Ukuvula iKhowudi yoYilo lwe-HDI: Impembelelo ebalulekileyo yoYilo lwe-Micro-Via kunye ne-Blind-Via kwiNtsebenzo
Ukuvula iKhowudi yoYilo lwe-HDI: Impembelelo ebalulekileyo yeMicro - nge kunye neBlind - ngeDesigns kwiNtsebenzo
Kwintsimi entsonkothileyo ye-HDI (High - Density Interconnect) uyilo lwebhodi yesekethe, uyilo lwe-micro - via kunye ne-blind - via zifana neekhowudi ezibalulekileyo ezifihliweyo kwi-maze yesekethe, zidlala indima ebalulekileyo ekusebenzeni kwebhodi yesekethe. Kwiinjineli ezizinikele kuyilo lwe-HDI, ukuqonda ngokunzulu nokusebenzisa ngokuchanekileyo ezi zinto zimbini zoyilo yeyona nto iphambili ekuphuhliseni imiqobo yoyilo kunye nokufezekisa ukusebenza okugqwesileyo.
1.Micro - ngeDesign: I-Fine Channel ukuya kwi-High - Performance
(1) Impembelelo yeMicro - ngobukhulu kunye noxinano ekusebenzeni kombane
Ii-micro-vias, njengeetshaneli ezincinci ezidibanisa imigca yesekethe kwiileya ezahlukeneyo zebhodi yesekethe, ukukhethwa kobukhulu bazo kunye noxinano kunxulumene ngokuthe ngqo nokusebenza kombane kwebhodi yesekethe. Kwiimeko zokusetyenziswa kokudluliselwa kwesignali ngesantya esiphezulu, njenge-PCI-Express 6.0 interface enesantya sesignali esiphezulu njenge-64Gbps, i-parasite capacitance kunye ne-inductance yee-micro-vias ziba zizinto ezibalulekileyo ezichaphazela ukuthembeka kwesignali. Ngokwethiyori ye-electromagnetic, i-parasite capacitance yee-micro-vias ilingana nesikwere se-via diameter, kwaye i-parasite inductance ilingana nobunzulu be-via. Ke ngoko, ukusebenzisa ii-micro-vias ezincinci (ezifana ne-50μm okanye ezincinci) kunokunciphisa kakhulu i-parasite capacitance kwaye kunciphise ukulibaziseka kunye nokuncipha ngexesha lokudluliselwa kwesignali. Kwangaxeshanye, ukwandisa ngokufanelekileyo uxinano lwee-micro-vias ukuze kufezekiswe uqhagamshelo lombane olusebenzayo ngakumbi ngaphakathi kwendawo yebhodi yesekethe elinganiselweyo kunceda ukuphucula ukusebenza kakuhle kokudluliselwa kwesignali kwaye kuhlangatyezwane neemfuno ezingqongqo zokudluliselwa kwedatha ngesantya esiphezulu kuxinano lwemigca.
(2) Ukukhethwa kunye nokuphuculwa kweMicro - ngeTekhnoloji yoLungiselelo
Ukuchaneka kunye nomgangatho wetekhnoloji yokucubungula nge-micro-via kumisela ngokuthe ngqo ukusebenza kwe-micro-vias. Okwangoku, iiteknoloji eziphambili zokucubungula nge-micro-via ziquka ukubhola nge-laser, ukukrola nge-plasma, njl. Itekhnoloji yokugaya nge-laser, kunye neenzuzo zayo zokuchaneka okuphezulu kunye nokuguquguquka okuphezulu, isetyenziswa kakhulu ekuveliseni Iibhodi zeesekethe ze-HDIXa usebenzisa inkqubo yokubhola nge-laser, iinjineli kufuneka zilawule ngokuchanekileyo iiparameter ezifana namandla, ububanzi be-pulse, kunye nendawo yokugxila kwe-laser. Umzekelo, amandla e-laser agqithisileyo anokubangela i-carbonization yodonga lomngxuma, okwandisa ukumelana kwaye kuchaphazele ukuhanjiswa kwesignali; ububanzi be-pulse obungachanekanga kunye nendawo yokugxila kunokukhokelela ekuphambukeni kobungakanani kunye neemilo ezingaqhelekanga zee-micro-vias. Ngokwenza ngcono ezi parameters kunye nokudibanisa izixhobo zokubhola eziphambili kunye nenkqubo yolawulo oluzenzekelayo, ukucutshungulwa ngokuchanekileyo kwee-micro-vias kunokufezekiswa, kuqinisekiswa iindonga zemingxuma ezigudileyo ngaphandle kwee-burrs, ngaloo ndlela kuphuculwe ukuthembeka kunye nokusebenza kombane kwee-micro-vias.
