Kuongororwa Kwakakwana kwePrinted Circuit Board (PCB) Technology: Mhando, Zvishandiso, Mashandisirwo, uye Mafambiro Eramangwana

Sechikamu chakakosha chemidziyo yemagetsi, Printed Circuit Board (PCB) inoshanda senzvimbo yetsinga yemagetsi, ichiita mabasa akakosha ekupa rutsigiro rwemakanika uye kubatana kwemagetsi kune zvikamu zvemagetsi. Nekukura nekukurumidza kwetekinoroji yemagetsi, kubva pakutakurika kwakatetepa uye kwakareruka kwemafoni kusvika pakushandisa komputa yepamusoro munzvimbo dzedata, kubva pakutumira nekukurumidza mukutaurirana kwe5G kusvika pakudzora kwakaoma mukutyaira kwemotokari, mamiriro akasiyana ekushandisa anoisa zvinodiwa zvakasiyana-siyana zvekushanda, chimiro, uye maitiro ePCB. Izvi zvakaita kuti pave nemhando dzakasiyana-siyana dzePCB. Kunzwisisa kwakakwana hunhu hwakasiyana hwePCB kwakakosha kune mainjiniya emagetsi, vaongorori nevagadziri, pamwe nevashandi vari mumaindasitiri ane hukama, kuti vagadzirise magadzirirwo emagetsi uye vawedzere kushanda kwechigadzirwa.

Kuongororwa kwehunyanzvi hwePCBs dzakarongwa nezvinhu zveSubstrate

(chimwe) MaPCB akaomarara

MaPCB akaomarara, ane kugadzikana kwawo kwakakura uye simba rawo, ave sarudzo huru yemidziyo yakawanda yemagetsi. Zvinhu zvegirazi, zvakaita seE-glass neS-glass, zvinoshandiswa zvakanyanya mukugadzira maPCB akaomarara nekuda kwehunhu hwavo hwakanaka hwekuputira uye simba remuchina. Pakati pawo, E-glass fiber inopa kushanda kwepamusoro uye inowanikwa muzvigadzirwa zvemagetsi; S-glass fiber, kune rumwe rutivi, ine simba rakawanda uye modulus, zvichiita kuti ive yakakodzera kuminda ine zvinodiwa zvakanyanya zvehunhu hwemuchina.

MaPCB akaomarara akagadzirwa nezvinhu zvepolyimide (PI) ane hunhu hwakadai sekudzivirira kupisa kwakanyanya (kunokwanisa kushanda nguva dzose pamusoro pe200°C), kudzivirira kupisa kwakanyanya (kune dielectric constant yakaderera kusvika pa3), uye kugadzikana kwakanaka kwemakemikari. Anowanzo shandiswa mumamiriro ezvinhu anodiwa zvakanyanya akadai semuchadenga uye zvemagetsi zvemauto. FR-4, sezvinhu zvinonyanya kushandiswa zve substrate zvemaPCB akaomarara, yakagadzirwa nejira regirazi rakaiswa epoxy resin. Ine hunhu hwakanaka hwemagetsi (ine simba rekudzivirira kupisa rinodarika 10^14Ω·cm) uye simba rekudzivirira kupisa (rinosangana ne UL94V-0 flame retardant grade), uye inoshandiswa zvakanyanya muzvigadzirwa zvemagetsi zvehurumende zvakaita semakomputa nemidziyo yekutaurirana.

Sema laminates ane mhangura akagadzirwa nesimbi, CEM-1 neCEM-3 ane hunhu hwawo. CEM-1, inoumbwa nemusanganiswa wegirazi nechigadziko chepapepa, ine mutengo wakaderera uye ine hunhu hwemagetsi, zvichiita kuti ikodzere zvigadzirwa zvemagetsi zvinodhura zvakanyanya. CEM-3, yakavakirwa pagirazi fiber core, inobudirira mukuita kwekucheka uye kugadzira michina, uye inowanzoshandiswa mumidziyo yemagetsi midiki.

(二) 、Flexible PCBs (FPCs)

MaPCB anochinjika (FPCs), ane mukana wekukombama uye kutetepa kwawo kwakasiyana, ane chinzvimbo chakakosha mumidziyo yemagetsi ine nzvimbo shoma. Polyimide (PI) ndeimwe yezvinhu zvikuru zveFPCs. Ine mukana wakanaka wekuchinjika (inokwanisa kutsungirira mamiriyoni emitambo yekukombama), inodzivirira kupisa kwakanyanya (ine tembiricha yekushanda kwenguva refu inopfuura 150°C), uye ine hunhu hwakanaka hwemagetsi (ine mukana wekurasikirwa ne dielectric wakaderera kusvika 0.002).

