1. Selelekela
Jwalo ka mohato wa bohlokwa tshebetsong ya SMT, ho tjheseletsa hape ho bapala karolo ya bohlokwa ho fumaneng botshepehi le bophelo ba dihlahiswa tsa elektroniki. IPC-J-STD-020, tlhahiso ea sejoale-joale ea elektroniki e hloka ho nepahala ha taolo ea mocheso oa ±5°C. Makala a kang lisebelisoa tsa elektroniki tsa likoloi (AEC-Q100) le lifofane (MIL-STD-883), boleng ba ho kopanya litšepe bo ama polokeho le ts'ebetso ea sehlahisoa ka kotloloho.
2. Melao-motheo ea Ts'ebetso le Lintlha tsa Bohlokoa tsa Taolo
Ho kopanya hape ho etsa manonyeletso a tsitsitseng a ho kopanya ka liprofaele tse laoloang tsa mocheso. Liparamente tsa bohlokoa li kenyelletsa:
- ·Sekhahla sa ho Futhumatsa: 1–3°C/s (ho qoba ho thothomela ha mocheso)
- ·Mocheso o Phahameng: 20–40°C kaholimo ho ntlha ea ho qhibiliha ha solder (hangata 235–245°C bakeng sa SnAgCu)
- ·Nako e ka Holimo ho Liquidus (TAL): Metsotsoana e 30–90
- ·Sekhahla sa ho Pholisa: 1–4°C/s (ho ntlafatsa sebopeho sa manonyeletso a solder)
3. Litšebetso tsa Bohlokoa tsa Tekheniki
3.1 Ntlafatso ea Profaele ea Mocheso
- ·E sebelisa profaele ea mocheso ea KIC e nang le tlhokomelo ea nako ea sebele ea likanale tse 6-12.
- ·E netefatsa bokaholimo ba boto ΔT le THEKO .
- ·Lithuto tsa SMTA li bontša hore liprofaele tse ntlafalitsoeng tsa mocheso li ka fokotsa likoli tsa ho tjheseletsa ka 60% (Sekolo se Phahameng, 2021).
3.2 Taolo ea Sepakapaka
- ·Tšireletso ea Naetrojene: THE2 Khatello e ka tlase ho 1000ppm e eketsa ho kgona ho koloba ka ho feta 15% (Tlaleho ea Lipatlisiso tsa Heller).
- ·Phetoho ea Moea o Chesang: Phallo ea moea e laoloang (0.5–1.5 m/s) e netefatsa phetiso ea mocheso e ts'oanang.
3.3 Litekanyo tsa Tshebetso ea Lisebelisoa
| Letšoao/Mohlala | Libaka tsa Thempereichara | Ho nepahala ha Taolo ea Mocheso | Tšebeliso ea naetrojene | Likaroloana |
|---|---|---|---|---|
| Heller 1910 | 12 | ±1°C | 15m³/h | Moea o chesang o potolohang habeli |
| Rehm V9 | 10 | ±1.5°C | 12m³/h | Phallo ea lephaka hape |
| Jutuo JS-800 | 8 | ±2°C | 18m³/hora | Pholiso e bohlale |
4. Sistimi ea Netefatso ea Boleng
4.1 Tlhokomelo ea Ts'ebetso
- ·Tlhahlobo ea SPC ea nako ea sebele: CRP ≥ 1.33
- ·Netefatso ea boemo ba mocheso hape: Lihora tse ling le tse ling tse 4
- ·Tlhahlobo ea X-ray: E netefatsa boleng ba lenonyeletso la solder ka IPC-A-610 maemo a tloaelehileng
4.2 Netefatso ea Botšepehi
- ·Ho potoloha ha mocheso: -40°C ho isa ho 125°C, lipotoloho tse 1000
- ·Ho thothomela ha Mekaniki: Teko ea 20–2000Hz, e nang le li-axis tse 3
- ·Metalography: Botenya ba IMC (intermetallic compound) 2–5μm
5. Linyeoe tsa Kopo ea Indasteri
- ·Lisebelisoa tsa Elektroniki tsa Likoloi: E fihlela maemo a khatello ea mocheso ea potoloho ea 3000.
- ·Lisebelisoa tsa Bongaka: E netefalitsoe tlas'a ISO 13485 bakeng sa ho latela le ho tšepahala ha ts'ebetso.
- ·Puisano ea 5G: E netefatsa botšepehi ba lets'oao ka jiometri e ntlafalitsoeng ea solder joint bakeng sa li-module tsa mmWave.
6. Kakaretso: Metheo ea ho Tšepahala Haholo ka ho Fetoha ha Seretse
- ·Taolo e nepahetseng ea boemo ba mocheso
- ·Tshebetso e tsitsitseng le e sebetsang hantle ea lisebelisoa
- ·Tlhokomelo ea boleng bo felletseng le netefatso ea botšepehi
Ka taolo e hlophisitsoeng ea ts'ebetso, bahlahisi ba ka fihlela chai ea ho kopanya hape ea ≥99.9%, ba fihlella maemo a boleng le botsitso a etelletseng pele indastering.
Litšupiso
- 1.IPC-J-STD-020E, 2020
- 2. Pampiri e Tšoeu ea Litharollo tsa Ts'ebetso ea Heller, 2022
- 3. Ditsamaiso tsa Matjhaba tsa SMTA, 2021
- 4.MIL-STD-883H, 2019
- 5.AEC-Q100 Rev-H, 2014