2. Iimfama - nge-Design: Icebo eliPhambili lokuphucula uBulungisa beSignali
(1) Ukufanisa iiMpawu - ngeeNtlobo kunye neMibono yoSetyenziso
Ii-vias ezingaboniyo zingahlulwa zibe zii-vias eziphezulu nezisezantsi, ii-vias ezingaboniyo ezisezantsi neziphakathi ngokweendawo zazo kunye neendlela zokunxibelelana kwibhodi yesekethe. Iindidi ezahlukeneyo zee-vias ezingaboniyo zifanelekile kwiimeko ezahlukeneyo zesicelo. Kwiindlela zoyilo ezineemfuno eziphezulu kakhulu zobungakanani bendawo kunye nomgangatho wokudluliselwa kwesignali, njengeebhodi ze-smartphone, ii-vias eziphezulu nezisezantsi nezi-vias ezingaboniyo zinokunciphisa ngempumelelo inani lee-vias kumphezulu webhodi yesekethe, zinciphise ukuphazamiseka kwesignali, kwaye kwangaxeshanye zifezekise unxibelelwano olusebenzayo phakathi kwezinto zomphezulu kunye nemigca yangaphakathi. Kwiindlela zoyilo zebhodi ezinee-level ezininzi, ii-vias eziphakathi neziphakathi zihlala zisetyenziselwa ukudibanisa imigca yesignali kumaleko ophakathi, zilungise indlela yokudluliselwa kwesignali, kwaye zinciphise ukulahleka kokudluliselwa kwesignali ngaphakathi kwebhodi yesekethe. Umzekelo, kuyilo lweebhodi ze-server eziphezulu, ngokusebenzisa ngokufanelekileyo ii-vias eziphakathi neziphakathi, imiqondiso yeemodyuli ezahlukeneyo ezisebenzayo inokwahlulwa ngokufanelekileyo, i-crosstalk yesignali inokuthintelwa, kwaye uzinzo kunye nokuthembeka kwenkqubo kunokuphuculwa.
(2) Ukwenziwa ngcono koBulungisa beSignali yiMfama - ngoYilo
Uyilo lwe-Blind-via luneengenelo ezibalulekileyo ekuphuculeni ukuthembeka kwesignali. Xa kuthelekiswa ne-through-vias, i-blind-vias inokunciphisa ukubonakaliswa kunye nokusasazeka kwesignali kwi-vias kwaye inciphise ukulahleka kokudluliselwa kwesignali. Oku kungenxa yokuba i-blind-vias idibanisa kuphela inxalenye yeeleya zebhodi yesekethe, ithintela ukuba isignali idlule kwiileya ezininzi ze-dielectric kwi-through-via, ngaloo ndlela inciphisa ukusebenzisana phakathi kwesignali kunye nendawo ejikelezileyo. Kuyilo lwesekethe yedijithali ekhawulezayo, ukuthembeka kwesignali ngundoqo ekuqinisekiseni ukusebenza kwenkqubo. Ngokuyila ngokufanelekileyo indawo, ubungakanani, kunye nenani lee-blind-vias kunye nokudibanisa itekhnoloji yolawulo lwe-impedance echanekileyo, ukubonakaliswa kwesignali kunye ne-crosstalk kunokunciphisa ngempumelelo, kuqinisekisa ukuhanjiswa okuzinzileyo kwesignali kwibhodi yesekethe. Umzekelo, xa uyila isekethe ye-serial interface yesantya esiphezulu, ukuhlela ii-blind-vias kwiindawo eziphambili kwindlela yokudluliselwa kwesignali kunye nokwenza ngcono ukufana phakathi kobukhulu be-blind-vias kunye nemigca kunokuphucula kakhulu umlinganiselo wesignali-ukuya-kwingxolo yesignali kwaye kuphucule ukuchaneka kunye nokuthembeka kokudluliselwa kwedatha.