Zvinhu zvakagadzirwa nepolyester film zvakaita sepolyethylene terephthalate (PET) uye polyethylene naphthalate (PEN) zvinowanzoshandiswawo mumaFPC. Ane mabhenefiti emutengo wakaderera uye kugona kushandiswa zvakanaka, asi haana kunyanya kuderera pane PI kana tichitarisa tembiricha yepamusoro uye hunhu hwemagetsi. Maparamita akakosha ekuyera mashandiro emaFPC, akadai seredhiyasi yekukotama uye huwandu hwemadenderedzwa ekukotama aanogona kutsungirira, anokanganisa zvakananga kuvimbika uye hupenyu hwebasa reFPC mumashandisirwo anoshanda.

(Chimwe) MaPCB Akasimba-Anochinjika

MaPCB anochinjika-chinjika anobatanidza zvine hungwaru maPCB anochinjika nemaPCB anochinjika. Munzvimbo dzakachinjika, zvinhu zvakafanana zvinoshandiswa mumaPCB anochinjika, zvakaita seFR-4 kana PI rigid boards, zvinowanzo shandiswa kupa rutsigiro rwemakanika uye kugadzikana kwebhodhi redunhu, zvichiita kuti zvikamu zvemagetsi nekubatana kwemagetsi zviiswe zvakavimbika. Munzvimbo dzinochinjika, zvinhu zvinochinjika, zvakaita sePI flexible films, zvinoshandiswa kuita kuti bhodhi redunhu rigone kuchinjika.

Tekinoroji huru yemaPCB anochinjika iri mukubatanidza nzvimbo dzakatsiga nedzinochinjika. Nzira dzakajairika dzekubatanidza dzinosanganisira kusveta nelaser uye kunamatira. Kuvimbika kwezvikamu zvekubatanidza uye dhizaini yekuderedza kushushikana zvinhu zvakakosha pakuona kuti maPCB anochinjika anoshanda zvakanaka. Dhizaini ine musoro inogona kudzivirira matambudziko akadai sekukundikana kwekubatanidza kana kutapurirana kwechiratidzo chisina kujairika panguva yekukombama.

二、Hunhu hwehunyanzvi hwePCBs hwakarongwa nenhamba yezvikamu zvinofambisa magetsi

(一) MaPCB Ane Rutivi Rumwe Chete

Semhando yePCB, PCB ine divi rimwe chete ine pepa remhangura parutivi rumwe chete uye inoita mabasa edunhu kuburikidza newaya dzemativi maviri. Chimiro chayo chedunhu chiri nyore, zvichiita kuti chikwanise mimwe michina yemagetsi ine zvinodiwa zvishoma, zvakaita semabhodhi ekudzora zvishandiso zvepamba uye mabhodhi ematoyi. Maitiro ekugadzira maPCB ane divi rimwe chete ari nyore, anosanganisira matanho akadai sekucheka pepa remhangura, kudhinda mask yesolder, uye kudhinda mavara, uye mutengo wacho wakaderera. Zvisinei, nekuda kwenzvimbo shoma yewaya, kuomarara kwedunhu uye kuwedzera kushanda kwePCB dzine divi rimwe chete zvakaganhurirwa.

(二) MaPCB Ane Mativi Maviri

PCB ine mativi maviri ine foil yemhangura kumativi ese ebhodhi redunhu uye inoita kuti magetsi aenderane pakati pemativi maviri kuburikidza nemavias (mavias ane simbi). Maitiro ekugadzira mavias anowanzo sanganisira matanho akadai sekubhoboza, electroless copper plating, uye electroplating kuti ive nechokwadi chekuti madziro emukati mevias anofambiswa zvakanaka. Kuoma kwedunhu uye kugona kwekushandisa maPCB ane mativi maviri kwavandudzika zvakanyanya zvichienzaniswa nemaPCB ane mativi maviri, uye anogona kushandiswa mumabhodhi emakombiyuta, mamwe mamodule emidziyo yekutaurirana, nezvimwewo.

Mukugadzirwa kwemaPCB ane mativi maviri, kuronga waya uye kuronga kuburikidza nemagetsi ndizvo zvinhu zvakakosha. Dhizaini yakakodzera inogona kuderedza kupindira kwemasaini uye kuvandudza kusimba uye kugadzikana kwekutumira masaini.

