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I-PCB yeHybrid ecinezela rhoqo i-14L impedance
Umaleko ophezulu/nawuphi na umenzi we-HDI womaleko
Umgangatho
Inkqubo yoLawulo loMgangatho: ISO 9001: 2015, ISO14001: 2015, IATF16949: 2016, OHSAS 18001: 2007, QC080000: 2012SGS, RBA, CQC, WCA kunye ne ESA, SQ MARK, Canon GA, Sony GP
Umgangatho womgangatho wePCB: IPC 1, IPC 2, IPC 3, GJB 362C-2021, AS9100
Inkqubo yokuvelisa ephambili yePCB：IL/lmage、PatternPlating、I/L AOI、B/Oxide、Layup、Press、LaserDrilling、Drilling、PTH、PanelPlating、O/Llmage、PanelPlating、SESEtching、O/L AOI、S/Mask、Legend、SurfaceFinshed（ENIGENEPIG、Hard Gold、Soft Gold、HASL、LF-HASL、lmm Tin、lmm Silver、OSP）、Rout 、ET、FV
Izinto zovavanyo lwezixhobo zokuhlola
i-oven: uvavanyo lokugcina amandla obushushu
Umatshini wokuvavanya inqanaba lokungcola kwe-ion: Uvavanyo lokucoceka kwe-ion
umatshini wokuvavanya ityuwa: Uvavanyo lwetyuwa
Umvavanyi we-DC ombane ophezulu: uvavanyo lokumelana nombane
i-megger: ukumelana nobushushu
umatshini wokuxinana jikelele: uvavanyo lwamandla okukhupha
I-CAF: Uvavanyo lokufuduka kwe-ion, ukuphucula ii-substrates ze-PCB, ukuphucula ukucutshungulwa kwe-PCB, njl.
I-OGP: Ukusebenzisa izixhobo zokulinganisa umfanekiso we-3D ezingadibaniyo, kunye neqonga lokuhamba le-XYZ axis kunye nesibuko sokusondeza ngokuzenzekelayo, kusetyenziswa imigaqo yohlalutyo lomfanekiso ukucubungula imiqondiso yomfanekiso ngekhompyutha, ukulinganiswa kobukhulu bejometri kunye nokunyamezelana kwendawo kunokufunyaniswa ngokukhawuleza nangokuchanekileyo, kwaye amaxabiso e-CPK anokuhlalutywa.
Umatshini wokulawula ukumelana okwi-intanethi: ukumelana nokulawula uvavanyo lwe-TCT Iindlela eziqhelekileyo zokusilela, ukuqonda izinto ezinokubangela umonakalo kwizixhobo zenkqubo kunye nezinto eziyinxalenye ukuqinisekisa ukuba imveliso iyilwe okanye yenziwe ngokuchanekileyo na
ibhokisi yokothuka ebandayo neyobushushu: uvavanyo lokothuka ebandayo neyobushushu, ubushushu obuphezulu nobuphantsi
igumbi lobushushu kunye nokufuma rhoqo: Uvavanyo lokumelana nokugqwala kwe-electrochemical kunye nokumelana nokugquma komphezulu
imbiza yesolder: uvavanyo lokunyibilikisa
Uvavanyo lweRoHS: RoHS
umvavanyi we-impedance: amaxabiso e-AC impedance kunye nokulahleka kwamandla
izixhobo zovavanyo zombane: Vavanya ukuqhubeka kwesekethe yemveliso
Umatshini wenaliti ebhabhayo: Uvavanyo lokuqhuba uvavanyo oluphezulu lwe-voltage kunye novavanyo oluphantsi lokuqhuba
Umatshini wokuhlola imingxunya ozenzekelayo ngokupheleleyo: Jonga iintlobo ezahlukeneyo zemingxunya engaqhelekanga, kubandakanya imingxunya engqukuva, imingxunya emifutshane yesloti, imingxunya emide yesloti, imingxunya emikhulu engaqhelekanga, imingxunya eneembobo, imingxunya embalwa, imingxunya emikhulu nemincinci, kunye nemisebenzi yokuhlola iplagi yemingxunya
I-AOI：I-AOI ihlola ngokuzenzekelayo iimveliso ze-PCBA ngeekhamera ze-CCD ezikumgangatho ophezulu, iqokelele imifanekiso, ithelekise amanqaku ovavanyo kunye neeparameter ezifanelekileyo kwisiseko sedatha, kwaye emva kokucutshungulwa komfanekiso, ijonga iziphene ezincinci ezinokungajongwa kwi-PCB ekujoliswe kuyo. Akukho ndlela yokubaleka kwiziphene zesekethe.
