Ukuvula Ikhodi Yokuklama ye-HDI: Umthelela Obalulekile Wemiklamo Ye-Micro-Via kanye Ne-Blind-Via Ekusebenzeni
Ukuvula Ikhodi Yokuklama ye-HDI: Umthelela Obalulekile We-Micro - nge-Blind - nge-Designs Ekusebenzeni
Emkhakheni oyinkimbinkimbi womklamo webhodi lesifunda le-HDI (High - Density Interconnect), imiklamo yebhodi lesifunda ye-micro - via kanye ne-blind - via ifana namakhodi abalulekile afihliwe ku-maze yesifunda, edlala indima ebalulekile ekusebenzeni kwebhodi lesifunda. Konjiniyela abazinikele ekuklameni kwe-HDI, ukuqonda ngokujulile nokusebenzisa ngokunembile lezi zinto ezimbili zokuklama kuyisisekelo sokudlula ezinkingeni zokuklama nokufeza ukusebenza okuhle kakhulu.
1.Micro - nge-Design: Isiteshi Esihle kuya Ekusebenzeni Okuphezulu
(1) Umthelela We-Micro - Ngosayizi Nobuningi Ekusebenzeni Kukagesi
Ama-micro - vias, njengeziteshi ezincane ezixhumanisa imigqa yesekethe ezingqimbeni ezahlukene zebhodi yesekethe, ukukhethwa kobukhulu bawo kanye nobuningi bawo kuhlobene ngqo nokusebenza kukagesi kwebhodi yesekethe. Ezimweni zokusetshenziswa kokudluliselwa kwesignali ngesivinini esiphezulu, njenge-PCI - Express 6.0 interface enesilinganiso sesignali esiphezulu njenge-64Gbps, amandla e-parasitic kanye nokungena kwe-micro - vias kuba yizinto ezibalulekile ezithinta ubuqotho besignali. Ngokusho kombono we-electromagnetic, amandla e-parasitic e-micro - vias alingana nesikwele sobubanzi be-via, kanti ukungena kwe-parasitic kulingana nokujula kwe-via. Ngakho-ke, ukusebenzisa ama-micro - vias amancane (njengama-50μm noma amancane kakhulu) kunganciphisa kakhulu amandla e-parasitic futhi kunciphise ukubambezeleka kanye nokuncipha ngesikhathi sokudluliselwa kwesignali. Ngesikhathi esifanayo, ukwandisa ngokufanele ubuningi be-micro - vias ukuze kufezwe ukuxhumana kukagesi okusebenzayo ngaphakathi kwesikhala sebhodi yesekethe esilinganiselwe kusiza ukuthuthukisa ukusebenza kahle kokudluliselwa kwesignali futhi kuhlangabezane nezidingo eziqinile zokudluliselwa kwedatha ngesivinini esikhulu sobuningi bomugqa.
(2) Ukukhethwa Nokuthuthukiswa Kwe-Micro - Ngobuchwepheshe Bokucubungula
Ukunemba kanye nekhwalithi yobuchwepheshe bokucubungula obusebenzisa i-micro-via kunquma ngqo ukusebenza kwe-micro-vias. Njengamanje, ubuchwepheshe obujwayelekile bokucubungula obusebenzisa i-micro-via buhlanganisa ukubhoboza nge-laser, ukuqopha nge-plasma, njll. Ubuchwepheshe bokubhoboza nge-laser, kanye nezinzuzo zabo zokunemba okuphezulu kanye nokuguquguquka okuphezulu, busetshenziswa kabanzi ekukhiqizeni Amabhodi wesekethe we-HDI. Lapho besebenzisa inqubo yokubhoboza nge-laser, onjiniyela badinga ukulawula ngokunembile amapharamitha afana namandla, ububanzi be-pulse, kanye nendawo yokugxila kwe-laser. Isibonelo, amandla e-laser amaningi angabangela i-carbonization yodonga lwembobo, okwandise ukumelana futhi kuthinte ukudluliswa kwesignali; ububanzi be-pulse obungalungile kanye nendawo yokugxila kungaholela ekuphambukeni kosayizi kanye nokwakheka okungajwayelekile kwama-micro-vias. Ngokwenza ngcono la mapharamitha nokuhlanganisa imishini yokubhoboza ethuthukisiwe kanye nohlelo lokulawula oluzenzakalelayo, ukucubungula ngokunemba okuphezulu kwama-micro-vias kungafinyelelwa, kuqinisekiswe izindonga zembobo ezibushelelezi ngaphandle kwama-burrs, ngaleyo ndlela kuthuthukiswe ukuthembeka kanye nokusebenza kukagesi kwama-micro-vias.