(Chimwe) MaPCB eMultilayer

MaPCB ane ma "multilayer" akawanda ane ma "conductive layers" akawanda (kazhinji ma "layers" mana kana kupfuura), ayo akaparadzaniswa ne "insulating layers" (akadai se "prepreg sheets", ma "PP sheets"). Kuwedzera kuma "common through holes", "blind via" uye "bidded via" matekinoroji anoshandiswawo zvakanyanya muma "multilayer PCB". "blind via" i "conductive gomba" rinotangira pamusoro pe "circuit board" kuenda kune imwe "inner layer" uye haripindi mu "circuit board" yese; "bidded via" i "connecting conducting gomba" pakati pe "inner layers" uye harionekwe pamusoro pe "circuit board".

Kushandisa matekinoroji e "blind via" ne "build via" zvinobudirira kunoderedza huwandu hwe "vias" pamusoro pe "circuit board" uye kunovandudza kuwanda kwe "wiring" uye mashandiro e "signal transmission". Ma "multilayer PCB" anogona kuwana "high-density wiring" uye "high-performance" signal transmission, uye anoshandiswa zvakanyanya mumidziyo yemagetsi yepamusoro, senge "server motherboards", "smartphone motherboards", uye "high-performance graphics cards". Mukugadzirwa kwe "multilayer PCBs", zvinhu zvakaita se "lamination process", "drilling accuracy", uye electroplating quality" zvine simba guru pakushanda nekuvimbika kwe "circuit board".

tatu,Pfungwa huru dzehunyanzvi dzePCB dzakarongwa nemaitiro akakosha

(chimwe) MaPCB Akawanda Anowanzo shandiswa

MaPCB ane mafrequency akanyanya anonyanya kushandiswa mumidziyo yemagetsi inobata masaini ane mafrequency akakwira, akadai sekutaurirana pasina waya, radar, nedzimwe nzvimbo. Munguva yekutumirwa kwezviratidzo zvine mafrequency akakwira, matambudziko akadai sekurasikirwa kwechiratidzo uye kukanganisa kwechikamu anonyanya kuonekwa. Saka, maPCB ane mafrequency akakwira anofanirwa kushandisa zvinhu zvakakosha kuderedza kurasikirwa kwechiratidzo uye kuvandudza kunaka kwekutumira masaini.

Zvinhu zveRogers chimwe chezvinhu zvinoshandiswa zvakanyanya pakugadzira maPCB ane mafrequency akakwira. Chine dielectric constant yakaderera zvikuru (Dk inogona kunge yakaderera kusvika pa2.2) uye loss tangent (Df yakaderera kusvika pa0.0009), izvo zvinogona kuderedza kurasikirwa kwechiratidzo nekukanganiswa panguva yekutumira. Polytetrafluoroethylene (PTFE) nezvinhu zvayo zvakazadzwa zvinowanzo shandiswawo mumaPCB ane mafrequency akakwira, sezvo aine hunhu hwakanaka hwemagetsi ane mafrequency akakwira uye kugadzikana kwemakemikari.

Mukugadzira nekugadzira maPCB ane mafrequency akakwira, pamusoro pekusarudza zvinhu, dhizaini yezvinhu zvakaita sedunhu, kuenderana kweimpedance, uye electromagnetic shielding zvakakoshawo. Kurongeka kwedunhu kwakaringana kunogona kuderedza kupindirana pakati pezviratidzo, kuenderana kweimpedance kwakaringana kunogona kuve nechokwadi chekuti chiratidzo chinotumirwa zvakanaka, uye kudzivirira kwemagetsi kwakaringana kunogona kudzivirira masaini ane mafrequency akakwira kuti asapindirane nematunhu akapoteredza.

(二) MaPCB Akavakirwa paSimbi

MaPCB akagadzirwa nesimbi, ane simba guru rekuparadza kupisa, ave sarudzo yakanaka yemidziyo yemagetsi ine simba guru. Zvinhu zvesimbi zvakajairika zvinosanganisira aruminiyamu nemhangura. Substrate yakagadzirwa nearuminiyamu ine simba rakanaka rekuparadza kupisa uye mutengo wakaderera, uye inoshandiswa zvakanyanya munzvimbo dzakadai semwenje ye LED uye ma module emagetsi. Substrate yakagadzirwa nemhangura ine simba rekupisa rakawanda (rinenge ka1.6 pane aruminiyamu) uye yakakodzera zviitiko zvine zvinodiwa zvakanyanya zvekuparadza kupisa, senge macircuits emota ane simba guru.

Pfungwa yekuparadza kupisa kwemaPCB akavakirwa pasimbi ndeyekukurumidza kufambisa kupisa kunogadzirwa nezvinhu zvemagetsi kuburikidza nesimbi. Kuti uvandudze kushanda zvakanaka kwekuparadza kupisa, layer inochengetedza kupisa inofambisa kupisa, senge silicone pad inofambisa kupisa kana adhesive inochengetedza kupisa, inowanzo wedzerwa pakati pesimbi nemidziyo yemagetsi. Mukugadzirwa kwemaPCB akavakirwa pasimbi, kudzora ukobvu hwelayer inochengetedza kupisa uye simba rekubatanidza nesimbi zvinhu zvakakosha pakuona kuti inoshanda sei.