Isicelo (jonga umfanekiso oqhotyoshelweyo ngeenkcukacha)
1. Unxibelelwano lwe-5G
Isicelo: Ii-PCB ezicinezela i-hybrid ezisebenza rhoqo zibalulekile kwizikhululo zesiseko ze-5G, ii-antenna, kunye neemodyuli ze-RF ngenxa yokukwazi kwazo ukuphatha imiqondiso yesantya esiphezulu kunye nokunciphisa ukulahleka kwesignali. Ulawulo lwe-impedance olunezingqimba ezili-14 luqinisekisa ukuthembeka kwesignali ngokuchanekileyo, ngelixa itekhnoloji ye-HDI nayiphi na ingqimba ivumela uyilo oluncinci noluxineneyo.
Iimpawu eziphambili: Ukulahleka okuphantsi kwe-dielectric, uzinzo oluphezulu lobushushu, kunye nokuhambelana okuhle kakhulu kwe-impedance.
2. Inqwelo-moya kunye noKhuselo
Ukusetyenziswa: Isetyenziswa kwiinkqubo zeradar, unxibelelwano lwesathelayithi, kunye nee-avionics. Ulwakhiwo lwe-PCB oluneziteyara ezininzi luxhasa ukujikeleza okuntsonkothileyo, kwaye amandla e-frequency ephezulu aqinisekisa ukusebenza okuthembekileyo kwiindawo ezixineneyo.
Iimpawu eziphambili: Ukuthembeka okuphezulu, ukumelana nokungcangcazela, kunye nokukwazi ukusebenza kumanqanaba obushushu abanzi.
3. Imifanekiso yezonyango kunye nokuxilongwa
Ukusetyenziswa: Kubalulekile kwiimashini ze-MRI, ii-CT scanners, kunye nezixhobo ze-ultrasound. Ulawulo lwe-impedance olunezingqimba ezili-14 luqinisekisa ukuhanjiswa kwesignali ngokuchanekileyo, ngelixa itekhnoloji ye-HDI ivumela ukwenziwa kube lula kweesekethe ezintsonkothileyo.
Iimpawu eziphambili: Ukuthembeka okuphezulu kwesignali, uyilo oluncinci, kunye nokuhambelana nezinzwa zefrikhwensi ephezulu.
4. Iimoto ze-elektroniki (iinkqubo ze-ADAS kunye ne-EV)
Ukusetyenziswa: Kusetyenziswa kwiiNkqubo zoNcedo lwaBaqhubi eziPhambili (i-ADAS), ulawulo lwamandla ezithuthi zombane (i-EV), kunye neenkqubo zokuzonwabisa. Ii-PCB ezisebenzisa i-frequency ephezulu zixhasa ukudluliselwa kwedatha ngesantya esiphezulu kwiisensa kunye neekhamera.
Iimpawu eziphambili: Ukuqhuba okuphezulu kobushushu, ukuqina, kunye nokukwazi ukusingatha izicelo zamandla aphezulu.
5. IoT kunye nezixhobo ezikrelekrele
Ukusetyenziswa: Kufumaneka kwizixhobo ezikrelekrele zasekhaya, izinto ezinxitywayo, kunye neesensa ze-IoT zoshishino. Ii-PCB ze-HDI ezineleya nganye zivumela uyilo oluncinci nolukhaphukhaphu, ngelixa amandla e-frequency ephezulu eqinisekisa ukuhanjiswa kwedatha ngokukhawuleza.
