Umehluko Phakathi Kwama-PCB E-Ceramic Nama-PCB E-FR4 Endabuko

Ngaphambi kokuxoxa ngale ndaba, ake siqale siqonde ukuthi ayini ama-PCB e-ceramic nokuthi ayini ama-PCB e-FR4.

Ibhodi Yesekethe Yesigungu Sesigungu ibhekisela ohlotsheni lwebhodi yesekethe ekhiqizwa ngokusekelwe ezintweni zesekethe, eyaziwa nangokuthi i-Ceramic PCB (ibhodi yesekethe ephrintiwe). Ngokungafani nezingxenye zepulasitiki eziqinisiwe zeglasi ezivamile (FR-4), amabhodi esekethe esigungu Sesigungu asebenzisa izingxenye zesekethe, ezinganikeza ukuzinza okuphezulu kokushisa, amandla angcono omshini, izakhiwo ze-dielectric ezingcono, kanye nokuphila isikhathi eside. Ama-PCB e-Ceramic asetshenziswa kakhulu kumasekethe anokushisa okuphezulu, ama-frequency aphezulu, kanye namandla aphezulu, njengezibani ze-LED, ama-amplifiers kagesi, ama-laser e-semiconductor, ama-transceivers e-RF, ama-sensor, kanye namadivayisi e-microwave.

Ibhodi Lesekethe libhekisela ezintweni eziyisisekelo zezingxenye ze-elekthronikhi, ezaziwa nangokuthi i-PCB noma ibhodi lesekethe eliphrintiwe. Liyisithwali sokuhlanganisa izingxenye ze-elekthronikhi ngokuphrinta amaphethini wesekethe yensimbi ezindaweni ezingezona ezihambisa umoya, bese kudala izindlela ezihambisa umoya ngezinqubo ezifana nokugqwala kwamakhemikhali, ithusi le-electrolytic, kanye nokubhoboza.

Okulandelayo ukuqhathanisa phakathi kwe-CCL yobumba kanye ne-FR4 CCL, okuhlanganisa umehluko wazo, izinzuzo kanye nokungalungi.

I-PCB yobumba

Amasimu okusetshenziswa kwezinto ezahlukene:

I-Alumina Ceramic (Al2O3): Inokushisa okuhle kakhulu, ukuqina kokushisa okuphezulu, ubulukhuni, kanye namandla okusebenza ukuze ifaneleke kumadivayisi kagesi anamandla aphezulu.

I-Aluminium Nitride Ceramics (AlN): Njengoba inamandla okushisa aphezulu kanye nokuzinza okuhle kokushisa, ifaneleka kumadivayisi kagesi anamandla aphezulu kanye nezibani ze-LED.

I-Zirconia ceramics (ZrO2): enamandla aphezulu, ubulukhuni obuphezulu kanye nokumelana nokuguguleka, ifanele imishini kagesi enamandla aphezulu.

Izinkambu zohlelo lokusebenza zezinqubo ezahlukene:

I-HTCC (i-High Temperature Co fired Ceramics): Ifanele ukusetshenziswa kwezinhlelo zokusebenza ezisebenzisa izinga lokushisa eliphezulu kanye namandla aphezulu, njenge-electronics yamandla, i-aerospace, ukuxhumana ngesathelayithi, ukuxhumana kwe-optical, imishini yezokwelapha, i-electronics yezimoto, i-petrochemical kanye neminye imboni. Izibonelo zomkhiqizo zifaka phakathi ama-LED anamandla aphezulu, ama-amplifier wamandla, ama-inductor, ama-sensor, ama-capacitor okugcina amandla, njll.

I-LTCC (I-Low Temperature Co fired Ceramics): Ifanelekela ukukhiqizwa kwamadivayisi e-microwave njenge-RF, i-microwave, i-antenna, inzwa, isihlungi, isihlukanisi samandla, njll. Ngaphezu kwalokho, ingasetshenziswa kwezokwelapha, kwezimoto, ezindizayo, kwezokuxhumana, kwe-elekthronikhi nakweminye imikhakha. Izibonelo zomkhiqizo zifaka amamojula e-microwave, amamojula e-antenna, izinzwa zokucindezela, izinzwa zegesi, izinzwa zokusheshisa, izihlungi ze-microwave, izihlukanisi zamandla, njll.

I-DBC (Direct Bond Copper): Ifanelekela ukushabalalisa ukushisa kwamadivayisi e-semiconductor anamandla aphezulu (njenge-IGBT, i-MOSFET, i-GaN, i-SiC, njll.) anomoya omuhle kakhulu wokushisa kanye namandla omshini. Izibonelo zomkhiqizo zifaka amamojula kagesi, ama-elekthronikhi kagesi, abalawuli bezimoto zikagesi, njll.

I-DPC (Ibhodi Lesekethe Eliphrintiwe Le-Direct Plate Copper Multilayer): isetshenziselwa kakhulu ukushabalalisa ukushisa kwezibani ze-LED ezinamandla aphezulu ezinezici zokuqina okuphezulu, ukuhanjiswa kokushisa okuphezulu, kanye nokusebenza okuphezulu kukagesi. Izibonelo zomkhiqizo zifaka phakathi izibani ze-LED, ama-LED e-UV, ama-LED e-COB, njll.

I-LAM (i-Laser Activation Metallization ye-Hybrid Ceramic Metal Laminate): ingasetshenziswa ekushabalaliseni ukushisa kanye nokwenza ngcono ukusebenza kukagesi ezibanini ze-LED ezinamandla aphezulu, amamojula kagesi, izimoto zikagesi, kanye neminye imikhakha. Izibonelo zomkhiqizo zifaka phakathi izibani ze-LED, amamojula kagesi, abashayeli bezimoto zikagesi, njll.

I-PCB ye-FR4

Amabhodi okuthwala e-IC, amabhodi e-Rigid-Flex kanye namabhodi e-HDI angaboni/angcwatshwe ngamabhodi yizinhlobo ezivame ukusetshenziswa zama-PCB, ezisetshenziswa ezimbonini nasemikhiqizweni ehlukene kanje:

Ibhodi lenkampani ye-IC: Liyibhodi lesifunda eliphrintiwe elivame ukusetshenziswa, elisetshenziswa kakhulu ekuhlolweni nasekukhiqizweni kwama-chip kumadivayisi kagesi. Izicelo ezivamile zifaka phakathi ukukhiqizwa kwe-semiconductor, ukukhiqizwa kwe-elekthronikhi, izindiza, ezempi, kanye neminye imikhakha.

Ibhodi Eliqinile Neliguquguqukayo: Liyibhodi lezinto ezihlanganisiwe elihlanganisa i-FPC ne-PCB eqinile, kanye nezinzuzo zamabhodi wesekethe aguquguqukayo naqinile. Izicelo ezivamile zifaka phakathi ama-electronics abathengi, imishini yezokwelapha, ama-electronics ezimoto, izindiza, kanye neminye imikhakha.

I-HDI ifihliwe/ifihliwe ngebhodi: Iyibhodi yesekethe ephrintiwe exhumanisayo enobuningi obukhulu enobukhulu bemigqa ephezulu kanye nokuvulwa okuncane ukuze kufezwe ukupakishwa okuncane kanye nokusebenza okuphezulu. Izinhlelo zokusebenza ezivamile zifaka phakathi ukuxhumana kweselula, amakhompyutha, ama-electronics abathengi, kanye neminye imikhakha.