(三) HDI PCBs (High-Density Interconnect PCBs)

MaPCB eHDI (High-Density Interconnect PCBs), ane hunhu hwawo hwekubatanidza waya zvakanyanya uye miniaturization, anosangana nezvinodiwa zvakanyanya zvemidziyo yemagetsi yemazuva ano yenzvimbo uye mashandiro. Matekinoroji makuru eHDI PCB ari mukugadzirwa kwema micro-vias (Micro-Vias) uye kuchekwa kwemitsara midiki. Dhayamita yema micro-vias inowanzo kuve pasi pe0.1mm uye inogadzirwa uchishandisa matekinoroji epamusoro akadai sekucherwa kwelaser kana plasma etching.

Kucheka mitsetse midiki kunoda michina yekucheka yakanyatsogadzirwa uye kudzora mashandiro kuti uwane waya dzakapfava dzine upamhi hwemutsetse/mutsara uri pasi pe30μm/30μm. MaPCB eHDI anowanzo tora tekinoroji yekuvaka, zvichiita kuti pave nekubatana kwakasimba nekuisa machira ekudzivirira kupisa uye machira ekufambisa mhepo. MaPCB eHDI anoshandiswa zvakanyanya mumidziyo midiki yemagetsi yakaita semafoni, mapiritsi, uye michina inopfekwa, uye ndeimwe yematekinoroji akakosha ekuita kuti michina iyi ishande zvakanaka uye ive midiki.

Mabhodhi eIC Carrier (IC Carrier Boards)

MaIC substrates (mabhodhi ekutakura eIC) anonyanya kushandiswa pakurongedza machip, akadai seBGA (Ball Grid Array) packaging, QFN (Quad Flat No-Lead) packaging, uye FC (Flip Chip) packaging, nezvimwewo. MaIC substrates anofanira kunge aine hunhu hwekubatana kwakanyanya uye kunyatsojeka kuti awane kubatana kwakavimbika pakati pechip nedunhu rekunze.
Ma-IC substrates anowanzo tevedzera dhizaini yebhodhi rine mativi akawanda, uye pane zvinodiwa zvakasimba zvekunyatsorongeka kwemutsetse, kuburikidza nehukuru, uye kunyatsorongeka kwenzvimbo panguva yekugadzira. Panguva imwe chete, ma-IC substrates anofanirwawo kufunga nezvekutarisira kupisa uye mashandiro emagetsi kuti ave nechokwadi chekugadzikana uye kuvimbika kwechip panguva yekushanda. Nekuvandudzwa kuri kuramba kuchiitwa tekinoroji yechip, zvinodiwa zvekushanda uye kunyatsorongeka kwezvikamu zveIC zviri kuramba zvichiwedzera.

五、Hunhu hwehunyanzvi hwePCBs hwakarongwa nechimiro cheConductive Vias

(一) Mabhodhi Anopfuudzwa Nemaburi

Bhodhi rinopinda nepaburi nderimwe remhando dzakajairika dzePCB. Ma "conductive vias" aro anopinda kubva pamusoro kusvika pasi pebhodhi re "circuit", uye kubatana kwemagetsi pakati pezvikamu kunowanikwa kuburikidza ne "via electroplating process". Bhudhi rinopinda nepaburi nderumwe neukobvu hwemhangura hwemadziro anopinda nepaburi nderumwe zvinhu zvakakosha zvinokanganisa mashandiro aro emagetsi uye simba remakanika.
Dhiyamita yakakura inobatsira pakuisa zvikamu zve plug-in, asi inotora nzvimbo yakawanda yekubatanidza waya; ukobvu hwemhangura husina kukwana hwemadziro e via hunogona kukonzera kubatana kwemagetsi kusingavimbike. Munguva yekugadzira bhodhi rinopinda nepaburi, kunyatsoboorwa kwema vias uye mhando ye electroplating zvine simba guru pakushanda kwebhodhi redunhu. Pamusoro pezvo, bhodhi rinopinda nepaburi rinogonawo kushandisa nzira yekuzadza nepaburi, senge resin filling, kuti rivandudze kuvimbika kwayo uye kuramba hunyoro.

