Ho Finyella Tlhahiso e se Nang Bofokoli ka Lipilara tse 'Nè tsa Theknoloji
I. Bohlokwa ba Tekheniki: Taolo e Nepahetseng ya ho Hlahiswa ha Solder Paste
Temoho ea Indasteri: "Liphoso tsa ho kopanya tsa 60%-70% li simoloha khatisong (IPC-7525 7.1.2). Ho beha ka nepo ke mokhoa oa pele oa tšireletso."
Lipakane tsa Taolo ea Bongata
| Tekanyo | Litlhoko tse Tloaelehileng | Referense ea IPC |
|---|---|---|
| Ho nepahala ha Molumo | Sekhahla sa Phetisetso > 85%, CPK ≥ 1.67 | J-STD-005 4.3.2 |
| Botšepehi ba Sebopeho | Ho theoha ha mobu ≤ 10%, Ha ho na ho heleha/ho putlama | IPC-SM-817 3.2.1 |
| Ho nepahala ha Boemo | Offset ≤ 15% ea Bophara ba Pad | IPC-A-610H 8.2.3.4 |
II. Ntlafatso e Tebileng ea Litšiea tse 'Nè tsa Tekheniki
1. Moralo oa Stencil: Template ea Nano-scale Precision
- ·Ho seha ka laser + ho polishing ka motlakase (Ra ≤ 0.6μm, ho latela Sehlopha sa 3)
- ·Bolelele ba ho nyoloha/ho theohela tlase ≤ 0.08mm (moralo o thibelang ho thulana ha lehare)
- ·Sekoahelo sa SiN nano se fokotsa diphoso tsa bolo ya solder ka 38%
- ·Moralo oa lesoba le lenyenyane bakeng sa likarolo tsa 01005 (karolelano ea sebaka ≥ 0.71)
Mokgwa wa Mosebetsi wa Netefatso ya Moralo: PCB → DFM → Mohlala → Tlhahiso e Kgolo
2. Liparamente tsa ho Hatisa: Taolo e Bohlale e koetsoeng
| Paramethara | Mefuta e Tloaelehileng | Moeli oa Kotsi |
|---|---|---|
| Khatello ea Squeegee | 100 ± 20 g/mm | >150 g/mm → phetoho ea stencil |
| Lebelo la Karohano | 1.5 ± 0.5 mm/s | >3 mm/s → ho betla mabitla +250% |
| Maemo a Tikoloho | 23 ± 1℃ / 50 ± 5% RH | ΔT > 3℃ → phetoho ea molumo ± 12% |
Taolo ea AI e koetsoeng: Tlhokomelo ea SPI → mohlala oa LSTM → puseletso e matla → CPK ≥ 2.0
3. Setlolo sa Solder: Ho Latela Potoloho e Felletseng ea Bophelo
- ·Sebaka se batang sa polokelo ho -40℃
- ·Ho futhumatsa butle-butle: 5℃ lihora tse ling le tse ling tse 2 ho isa mochesong oa kamore
- ·Ho kopanya centrifugal: 1200 rpm bakeng sa 180s
- ·Tlhahlobo ea ho hlaka ha matla: 850 ± 30 kcps
- ·Nako ea ho Bula: ≤ 72h
- ·Ho tlama sehlopha sa MES bakeng sa ho sala morao
4. Ho Hloekisa Stencil: Tiisetso ea ho se be le masala
| Mokhoa oa ho Hloekisa | Maqhubu | Mokhoa oa Netefatso |
|---|---|---|
| Hlakola ka Omileng + Vacuum Cleaner | Li-PCB tse ling le tse ling tse 5 | Tlhahlobo ea Microscope ea 50x |
| Solvent e Hloekileng ka ho Tebileng | Metsotso e meng le e meng e 30 | Masalla a Gravimetric |
Mekhoa ea ho se be le lintho tse setseng: Khatello 50,000
III. Boleng ba Moreki: Ntlafatso ea Boleng bo ka Lekanyetsoang
| Metric | Pele ho | Kamora | Boemo |
|---|---|---|---|
| Tlhahiso ea Pele ea Pase | 82% | 99.1% | QFN ea bophahamo ba 0.4mm |
| Sekhahla se Phethahetseng sa Sekoli | 850 PPM | 62 PPM | BGA ea Likoloi (X-Ray) |
| Litšenyehelo tsa ho Sebetsa Bocha | $12k/khoeli | $0.8k/khoeli | Mohala oa PCBA oa Bongaka |
Nyeoe: Boto e kholo ea Smartwatch e nang le bongata ba likarolo tsa 01005 e fihletse liphoso tsa bolo ea solder ka stencil e koahetsoeng ka nano
IV. Moeli oa Indasteri: Nako ea Khatiso e Bohlale
'Mapa oa Tsela ea Theknoloji
- ·2024: Ketsiso ea mafahla a dijithale bakeng sa ho hatisa ka stencil
- ·2025: Sistimi ea ho squeegee ea AI e ikamahanyang le maemo
- ·2026: Taolo ea reactivity ea ho peista ea solder ea boemo ba limolek'hule
Temoho ea Setsebi
"Keketseho ea chai ea 23.7% e fihletsoeng ka ho ntlafatsa ho nepahala ha bophahamo ba peista ho tloha ho ±15% ho isa ho ±8% (SMTA 2023-PT-087).
Theknoloji ea litšiea tse 'ne e atolosa sekoli sa khatiso MTBA (Nako e Bohareng Pakeng tsa Likotsi) ho fihlela lihora tse 1200."
Litšupiso
- 1.IPC-7525C “Tataiso ea Moralo oa Penteile”
- 2.J-STD-005B “Litlhoko tsa ho kopanya lipeista”
- 3. Pampiri e Tšoeu ea SMTA: “Litekanyo tsa ho Hlahisa Paste ea Solder” (2023)
- 4.IEC 61191-3: 2017 “Dikopano tsa Boto e Hatisitsweng - Karolo ya 3”
