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Impedance ea PCB ea Hybrid e nang le maqhubu a phahameng I 14L
Moetsi oa HDI ea lera le phahameng/lera lefe kapa lefe
Boleng
Sistimi ea Tsamaiso ea Boleng: ISO 9001: 2015, ISO14001: 2015, IATF16949: 2016, OHSAS 18001: 2007, QC080000: 2012SGS, RBA, CQC, WCA & ESA, SQ MARK, Canon GA, Sony GP
Tekanyetso ea boleng ba PCB: IPC 1, IPC 2, IPC 3, GJB 362C-2021, AS9100
Mokhoa o moholo oa tlhahiso ea PCB：IL/lmage、PatternPlating、I/L AOI、B/Oxide、Layup、Press、LaserDrilling、Drilling、PTH、PanelPlating、O/Llmage、PanelPlating、SESEtching、O/L AOI、S/Mask、Legend、SurfaceFinshed（ENIGENEPIG、Hard Gold、Soft Gold、HASL、LF-HASL、lmm Tin、lmm Silver、OSP）、Rout 、ET、FV
Lintho tsa teko ea lisebelisoa tsa tlhahlobo
ontong: teko ea polokelo ea matla a mocheso
Mochini oa ho hlahloba boemo ba tšilafalo ea Ion: Teko ea bohloeki ba Ionic
mochini o hlahlobang spray ea letsoai: Teko ea spray ea letsoai
Teko ea DC e nang le motlakase o phahameng: teko ea ho mamella motlakase
megger: ho hanyetsa ho kwahela
mochini o tensile oa bokahohleng: teko ea matla a peel
CAF: Teko ea ho falla ha Ion, ho ntlafatsa li-substrate tsa PCB, ho ntlafatsa ts'ebetso ea PCB, jj.
OGP: Ho sebelisoa lisebelisoa tsa ho lekanya setšoantšo sa 3D tse sa amaneng, tse kopantsoeng le sethala sa ho sisinyeha sa axis ea XYZ le seipone sa zoom se iketsang, ho sebelisoa melao-motheo ea tlhahlobo ea setšoantšo ho sebetsana le matšoao a setšoantšo ka khomphutha, tekanyo ea litekanyo tsa jeometri le mamello ea boemo e ka bonoa kapele le ka nepo, 'me boleng ba CPK bo ka hlahlojoa.
Mochini oa taolo ea khanyetso inthaneteng: Teko ea khanyetso ea taolo ea TCT Mekhoa e tloaelehileng ea ho hloleha, ho utloisisa mabaka a ka bang teng a ka bakang tšenyo lisebelisoa tsa sistimi le likarolo ho netefatsa hore na sehlahisoa se entsoe kapa se entsoe ka nepo
lebokose la ho makala le batang le mocheso: teko ea ho makala e batang le mocheso, mocheso o phahameng le o tlase
Kamore ea mocheso le mongobo e sa khaotseng: Teko ea ho hanyetsa ts'enyeho ea elektroniki le ho hanyetsa ho thijoa ha bokaholimo
pitsa ea ho solder: teko ea ho khona ho solder
Teko ea RoHS: RoHS
Teko ea impedance: AC impedance le boleng ba tahlehelo ea matla
lisebelisoa tsa liteko tsa motlakase: Leka ho tsoela pele ha potoloho ea sehlahisoa
Mochini oa nale o fofang: Teko ea ho kenya mocheso o phahameng oa motlakase le ho hanyetsa ho tlase
Mochini o hlahlobang masoba ka boiketsetso ka botlalo: Hlahloba mefuta e fapaneng ea masoba a sa tloaelehang, ho kenyeletsoa masoba a chitja, masoba a makhutšoane a slot, masoba a malelele a slot, masoba a maholo a sa tloaelehang, masoba a nang le masoba, masoba a 'maloa, masoba a maholo le a manyane, le mesebetsi ea tlhahlobo ea plug ea masoba
AOI：AOI e hlahloba ka bohona lihlahisoa tsa PCBA ka lik'hamera tsa CCD tse nang le tlhaloso e phahameng, e bokella litšoantšo, e bapisa lintlha tsa liteko le liparamente tse tšoanelehang polokelongtshedimosetsong, 'me ka mor'a ts'ebetso ea litšoantšo, e hlahloba liphoso tse nyane tse ka 'nang tsa hlokomolohuoa ho PCB e reriloeng. Ha ho na ho phonyoha liphoso tsa potoloho.
Kopo (sheba setšoantšo se hoketsoeng bakeng sa lintlha tse qaqileng)
1. 5G Mehala ea puisano
Tšebeliso: Li-PCB tse hatelloang ka maqhubu a phahameng tsa hybrid li bohlokoa liteisheneng tsa motheo tsa 5G, li-antenna le li-module tsa RF ka lebaka la bokhoni ba tsona ba ho sebetsana le matšoao a lebelo le phahameng le ho fokotsa tahlehelo ea matšoao. Taolo ea impedance ea mekhahlelo e 14 e netefatsa botšepehi bo nepahetseng ba matšoao, ha theknoloji efe kapa efe ea HDI e lumella meralo e menyenyane le e nang le bongata bo phahameng.
Likarolo tsa Bohlokoa: Tahlehelo e tlase ea dielectric, botsitso bo phahameng ba mocheso, le ho bapisa impedance hantle.
2. Lifofane le Tšireletso
Tšebeliso: E sebelisoa litsamaisong tsa radar, puisanong ea sathelaete le li-avionics. Sebopeho sa PCB sa mekhahlelo e mengata se tšehetsa potoloho e rarahaneng, 'me bokhoni ba maqhubu a phahameng bo netefatsa ts'ebetso e tšepahalang libakeng tse feteletseng.