(二) Mabhodhi eMicro-Via

Mabhodhi eMicro-via anoshandisa ma-conductive vias ane dhayamita diki (kazhinji pasi pe0.15mm), akadai sema-blind micro-vias uye ma-bidden micro-vias. Kuumbwa kwema-micro-vias kunowanzo shandiswa nelaser drilling kana plasma etching technology, uye matekinoroji aya anogona kugadzira ma-micro-vias nemazvo kuti asvike pazvinodiwa ne high-density wiring.
Ma micro-vias emabhodhi e micro-via ane dhayamita diki uye nhamba huru, izvo zvinogona kuita kuti magetsi akwanise kubatanidzwa mukati menzvimbo diki uye kuvandudza nhanho yekubatanidza uye mashandiro ebhodhi redunhu. Munguva yekugadzira nekugadzira mabhodhi e micro-via, maitiro ekuzadza nekurapa pamusoro pema micro-vias anofanirwa kufungwa kuti ave nechokwadi chekuti magetsi anoshanda uye akavimbika.

(III) Mabhodhi Anoshanda Nemapofu

Ma "conductive vias" e "blind via boards" anongobva pamusoro pe "circuit board" kuenda kune imwe "inside layer" uye haapindi mu "circuit board" yese. Kuvapo kwe "blind vias" kunogona kuderedza huwandu hwe "vias" pamusoro pe "circuit board", kuwedzera huwandu hwe "wiring", uye kuderedzawo kupindirana kwezviratidzo panguva ye "transmission".
Maitiro ekugadzira mablind vias anosanganisira kuchera nelaser, electroplating mushure mekuboorera nemechanical, nezvimwewo. Nzira dzakasiyana dzekugadzira dzine mhedzisiro yakasiyana pamhando uye mutengo weblind vias. Mukugadzira mablind via boards, nzvimbo nehuwandu hweblind vias zvinofanirwa kurongwa zvine musoro kuti zvipe mukana wakazara kune zvakanakira uye kuvandudza mashandiro ecircuit board.

(四) Mabhodhi eHigh-Density Interconnect (HDI)

Mabhodhi eHigh-Density Interconnect (HDI) ane hunyanzvi hwekubatanidza zvinhu zvine density yakakura, dhayamita diki, uye mitsetse midiki, uye ndeimwe yematekinoroji akakosha ekuita kuti zvishandiso zvemagetsi zviite miniaturization uye kushanda kwepamusoro. Pamusoro pekushandisa maviya madiki ekufambisa, mabhodhi eHDI anowanawo waya dzakapfava dzine upamhi hwemutsara/mutsara usingasviki 30μm/30μm kuburikidza netekinoroji yekucheka mitsetse midiki.
Mabhodhi eHDI anowanzo tevedzera tekinoroji yekuvaka, zvichiita kuti pave nekubatana kwakasimba nekuisa machira ekudzivirira kupisa uye machira ekufambisa mhepo. Munguva yekugadzira mabhodhi eHDI, zvinodiwa zvezvinhu, michina, uye maitiro acho zvakakwirira kwazvo, uye mhando yekubatanidza yega yega inofanirwa kudzorwa zvakanyanya kuti ive nechokwadi chekuti bhodhi redunhu rinoita basa uye rakavimbika.

Mhedziso

Sehwaro hwakakosha hwetekinoroji yemagetsi, kusiyana kwemarudzi uye kuoma kwehunyanzvi hwemabhodhi edunhu akadhindwa zvinopa rutsigiro rwakasimba rwekuvandudzwa nekuvandudzwa kwemidziyo yemagetsi. Kubva pakusarudzwa kwezvinhu zve substrate kusvika pakugadzirwa kwezvikamu zvinofambisa mhepo, kubva pakushandiswa kwemaitiro akakosha kusvika pakufunga nezvenzira dzekurapa pamusoro, uye zvakare kusvika kuzvinodiwa zvehunyanzvi zveminda yakasiyana yekushandisa uye hunhu hwechimiro che conductive vias, chinongedzo chimwe nechimwe chine zvazvinoreva zvehunyanzvi.

Nekufambira mberi kuri kuramba kuchiita tekinoroji yemagetsi, zvakaita sekukura nekukurumidza kwetekinoroji itsva senge njere dzekugadzira, Internet of Things, uye big data, zvinodiwa zvepamusoro zvichaiswa pamberi pekushanda uye mashandiro ePCB. Mune ramangwana, tekinoroji yePCB ichakura ichienda kune density yakakwira, kushanda kwepamusoro, mutengo wakaderera, uye kuchengetedzwa kwakanyanya kwezvakatipoteredza, ichiramba ichikurudzira miniaturization, huchenjeri, uye kuvandudzwa kwepamusoro kwemidziyo yemagetsi. Mainjiniya emagetsi nevashandi vemaindasitiri ane hukama vanofanirwa kunyatsoteerera mafambiro ekuvandudzwa kwetekinoroji yePCB, vachiramba vachigadzira zvinhu zvitsva uye vachigadzirisa magadzirirwo kuti vasangane nezvinodiwa nemusika zviri kukura nematambudziko ehunyanzvi.

