1. Selelekela
Tlhahisong ea sejoale-joale ea elektroniki, ho beoa ha likarolo ke mohato oa mantlha oa ts'ebetso ea SMT (Surface Mount Technology), e susumetsang ka kotloloho ts'epo le ts'ebetso ea PCBA (Seboka sa Boto ea Potoloho e Hatisitsoeng). Ha lisebelisoa tsa elektroniki li ntse li ba nyane le ho kopanngoa ka bongata, liphephetso tsa ho beoa li eketseha haholo - ho tloha ho sebetsana le likarolo tse nyane haholo tsa 01005 (0.4×0.2mm) ho fihlela litlhoko tsa ts'epo tsa liphutheloana tse rarahaneng joalo ka BGA le QFN (IPC-7351B, 2014).
2. Likarolo tsa Bohlokwa tsa Tekheniki tsa Mekhoa ea ho Phahamisa
2.1 Ho lata le ho beha thepa ka nepo e phahameng
- ·Ho lata ka nepo: E sebelisa matsoho a roboto a thata haholo le li-nozzle tsa vacuum tse ikamahanyang le maemo ho laola matla a ho nka le ho qoba tšenyo ea likarolo (Juki, 2023).
- ·Tekanyo e Bohlale ea Pono: E sebelisa litsamaiso tsa optical tse nang le qeto e phahameng (mohlala, pono ea 3D ea Fuji NXT) ho hokahanya likarolo ka mokhoa o feto-fetohang ka ho nepahala ha ±15μm (Fuji, 2021).
- ·Puseletso e Matla ea ho Phahamisa: E lokisa kgatello ya Z-axis ho latela tlhahlobo ya PCB warpage ho netefatsa hore ho na le kgokelo e nepahetseng ya solder paste (Panasonic NPM Series Technical Manual).
2.2 Ntlafatso ea Ts'ebetso le Tsamaiso ea Lintlha
- ·Ntlafatso ea Lenaneo la ho Kenya: E sebelisa li-algorithms tse bohlale tsa ntlafatso ea liphanele ho khutsufatsa litsela tsa maeto a hlooho le ho eketsa bokhoni ba ho beha (Pampiri e Tšoeu ea Yamaha YSM20R).
- ·Database ea Likarolo: E kopanya diparamithara tse tloaelehileng tsa IPC-7351 bakeng sa maano a nepahetseng a ho sebetsana le dipakete tsa 0201, BGA, le tse ding (SMTnet, 2020).
- ·Kopanyo ea Sistimi ea MES: E netefatsa netefatso ea BOM le thibelo ea liphoso tse iketsang bakeng sa ho se lumellane ha thepa kapa ho kenya ka morao.
3. Lisebelisoa tsa Bohlokoa le Taolo ea Ts'ebetso
3.1 Taolo ea Linotlolo le Phepelo
- ·Tlhokomelo ea Boemo ba Nozzle: Ho lemoha ka vacuum ka nako ea sebele (moeli ≥ -80kPa) ho qala ho hloekisa kapa ho nkela sebaka ka bohona ha ho fumanoa liphoso (Juki, 2023).
- ·Thibelo ea Phoso ea Fepa: Ho latela khoutu ea RFID/QR ho netefatsa hore ho latela mohlala le tsamaiso ea potoloho ea bophelo ho qoba ho jara litheipi le ho fepa lintho tse se nang letho (NEPCON Asia, 2023).
3.2 Tšepahalo ea Phepelo
- ·Tlhokomelo e Thibelang: Tekanyo ea lisebelisoa tsa ho fepa lipotolohong tse ling le tse ling tse limilione tse 2 e fokotsa ho kheloha ha mechini.
- ·Temoso ea ho se Tloaelehe: Li-sensor tsa ho thothomela li lemoha motsamao o sa tloaelehang esale pele, e leng se nolofalletsang ho tima le ho hlokomela lintho ka potlako.
4. Boleng ba Bareki le Likopo tsa Indasteri
- ·Lisebelisoa tsa Elektroniki tsa Likoloi: E fihlela maemo a ts'ebetso a polokeho a ISO 26262 bakeng sa li-module tsa ECU tse nang le ts'epo ea bophelo bo bolelele.
- ·Lisebelisoa tsa Bongaka: E latela maemo a IEC 60601, e fokotsa likotsi tsa ho hloleha ka lebaka la ho se behe sebaka hantle.
- ·Lisebelisoa tsa Puisano: E tšehetsa ho kenngoa ha molumo oa ≤0.3mm bakeng sa li-module tsa 5G mmWave le liboto tsa puisano tse lebelo le phahameng.
5. Papiso ea Tshebetso ea Lisebelisoa tse Tloaelehileng
| Mohlala oa Lisebelisoa | Ho nepahala ha Sebaka (μm) | Lebelo (CPH) | Karolo e fokolang |
|---|---|---|---|
| Yamaha YSM20R | ±25 | 96,000 | 01005 |
| JUKI RS-1R | ±30 | 85,000 | 0201 |
| Panasonic NPM-W2 | ±20 | 108,000 | 01005 |
(Mohloli: Tlaleho ea Teko ea NEPCON Asia 2023)
6. Kakaretso: Linotlolo tsa ho Hloma ka Tsela e Tšepahalang Haholo
- ·Lisebelisoa tse Nepahetseng: Puseletso ea li-axis tse ngata le ho nepahala ha boemo ba micron.
- ·Mekhoa e Bohlale ea Taolo: Taolo e felletseng ea nozzle/feeder.
- ·Lintlha tse Tloaelehileng: Ho kopanngoa ha laeborari ea likarolo tsa IPC + ho latela ha MES.
Ka ho phethahatsa taolo e hlophisehileng ho pholletsa le ts'ebetso eohle, bahlahisi ba ka fihlella chai ea pele ea ≥99.95% - e leng tekanyetso indastering ea lisebelisoa tsa elektroniki - e fang bareki boleng bo tsitsitseng le ts'ebetso e sebetsang ea tlhahiso.
Litšupiso
- 1.IPC-7351B, Litlhoko tse Akaretsang bakeng sa Moralo oa ho Thabisa Sebaka, 2014.
- 2. Mochini oa Fuji, Buka ea Taelo ea Theknoloji ea NXT III, 2021.
- 3.Juki, Tlaleho ea Theknoloji ea ho Beha Lintho Tse Tsoetseng Pele, 2023.
- 4.NEPCON Asia, Letshwao la Disebediswa tsa SMT, 2023.
- 4.SMTnet, Tlhahlobo ea Boleng ba Ts'ebetso, 2020.