Iimpawu eziphambili: Ukunciphisa amandla, ukusetyenziswa kwamandla aphantsi, kunye noqhagamshelo olukhawulezayo.
6. Amaziko eDatha kunye neComputer yamafu
Ukusetyenziswa: Isetyenziswa kwiiseva, iiswitshi, kunye nezixhobo zenethiwekhi ezikhawulezayo. Ulawulo lwe-impedance olunezingqimba ezili-14 luqinisekisa ukulahleka okuncinci kwesignali, kwaye itekhnoloji yokucinezela ye-hybrid ixhasa ukudluliselwa kwedatha ngesantya esiphezulu.
Iimpawu eziphambili: I-bandwidth ephezulu, ulawulo lobushushu, kunye nokuthembeka kokusebenza iiyure ezingama-24 ngosuku, iintsuku ezisixhenxe ngeveki.
7. Izixhobo ze-elektroniki zabathengi
Ukusetyenziswa: Kufumaneka kwiifowuni eziphathwayo, iitablethi, kunye neekhonsoli zemidlalo. Ii-PCB ze-HDI ezikwi-nayiphi na i-layer zivumela izixhobo ezincinci nezikhaphukhaphu, ngelixa amandla aphezulu exhasa uqhagamshelo lwe-5G kunye ne-Wi-Fi 6/6E.
Iimpawu eziphambili: Unxibelelwano oluxineneyo, ukuthembeka kwesignali okugqwesileyo, kunye ne-compact form factor.
8. Ukwenziwa kwezinto ngokuzenzekelayo kwimizi-mveliso kunye neerobhothi
Ukusetyenziswa: Isetyenziswa kwi-PLCs (Programmable Logic Controllers), ii-motor drives, kunye neenkqubo zolawulo lwe-robotic. Ii-PCB ezisebenza rhoqo ziqinisekisa imiqondiso yokulawula echanekileyo, kwaye uyilo lwe-multilayer luxhasa i-complex circuitry.
Iimpawu eziphambili: Ukuqina okuphezulu, ukumelana ne-EMI, kunye nokukwazi ukusingatha imithwalo enamandla aphezulu.
9. Iinkqubo zoNxibelelwano zoMkhosi
Ukusetyenziswa: Kubalulekile kwizixhobo zonxibelelwano ezikhuselekileyo, iikhonkco zedatha ezifihliweyo, kunye neenkqubo zolawulo lwedabi. Ulawulo lwe-impedance oluneeleya ezili-14 luqinisekisa ukuhanjiswa kwesignali okuthembekileyo kwiindawo ezinzima.
Iimpawu eziphambili: Ukuthembeka okuphezulu, ukumelana nokuphazamiseka, kunye nokukwazi ukusebenza kwiimeko ezimandundu.
10. Ikhompyutha Esebenza Kakhulu (i-HPC)
Ukusetyenziswa: Isetyenziswa kwiikhompyutha ezinkulu, ii-accelerator ze-AI, kunye neebhodi ze-GPU. Ii-PCB ezicinezela i-hybrid ezisebenza rhoqo zixhasa ukucutshungulwa kwedatha okukhawulezayo kakhulu, kwaye itekhnoloji ye-HDI nayiphi na ilayer ivumela uqhagamshelo oluxineneyo.
Iimpawu eziphambili: Ukudluliselwa kwesignali ngesantya esiphezulu, ulawulo lobushushu, kunye nokukhula koyilo oluntsonkothileyo.
Isicelo
Ii-PCB ze-HDI zisetyenziswa kwiindawo ezahlukeneyo ezifana neefowuni eziphathwayo, iikhamera zedijithali, ii-AI, ii-IC carriers, izixhobo zonyango, ulawulo lwemizi-mveliso, iilaptops, ii-elektroniki zeemoto, iirobhothi, iidrone, njl.njl.