Mibvunzo Inowanzo bvunzwa：

Mubvunzo 1. Ndezvipi zvinhu zvepasi zvakajairwa zvePCB dzakasimba?

Zvinhu zvakajairika zvePCB dzakasimba zvinosanganisira magirazi (akadai seE-glass, S-glass, nezvimwewo), polyimide (PI), FR-4 (laminate ine mhangura inodzima moto inoumbwa ne epoxy resin nejira regirazi fiber), CEM-1 (laminate ine mhangura ine magirazi nepepa), uye CEM-3 (laminate ine mhangura ine girazi).

Mubvunzo wechipiri. Sei maPCB anochinjika akakodzera zvishandiso zvinopfekwa?

MaPCB anochinjika akakodzera zvishandiso zvinopfekwa nekuti zvinhu zvavo zvikuru zvakaita sepolyimide (PI), polyethylene terephthalate (PET), nezvimwewo zvinovapa kuchinjika kwakanaka, zvichiita kuti vakwanise kukotama, kupeta, uye kukotama mukati memhando yakati, izvo zvinogona kuenderana nemaumbirwo akaomarara emidziyo inopfekwa inoenderana nemuviri wemunhu. Panguva imwe chete, ane hunhu hwekuva matete uye akareruka, uye haazoremedzi zvakanyanya munhu anopfekwa, zvichizadzisa zvinodiwa zvemidziyo inopfekwa kuti ive nenzvimbo uye inyaradze.

Mubvunzo 3. Ndeapi mabasa enzvimbo yakasimba nenzvimbo inochinjika muPCB yakasimba-inochinjika?

Munzvimbo yakaoma yePCB yakasimba, zvinhu zvakasimba zve substrate zvakaita seFR-4 kana PI rigid boards zvinonyanya kushandiswa kupa rutsigiro rwemakanika uye kugadzikana, zvichivimbisa kusimba kwechimiro chebhodhi redunhu panguva yekuisa nekushandisa. Nzvimbo inochinjika, kune rumwe rutivi, inoshandisa zvinhu zvinochinjika zve substrate zvakaita sePI flexible films kuti iite basa rekukotama, kuitira kuti ienderane nekuchinja kwechimiro chemudziyo mumamiriro akasiyana ekushandiswa uye kusangana nezvinodiwa zvekushanda kwakaoma kwemakanika nemagetsi.

Mubvunzo wechina. Ndeapi musiyano mukuru uripo pakati pePCB dzine mativi maviri nemaPCB ane mativi maviri?

PCB ine divi rimwe chete ine foil yemhangura kudivi rimwe chete uye inoshandiswa pakubatanidza waya nedivi rimwe chete. Kuoma kwayo kwedunhu kwakaderera, uye yakakodzera michina yemagetsi iri nyore. Maitiro ekugadzira ari nyore uye mutengo wakaderera, asi mabasa ayo nenzvimbo yekubatanidza waya zvakaganhurirwa. PCB ine mativi maviri ine foil yemhangura kumativi ese, uye kubatana kwemagetsi pakati pemativi maviri kunowanikwa kuburikidza nema vias (kazhinji ma vias ane simbi). Kuoma kwedunhu kuri pakati nepakati, uye inogona kuita mabasa akawanda nehuwandu hwakawanda hwekushandisa, senge mamaboard emakombiyuta, zvishandiso zvekutaurirana, nezvimwewo.

Mubvunzo 5. Ndeapi mabasa e blind vias nema covered vias muma multilayer PCBs?

Ma-blind vias ari muma-multilayer PCB maburi anofambisa magetsi anotambanuka kubva pamusoro kuenda kune imwe nzvimbo yemukati uye haapindi mubhodhi rese redunhu. Anogona kushandiswa pakubatanidza magetsi pakati pezvikamu zvakasiyana, kuderedza kupindirana kwemasaini uye kuvandudza kusimba kwemasaini. Ma-vias akavigwa anobatanidza pakati pezvikamu zvemukati uye haaonekwe pamusoro. Anogona kuwana hukama pakati pezvikamu zvisina kutora nzvimbo yepamusoro, izvo zvinobatsira kuwana waya yakawanda uye kuvandudza mashandiro uye nhanho yekubatanidza yebhodhi redunhu.

Mubvunzo 6. Sei maPCB ane frequency yepamusoro achifanira kushandisa zvinhu zvakakosha?