2. Abangaboni - nge-Design: Isu Eliyinhloko Lokuthuthukisa Ubuqotho Besignali
(1) Ukufanisa Izimpumputhe - Ngezinhlobo Nezimo Zokusebenza
Ama-vias angaboni angahlukaniswa abe ama-vias aphezulu - angaboni - aphansi, ama-vias aphansi - aphansi, kanye nama-vias aphakathi - aphansi ngokwezikhundla zawo kanye nezindlela zokuxhuma ebhodini lesifunda. Izinhlobo ezahlukene zama-vias angaboni zifanelekela izimo ezahlukene zohlelo lokusebenza. Emiklamo enezidingo eziphakeme kakhulu zosayizi wesikhala kanye nekhwalithi yokudlulisa isignali, njengebhodi le-motherboard le-smartphone, ama-vias aphezulu - aphansi kanye nama-vias aphansi - aphansi anganciphisa ngempumelelo inani lama-vias ebusweni bebhodi lesifunda, anciphise ukuphazamiseka kwesignali, futhi ngesikhathi esifanayo afinyelele ukuxhumana okusebenzayo phakathi kwezingxenye zobuso kanye nemigqa yangaphakathi - engqimbeni. Emiklamo yebhodi enezingqimba eziningi, ama-vias aphakathi - aphansi avame ukusetshenziswa ukuxhuma imigqa yesignali kungqimba oluphakathi, alungise indlela yokudlulisa isignali, futhi anciphise ukulahlekelwa kokudluliselwa kwesignali ngaphakathi kwebhodi lesifunda. Isibonelo, ekwakhiweni kwama-motherboard eseva ephezulu, ngokusebenzisa okunengqondo ama-vias aphakathi - aphansi, izimpawu zamamojula ahlukene asebenzayo zingahlukaniswa ngempumelelo, ukukhuluma ngesignali kungagwenywa, futhi ukuzinza nokuthembeka kohlelo kungathuthukiswa.
(2) Ukuthuthukiswa Kobuqotho Besignali Yimpumputhe - ngomklamo
Umklamo we-Blind - via unezinzuzo ezibalulekile ekuthuthukiseni ubuqotho besignali. Uma kuqhathaniswa nama-through - vias, ama-blind - vias anganciphisa ukubonakaliswa nokusabalala kwesignali kuma-vias futhi anciphise ukulahleka kokudluliselwa kwesignali. Lokhu kungenxa yokuthi ama-blind - vias axhuma ingxenye kuphela yezendlalelo zebhodi lesifunda, agweme ukuthi isignali idlule ezingqimbeni eziningi kakhulu ze-dielectric ku-through - via, ngaleyo ndlela kuncishiswe ukusebenzisana phakathi kwesignali nendawo ezungezile. Ekwakhiweni kwesekethe yedijithali yesivinini esikhulu, ubuqotho besignali buyisihluthulelo sokuqinisekisa ukusebenza kohlelo. Ngokuklama ngokufanele isikhundla, usayizi, kanye nenani lama-blind - vias nokuhlanganisa ubuchwepheshe bokulawula impedance obunembile, ukubonakaliswa kwesignali kanye nokukhuluma nge-crosstalk kungancishiswa ngempumelelo, kuqinisekiswe ukudluliselwa okuzinzile kwesignali ebhodini lesifunda. Isibonelo, lapho uklama isekethe yesixhumi esibonakalayo sesivinini esikhulu, ukuhlela ama-blind - vias ezindaweni ezibalulekile endleleni yokudluliselwa kwesignali nokwenza ngcono ukufana phakathi kosayizi wama-blind - vias kanye nemigqa kungathuthukisa kakhulu isilinganiso somsindo wesignali futhi kuthuthukise ukunemba nokuthembeka kokudluliselwa kwedatha.
3. Ukuthuthukiswa Kokubambisana Kwemiklamo Emincane - nge-Blind kanye ne-Micro - nge-Designs
(1) Izinto Okucatshangelwayo Ngomklamo Ngokusekelwe Ekusebenzeni Okuphelele
Ekwakhiweni kwangempela kwe-HDI, ama-micro-vias nama-blind-vias awakho ngokwawo kodwa kudingeka asebenzisane ukuze enze ngcono ukusebenza kwebhodi lesifunda. Onjiniyela kufanele baqale ezidingweni zokusebenza eziphelele zebhodi lesifunda, bacabangele ngokuphelele izici ezifana nezindlela zokudlulisa isignali, amanethiwekhi okusabalalisa amandla, kanye nezidingo zokushabalalisa ukushisa, futhi bahlele ngokufanele ukwakheka kwama-micro-vias nama-blind-vias. Isibonelo, lapho kuklanywa isekethe evamise kakhulu, ukuze kuncishiswe ukulahleka kokudlulisa isignali, ama-micro-vias nama-blind-vias kufanele ahlelwe ngokukhethekile endleleni emfushane yokudlulisa isignali futhi aqinisekise ukuthi ukuxhumana kwawo nemigqa kusebenza kahle kagesi. Ngesikhathi esifanayo, ekwakhiweni kwezingqimba zamandla nomhlabathi, ukusetshenziswa okunengqondo kwama-micro-vias nama-blind-vias ukwenza ngcono ukusatshalaliswa kwamandla nomhlabathi kunganciphisa ngempumelelo ukuphazamiseka komsindo wamandla kumasignali futhi kuthuthukise ukuzinza kohlelo.
