL seramika | FR4 CCL |
| Nā ʻāpana mea | Keramika | ʻO ka resin epoxy i hoʻoikaika ʻia i ke aniani fiber |
| Ka hoʻokele ʻana | N | A ME |
| Ka Hoʻokele Wela (W/mK) | 10-210 | 0.25-0.35 |
| Ka laulā o ka mānoanoa | 0.1-3mm | 0.1-5mm |
| Ka Paʻakikī o ka Hana ʻana | Kiʻekiʻe | Haʻahaʻa |
| Kumukūʻai Hana | Kiʻekiʻe | Haʻahaʻa |
| Nā Pōmaikaʻi | ʻO ke kūpaʻa wela kiʻekiʻe maikaʻi, ka hana dielectric maikaʻi, ka ikaika mechanical kiʻekiʻe, a me ke ola lawelawe lōʻihi | Nā mea hana maʻamau, ke kumukūʻai hana haʻahaʻa, ka hana maʻalahi, kūpono no nā noi alapine haʻahaʻa |
| Nā hemahema | Ke kumukūʻai hana kiʻekiʻe, ka hana paʻakikī, kūpono wale no nā noi alapine kiʻekiʻe a i ʻole ka mana kiʻekiʻe | ʻO ke kūpaʻa dielectric paʻa ʻole, nā loli wela nui, ka ikaika mechanical haʻahaʻa, a me ka maʻalahi i ka makū |
| Nā Kaʻina Hana | I kēia manawa, aia ʻelima mau ʻano maʻamau o nā CCL thermal seramika, me HTCC, LTCC, DBC, DPC, LAM, a pēlā aku. | Papa lawe IC, papa Rigid-Flex, HDI kanu ʻia/makapō ma o ka papa, papa ʻaoʻao hoʻokahi, papa ʻaoʻao pālua, papa multi-layer |
PCB keramika
Nā kahua noi o nā mea like ʻole:
ʻO ka Alumina Ceramic (Al2O3): Loaʻa iā ia ka insulation maikaʻi loa, ke kūpaʻa wela kiʻekiʻe, ka paʻakikī, a me ka ikaika mechanical e kūpono no nā mea uila mana kiʻekiʻe.
ʻO nā keramika Aluminium Nitride (AlN): Me ke alakaʻi wela kiʻekiʻe a me ke kūpaʻa wela maikaʻi, kūpono ia no nā mea uila mana kiʻekiʻe a me nā kahua kukui LED.
ʻO nā keramika Zirconia (ZrO2): me ka ikaika kiʻekiʻe, ka paʻakikī kiʻekiʻe a me ke kūpaʻa ʻana i ka ʻaʻahu, kūpono ia no nā lako uila kiʻekiʻe-voltage.
Nā kahua noi o nā kaʻina hana like ʻole:
HTCC (Nā Ceramics i hoʻoheheʻe ʻia i ka mahana kiʻekiʻe): Kūpono no nā noi wela kiʻekiʻe a me ka mana kiʻekiʻe, e like me nā mea uila mana, aerospace, kamaʻilio ukali, kamaʻilio optical, lako lapaʻau, mea uila kaʻa, petrochemical a me nā ʻoihana ʻē aʻe. ʻO nā hiʻohiʻona huahana e pili ana i nā LED mana kiʻekiʻe, nā mea hoʻoikaika mana, nā inductors, nā sensor, nā capacitors mālama ikehu, a pēlā aku.
LTCC (Low Temperature Co fired Ceramics): Kūpono no ka hana ʻana i nā mea microwave e like me RF, microwave, antenna, sensor, kānana, mea hoʻokaʻawale mana, a pēlā aku. Eia kekahi, hiki ke hoʻohana ʻia i ka lāʻau lapaʻau, kaʻa, aerospace, kamaʻilio, uila a me nā ʻoihana ʻē aʻe. ʻO nā hiʻohiʻona huahana e pili ana i nā modula microwave, nā modula antenna, nā sensor kaomi, nā sensor kinoea, nā sensor wikiwiki, nā kānana microwave, nā mea hoʻokaʻawale mana, a pēlā aku.
DBC (Direct Bond Copper): Kūpono no ka hoʻopuehu ʻana i ka wela o nā mea semiconductor mana kiʻekiʻe (e like me IGBT, MOSFET, GaN, SiC, a pēlā aku) me ka conductivity thermal maikaʻi loa a me ka ikaika mechanical. ʻO nā hiʻohiʻona huahana e komo pū me nā modula mana, nā mea uila mana, nā mea hoʻokele kaʻa uila, a pēlā aku.
DPC (Papa Kaapuni Paʻi Multilayer Copper Direct Plate): hoʻohana nui ʻia no ka hoʻopuehu ʻana i ka wela o nā kukui LED mana kiʻekiʻe me nā ʻano o ka ikaika kiʻekiʻe, ka conductivity thermal kiʻekiʻe, a me ka hana uila kiʻekiʻe. ʻO nā hiʻohiʻona huahana e pili ana i nā kukui LED, UV LED, COB LED, a pēlā aku.
LAM (Laser Activation Metallization for Hybrid Ceramic Metal Laminate): hiki ke hoʻohana ʻia no ka hoʻopuehu ʻana i ka wela a me ka hoʻonui ʻana i ka hana uila i nā kukui LED mana kiʻekiʻe, nā modula mana, nā kaʻa uila, a me nā ʻoihana ʻē aʻe. ʻO nā hiʻohiʻona huahana e pili ana i nā kukui LED, nā modula mana, nā mea hoʻokele motika kaʻa uila, a pēlā aku.
Papa hana FR4
ʻO nā papa lawe IC, nā papa Rigid-Flex a me nā papa HDI makapō/i kanu ʻia ma o nā papa he mau ʻano PCB i hoʻohana pinepine ʻia, i hoʻohana ʻia ma nā ʻoihana like ʻole a me nā huahana e like me kēia:
Papa lawe IC: He papa kaapuni paʻi maʻamau ia, i hoʻohana nui ʻia no ka hoʻāʻo ʻana i nā chip a me ka hana ʻana i nā mea uila. ʻO nā noi maʻamau e pili ana i ka hana semiconductor, ka hana uila, ka aerospace, ka pūʻali koa, a me nā ʻoihana ʻē aʻe.
Papa Rigid-Flex: He papa mea hui ia e hoʻohui i ka FPC me ka PCB paʻa, me nā pono o nā papa kaapuni paʻa a paʻa hoʻi. ʻO nā noi maʻamau e pili ana i nā mea uila mea kūʻai aku, nā lako lapaʻau, nā mea uila kaʻa, aerospace, a me nā ʻoihana ʻē aʻe.
HDI makapō/kanu ʻia ma o ka papa: He papa kaapuni paʻi kiʻekiʻe me ka nui o ka laina a me ka puka liʻiliʻi e hoʻokō ai i ka hoʻopili liʻiliʻi a me ka hana kiʻekiʻe. ʻO nā noi maʻamau e pili ana i nā kamaʻilio kelepona, nā kamepiula, nā mea uila mea kūʻai aku, a me nā kahua ʻē aʻe.