MaPCB ane mafrequency akanyanya anoshandiswa zvakanyanya kugadzirisa masaini ane mafrequency akakwira, akadai sema microwave frequency bands uye ma millimeter-wave frequency bands, uye masaini anogona kurasikirwa panguva yekutumira. Zvinhu zvakakosha zvakaita seRogers materials, polytetrafluoroethylene (PTFE), uye zvinhu zvakazadzwa neceramic zvinoshandiswa nekuti zvinhu izvi zvine hunhu hwe low dielectric constant (Dk) uye low loss tangent (Df), izvo zvinogona kuderedza kurasikirwa kwechiratidzo zvinobudirira, kuve nechokwadi chekuti chiratidzo chakasimba, uye kusangana nezvinodiwa zvekutumira masaini ane mafrequency akakwira.

Mubvunzo 7. Ndezvipi zvishandiso zvemagetsi zvine simba guru zvakakodzera maPCB esimbi?

MaPCB akagadzirwa nesimbi akakodzera michina yakasiyana-siyana yemagetsi ine simba guru. Semuenzaniso, mumamodule emagetsi, kupisa kwakawanda kunogadzirwa panguva yekushanda, uye maPCB akagadzirwa nesimbi anogona kubvisa kupisa zvinobudirira kuti ave nechokwadi chekuti anoshanda zvakajairika. Kune michina yemwenje ye LED, anogona kukurumidza kubvisa kupisa kunogadzirwa nema LED, zvichivandudza kushanda zvakanaka kwemwenje uye hupenyu hwemwenje. Kune macircuit emotor drive, anogona kubatsira kubvisa kupisa kunogadzirwa panguva yekushanda kwemotor, zvichiita kuti circuit ishande zvakanaka.

Mubvunzo 8. Ndezvipi zvinhu zvakakosha zvehunyanzvi zveHDI PCBs?

Hunhu hukuru hwehunyanzvi hweHDI PCBs hunosanganisira kushandiswa kwemadhayamita madiki (Micro-Via, anowanzova pasi pe0.1mm), ayo anoumbwa kuburikidza nematekinoroji epamusoro akadai sekubhoboza nelaser uye plasma etching; kuva nemitsara midiki (Fine Line), iyo inogona kuwana waya dzakapfava dzine upamhi hwemutsara/mutsara wepasi pe30μm/30μm; kushandisa tekinoroji yekuvaka kuti iwedzere huwandu hwema layers uye kuwana high-density interconnection; uye kuva nekubatana kwakanaka nemaitiro ekugadzira tekinoroji yesurface mount (SMT), iyo yakakodzera zvinodiwa nemidziyo yemagetsi midiki.

Mubvunzo 9. Ndedzipi mhando dzemachira epamusoro ePCB dzakapfapfaidzwa netini?

Mhando dzema "top-free tin layers" ema "tin-spray" e "tin-spray" anosanganisira "pure tin" (Pure Tin), "tin-lead alloy" (Tin-Lead Alloy), uye "lead-free tin spray", dzakadai seSn-Cu (tin-copper alloy), Sn-Ag-Cu (tin-silver-copper alloy), nezvimwewo. "Lead-free tin spray" imhando yave ichifarirwa zvishoma nezvishoma kuti isangane nezvinodiwa zvekuchengetedza nharaunda.

Mubvunzo 10. Sei maPCB akafukidzwa negoridhe achiwanzoshandiswa mumidziyo yemagetsi yepamusoro-soro?

MaPCB akafukidzwa negoridhe anowanzo shandiswa mumidziyo yemagetsi yepamusoro-soro nekuti goridhe resimbi rinofukidza pamusoro paro (rakakamurwa kuita goridhe rakaoma negoridhe rakapfava) rinogona kupa simba rakanaka remagetsi, kuderedza kuramba kusangana, uye kuve nechokwadi chekuvimbika kwekubatana kwemagetsi. Panguva imwe chete, goridhe rine simba rakanaka rekudzivirira oxidation, iro rinogona kudzivirira ngura yezvakatipoteredza uye ngura yemakemikari, kuwedzera hupenyu hwebasa rebhodhi redunhu, uye kusangana nezvinodiwa zvakasimba zvemidziyo yemagetsi yepamusoro-soro senge aerospace, michina yekurapa, uye nzvimbo dzekutaurirana kuti dzive dzakavimbika uye dzakagadzikana.

Mubvunzo 11. Chii chinofanira kutariswa paunenge uchichengeta maPCB eOSP?