Likarolo tsa Bohlokoa: Ho tšepahala ho hoholo, ho hanyetsa ho thothomela, le bokhoni ba ho sebetsa maemong a fapaneng a mocheso.
3. Litšoantšo tsa Bongaka le Tlhahlobo
Tšebeliso: E bohlokoa mechineng ea MRI, li-scanner tsa CT le lisebelisoa tsa ultrasound. Taolo ea impedance ea mekhahlelo e 14 e netefatsa phetiso e nepahetseng ea lets'oao, ha theknoloji ea HDI e nolofalletsa ho bebofatsa lipotoloho tse rarahaneng.
Likarolo tsa Bohlokoa: Botšepehi bo phahameng ba lets'oao, moralo o monyane, le ho lumellana le li-sensor tsa maqhubu a phahameng.
4. Lisebelisoa tsa Elektroniki tsa Likoloi (Mekhoa ea ADAS le EV)
Tšebeliso: E sebelisoa ho Advanced Driver Assistance Systems (ADAS), tsamaiso ea matla a likoloi tsa motlakase (EV), le litsamaiso tsa infotainment. Li-PCB tse nang le maqhubu a phahameng li tšehetsa phetiso ea data e potlakileng bakeng sa li-sensor le lik'hamera.
Likarolo tsa Bohlokoa: Ho tsamaisa mocheso ka matla a phahameng, ho tšoarella, le bokhoni ba ho sebetsana le lits'ebetso tse nang le matla a mangata.
5. IoT le Lisebelisoa tse Bohlale
Tšebeliso: E fumaneha disebedisweng tse bohlale tsa lapeng, tse aparwang, le di-sensor tsa IoT tsa indasteri. Di-PCB tsa HDI tsa lera lefe kapa lefe di nolofalletsa meralo e menyenyane, e bobebe, ha bokgoni ba maqhubu a phahameng bo netefatsa phetiso ya data ka potlako.
Likarolo tsa Bohlokoa: Miniaturization, tšebeliso e tlase ea matla, le khokahano e potlakileng.
6. Litsi tsa Data le Cloud Computing
Tšebeliso: E sebelisoa ho li-server, li-switch, le lisebelisoa tsa marang-rang tse lebelo le phahameng. Taolo ea impedance ea mekhahlelo e 14 e netefatsa tahlehelo e nyane ea lets'oao, 'me theknoloji ea ho tobetsa e kopantsoeng e tšehetsa phetiso ea data e lebelo le phahameng.
Likarolo tsa Bohlokoa: Bophara ba bandwidth bo phahameng, taolo ea mocheso, le ts'epo bakeng sa ts'ebetso ea 24/7.
7. Lisebelisoa tsa Elektroniki tsa Bareki
Tšebeliso: E fumaneha ho li-smartphone, matlapa le li-console tsa lipapali. Li-PCB tsa HDI tsa lera lefe kapa lefe li lumella lisebelisoa tse tšesaane le tse bobebe, ha bokhoni ba maqhubu a phahameng bo tšehetsa khokahano ea 5G le Wi-Fi 6/6E.
Likarolo tsa Bohlokoa: Likhokahano tse nang le bongata bo phahameng, botšepehi bo botle ba lets'oao, le ntlha e nyane ea sebopeho.
8. Boiketsetso ba Liindasteri le Liroboto
Tšebeliso: E sebelisoa ho PLCs (Batsamaisi ba Logic ba ka Sebetsang), li-drive tsa li-motor, le litsamaiso tsa taolo ea liroboto. Li-PCB tse nang le maqhubu a phahameng li netefatsa matšoao a taolo a nepahetseng, 'me meralo ea mekhahlelo e mengata e tšehetsa potoloho e rarahaneng.
Likarolo tsa Bohlokoa: Ho tšoarella ho phahameng, ho hanyetsa EMI, le bokhoni ba ho sebetsana le meroalo e matla haholo.
9. Mekhoa ea Puisano ea Sesole
Tšebeliso: Bohlokoa disebedisweng tse sireletsehileng tsa puisano, dihokelo tsa data tse patiloeng, le ditsamaiso tsa taolo ya lebala la ntwa. Taolo ya impedance ya mekhahlelo e 14 e netefatsa phetiso e tshepahalang ya letshwao dibakeng tse thata.
Likarolo tsa Bohlokoa: Tšepo e phahameng, ho hanyetsa tšitiso, le bokhoni ba ho sebetsa maemong a feteletseng.
10. Khomphutha e nang le Tshebetso e Phahameng (HPC)
Tšebeliso: E sebelisoa lik'homphieutheng tse kholo, li-accelerator tsa AI, le liboto tsa GPU. Li-PCB tse hatelloang ka bongata tse kopantsoeng li tšehetsa ts'ebetso ea data e potlakileng haholo, 'me theknoloji efe kapa efe ea HDI e nolofalletsa likhokahano tse nang le bongata bo phahameng.
Likarolo tsa Bohlokoa: Phetiso ea lets'oao ka lebelo le phahameng, taolo ea mocheso, le ho khona ho hola bakeng sa meralo e rarahaneng.
Kopo
Li-PCB tsa HDI li sebelisoa mafapheng a mangata a kang lifono tsa thekeng, lik'hamera tsa dijithale, AI, bajari ba IC, lisebelisoa tsa bongaka, taolo ea indasteri, lilaptop, lisebelisoa tsa elektroniki tsa likoloi, liroboto, li-drones, jj.