3. Ukwenziwa ngcono kweMisebenzi yoBuchule kwiMicro - nge kunye neBlind - ngeDesigns
(1) Izinto ekufuneka ziqwalaselwe kuyilo olusekelwe kwintsebenzo iyonke
Kuyilo lwe-HDI yokwenyani, ii-micro-vias kunye nee-blind-vias azikho zodwa kodwa kufuneka zisebenzisane ukuze kuphuculwe ukusebenza kwebhodi yesekethe iyonke. Iinjineli kufuneka ziqale kwiimfuno zokusebenza zebhodi yesekethe, ziqwalasele ngokupheleleyo izinto ezifana neendlela zokuhambisa isignali, iinethiwekhi zokusasazwa kwamandla, kunye neemfuno zokusasazwa kobushushu, kwaye zicwangcise ngokufanelekileyo uyilo lwee-micro-vias kunye nee-blind-vias. Umzekelo, xa kuyilwa isekethe ephindaphindayo, ukuze kuncitshiswe ukulahleka kokuhambisa isignali, ii-micro-vias kunye nee-blind-vias kufuneka zicwangciswe ngokukhethekileyo kwindlela yokuhambisa isignali emfutshane kwaye ziqinisekise ukuba uqhagamshelo lwazo kwimigca lusebenza kakuhle ngombane. Kwangaxeshanye, kuyilo lwamandla kunye neengqimba zomhlaba, ukusetyenziswa okunengqiqo kwee-micro-vias kunye nee-blind-vias ukuphucula ukusasazwa kwamandla nomhlaba kunokunciphisa ngempumelelo ukuphazamiseka kwengxolo yamandla kwimiqondiso kwaye kuphuculwe uzinzo lwenkqubo.
(2) Ukulinganisa kunye nokuqinisekisa kwiNkqubo yoYilo
Ngenxa yempembelelo enzima yoyilo lwe-micro - via kunye ne-blind - via ekusebenzeni kwebhodi yesekethe, ukuxhomekeka kuphela kumava kuyilo kudla ngokusilela ukufezekisa iziphumo ezilungileyo. Ke ngoko, kwinkqubo yoyilo, kubalulekile ukusebenzisa izixhobo eziphambili ze-Electronic Design Automation (EDA) zokulinganisa nokuqinisekisa. Ngokusebenzisa isoftware yokulinganisa intsimi ye-electromagnetic ye-3D efana ne-HFSS kunye ne-CST, iinjineli zinokulinganisa ngokuchanekileyo ukusebenza kombane kwe-micro - vias kunye ne-blind - vias kwiifrikhwensi ezahlukeneyo, kubandakanya iiparasitic parameters, ilahleko yokudluliselwa kwesignali, kunye ne-crosstalk. Ngokweziphumo zokulinganisa, ukuphucula kunye nokulungisa uyilo kunokunceda ekufumaneni nasekusombululeni iingxaki ezinokubakho ngaphambi kokwenziwa kwangempela, ukuphucula izinga lempumelelo kunye nokusebenza kakuhle koyilo. Umzekelo, xa uyila ibhodi yesekethe entsha ye-HDI, ngohlalutyo lokulinganisa, kufunyaniswa ukuba uyilo lwe-blind - via kwindawo ethile lubangela i-crosstalk egqithisileyo yesignali. Iinjineli zinokunciphisa ngempumelelo i-crosstalk kwaye ziqinisekise ukuthembeka kwesignali ngokulungisa indawo, ubungakanani be-blind - vias, okanye ukongeza amanyathelo okukhusela.
I-Rich Full Joy yindoda ephambili kwicandelo lokuvelisa i-HDI. Ngokubonelela kwayo ngobuchwephesha obukhulu kunye notyalo-mali oluqhubekayo lokuvelisa izinto ezintsha, ibonisa ubuchule obumangalisayo kwiinkqubo zoyilo kunye nokuveliswa kwezinto ezincinci. Ukuthatha ibhodi yesekethe ye-HDI yezikhululo zesiseko ze-5G njengomzekelo, i-Rich Full Joy iphucule kakhulu iingxaki zokunciphisa kunye nokuphazamiseka kwemiqondiso ngexesha lokuhanjiswa kwebhendi ephezulu ngokuphucula uyilo lwe-micro-via kunye ne-blind, okwenza ukugubungela kwesignali ye-5G kube banzi kwaye izinga lokudluliselwa lizinze ngakumbi, kwaye kuphucula ngokufanelekileyo umgangatho wonxibelelwano. Ekwenzeni iibhodi zesekethe ze-HDI kwiiseva eziphezulu, i-Rich Full Joy isebenzisa iteknoloji yokucubungula i-micro-via kunye nezicwangciso zoyilo lwe-blind-via ukusombulula ingxaki yempazamo yokudluliselwa kwedatha ebangelwa kukuthetha nge-signal, iphucula kakhulu uzinzo lokusebenza kweseva kunye nokusebenza kakuhle kokucubungula idatha, kunye nokubonelela ngesiqinisekiso esiqinileyo sesiseko sehardware kwizicelo zenqanaba leshishini. Ezi mpumelelo azibonisi kuphela amandla amahle e-Rich Full Joy kwimveliso ye-HDI kodwa zikwabonelela ngenkxaso enamandla yokuphucula iimveliso ze-elektroniki kumashishini ahlukeneyo, zibe liqabane elithembekileyo kwiinjineli ezininzi zoyilo lwe-HDI.