MaPCB eOSP anoiswa pamusoro nefirimu rekuchengetedza rinochinjika kumasokisi. Nguva yawo yekuchengetera ipfupi, uye kungwarira kunofanira kupihwa kudzivirira hunyoro. Anofanira kuchengetwa munzvimbo yakaoma uye isina hunyoro hwakanyanya kudzivirira kutadza kwefirimu rekuchengetedza rinochinjika kumasokisi nekuda kwehunyoro, izvo zvinogona kukanganisa kugona kwebhodhi redunhu. Panguva imwe chete, kungwarira kunofanirawo kupihwa pakuchenesa nzvimbo kudzivirira guruva netsvina kuti zvisasvibise pamusoro pebhodhi redunhu, izvo zvinogona kukanganisa kushanda kwewelding nekushandiswa kwayo.

Mubvunzo 12. Ndezvipi zvinodiwa pakushanda kwePCB pamabhodhi emakombiyuta?

Mabhodhi emakomputa akadai semamabhodhi emakombiyuta, makadhi emifananidzo, uye mabhodhi emaseva ane zvinodiwa kuti maPCB akwanise kugadzirisa nekutumira data nekukurumidza. Anofanira kutsigira maprotocol ekutumira masaini ekumhanya kwakanyanya akadai sePCI-E bus, USB interfaces, uye SATA interfaces. Anofanira kunge aine mashandiro akanaka emagetsi kuti ave nechokwadi chekuti masaini akasimba uye akagadzikana. Mamabhodhi emakombiyuta anofanira kubatanidza zvinhu zvakasiyana-siyana zvakakosha, zvakaita sechipset, BIOS chip, uye power supply circuit, nezvimwewo, zvichida kuti PCB ive nehurongwa hwakanaka uye huwandu hwepamusoro hwekubatanidza. Mabhodhi emaseva anofanirawo kutsigira maCPU akawanda uye ndangariro yakakura, zvichiisa zvinodiwa zvakanyanya pakukwanisa kutakura uye kuvimbika kwePCB.

Mubvunzo 13. Sei mabhodhi emotokari achifanira kuva akavimbika zvakanyanya?Mabhodhi emotokari anoshandiswa kumasisitimu emagetsi emotokari. Munguva yekutyaira, mota dzichasangana nemamiriro akasiyana-siyana akaomarara ezvakatipoteredza, akadai sekuzunguzika, kukanganiswa, uye shanduko mukupisa kwakanyanya nekuderera (zvinowanzo dikanwa kuti ishande zvakanaka mukati me -40°C kusvika 125°C). Kana bhodhi remotokari risina kuvimbika kwakakwana, zvinogona kukonzera kukundikana musisitimu yemagetsi emotokari, zvichikanganisa mashandiro akajairika emotokari uye kuchengetedzeka kwekutyaira. Saka, mabhodhi emotokari anofanirwa kuve akavimbika zvakanyanya kuti ave nechokwadi chekuti mashandiro akasimba munzvimbo dzakaoma.

Mubvunzo 14. Chii chinoshanda neIC substrate (IC carrier board) pakurongedza machip?

Chikamu cheIC (IC carrier board) chinonyanya kuita basa rekubatanidza chip nedunhu rekunze mukurongedza chip. Semuenzaniso, nzira dzekurongedza dzakadai seBGA (Ball Grid Array) packaging, QFN (Quad Flat No-Lead) packaging, uye FC (Flip Chip) packaging dzese dzinoda kuwana kubatana kwakavimbika kuburikidza neIC substrate. Inofanirwa kuve nehunhu hwekubatana kwakanyanya uye kunyatsojeka kuti isangane nezvinodiwa zvehuwandu hwakawanda hwekutumira masaini pakati pechip nedunhu rekunze. Panguva imwe chete, manejimendi yekupisa uye mashandiro emagetsi zvinofanirwawo kufungwa nezvazvo kuti ive nechokwadi chekuti kupisa kunobva panguva yekushanda kwechip kunogona kunyungudika zvinobudirira uye chiratidzo chinogona kupfuudzwa zvakadzikama, zvichiita kuti chip ishande zvakanaka.

Mubvunzo 15. Ma micro-vias emabhodhi e micro-via anogadzirwa sei?

Ma micro-vias emabhodhi e micro-via anowanzo gadzirwa ne laser drilling kana plasma etching technology. Laser drilling inoshandisa laser beam ine simba guru kuti ipenye circuit board, zvichiita kuti zvinhu zvibve nekukasika kuti zvigadzire micro-vias. Plasma etching, kune rumwe rutivi, inoshandisa plasma kuti iite chemically ne surface material ye circuit board kubvisa zvikamu zvisingadiwi, nokudaro ichigadzira diki via diameters, dzakadai se blind micro-vias uye buried micro-vias, nezvimwewo, kuti iwane high-density wiring.