(2) Ukulingisa Nokuqinisekisa Enqubweni Yokuklama
Ngenxa yomthelela oyinkimbinkimbi wemiklamo ye-micro - via kanye ne-blind - ngokusebenzisa ukusebenza kwebhodi lesifunda, ukuthembela kuphela kokuhlangenwe nakho kokuklama kuvame ukwehluleka ukufeza imiphumela emihle kakhulu. Ngakho-ke, enkambisweni yokuklama, kubalulekile ukusebenzisa amathuluzi athuthukisiwe e-Electronic Design Automation (EDA) ukuze kulinganiswe futhi kuqinisekiswe. Ngesofthiwe yokulingisa insimu ye-electromagnetic ye-3D njenge-HFSS kanye ne-CST, onjiniyela bangalingisa ngokunembile ukusebenza kukagesi kwe-micro - vias kanye ne-blind - vias kumaza ahlukene, kufaka phakathi amapharamitha e-parasitic, ukulahlekelwa kokudluliselwa kwesignali, kanye ne-crosstalk. Ngokwemiphumela yokulingisa, ukwenza ngcono nokulungisa umklamo kungasiza ekutholeni nasekuxazululeni izinkinga ezingaba khona ngaphambi kokukhiqiza kwangempela, kuthuthukiswe izinga lempumelelo kanye nokusebenza kahle komklamo. Isibonelo, lapho kuklanywa ibhodi lesifunda elisha le-HDI, ngokuhlaziywa kokulingisa, kutholakala ukuthi umklamo we-blind - via endaweni ethile ubangela i-crosstalk enkulu yesignali. Onjiniyela banganciphisa ngempumelelo i-crosstalk futhi baqinisekise ubuqotho besignali ngokulungisa indawo, usayizi we-blind - vias, noma ngokungeza izinyathelo zokuvikela.
I-Rich Full Joy iyisidalwa esihamba phambili emkhakheni wokukhiqiza i-HDI. Ngokutshala kwayo okujulile kobuchwepheshe kanye nokutshalwa kwezimali okuqhubekayo, ikhombisa ubungcweti obungavamile ekuklanyweni nasekuqapheni kwe-micro-via kanye ne-blind- ngemiklamo kanye nezinqubo zokukhiqiza. Uma sibheka ibhodi lesifunda le-HDI leziteshi zesisekelo ze-5G njengesibonelo, i-Rich Full Joy ithuthukise kakhulu izinkinga zokunciphisa nokuphazamiseka kwezimpawu ngesikhathi sokudluliselwa kwebhendi ephezulu ngokwenza ngcono imiklamo ye-micro-via kanye ne-blind- ngemiklamo, okwenza ukumbozwa kwesignali ye-5G kube kubanzi kanye nesilinganiso sokudlulisa sizinze kakhudlwana, futhi ithuthukise ngempumelelo ikhwalithi yokuxhumana. Ekwenziweni kwamabhodi wesekethe we-HDI wamaseva aphezulu, i-Rich Full Joy isebenzisa ubuchwepheshe obuthuthukisiwe be-micro-via processing kanye nezinhlelo zokubeka ze-blind- nge-blind ukuxazulula inkinga yephutha lokudluliselwa kwedatha elibangelwa ukukhuluma kwesignali, ithuthukisa kakhulu ukuzinza kokusebenza kweseva kanye nokusebenza kahle kokucubungula idatha, kanye nokunikeza isiqinisekiso esiqinile sesisekelo sehadiwe sezinhlelo zokusebenza zezinga lebhizinisi. Lezi mpumelelo azibonisi nje kuphela amandla amahle kakhulu e-Rich Full Joy ekukhiqizeni i-HDI kodwa futhi zinikeza ukwesekwa okuqinile kokuthuthukiswa kwemikhiqizo ye-elekthronikhi ezimbonini ezahlukahlukene, iba ngumlingani othembekile konjiniyela abaningi bokuklama be-HDI.
