Yintoni umahluko phakathi kwe-AOI kunye ne-SPI20240904
Ukuqonda Uhlolo lwe-SPI: Isihluthulelo seMveliso ye-Elektroniki ethembekileyo
Kwicandelo lokwenziwa kwezinto ze-elektroniki, ukuchaneka nokuthembeka kubaluleke kakhulu. I-Surface Mount Technology (SMT) itshintshe kakhulu ishishini, ivumela ukuveliswa kwezixhobo ze-elektroniki ezincinci nezisebenza kakuhle kakhulu. Nangona kunjalo, ngenxa yobunzima obukhulayo beesekethe kunye nezinto, ukuqinisekisa umgangatho kunye nokusebenza kwezi zixhobo ze-elektroniki kuye kwaba nzima ngakumbi. Kulapho kungena khona i-Solder Paste Inspection (SPI). Ukuhlolwa kwe-SPI yinkqubo ebalulekileyo yokulawula umgangatho kwi-SMT enceda ukugcina imigangatho ephezulu kwimveliso ye-elektroniki. Kweli nqaku, siza kujonga iinkcukacha zeUhlolo lwe-SPI, ukubaluleka kwayo, iindlela zokusebenza, kunye nempembelelo yayo kumgangatho uphela weendibano ze-elektroniki.
Yintoni ukuhlolwa kwe-SPI?
Uhlolo lweSolder Paste (SPI) lubhekisa kwinkqubo yokuvavanya ukusetyenziswa kwe-solder paste kwibhodi yesekethe eprintiweyo (PCB) ngaphambi kokubekwa kwezinto ze-elektroniki. I-solder paste ngumxube we-solder flux kunye nomgubo we-solder osetyenziselwa ukwenza ama-solder joints phakathi kwezinto ze-elektroniki kunye ne-PCB. Ukusetyenziswa ngokuchanekileyo kwe-solder paste kubalulekile kuba kuchaphazela ukuthembeka kunye nokusebenza kwemveliso yokugqibela. I-SPI iqinisekisa ukuba i-solder paste isetyenziswa ngokuchanekileyo, ngobuninzi obufanelekileyo, nakwiindawo ezifanelekileyo, kunciphisa amathuba okuba kubekho iziphene kwindibano yokugqibela.
Kutheni kufuneka kusetyenziswe uvavanyo lwe-SPI kwimveliso ye-elektroniki?
1. Ukuthintela Iziphene: I-SPI idlala indima ebalulekileyo ekuthinteleni iziphene eziqhelekileyo ezifana neebhulorho ze-solder, ukungoneli kwe-solder, kunye nokungahambi kakuhle kwezinto. Ngokubona ezi ngxaki kwangethuba kwinkqubo yokwenziwa, i-SPI inceda ekuphepheni ukulungiswa nokulungiswa okubiza kakhulu.
2. Ukuthembeka Okuphuculweyo: Ukusetyenziswa kwe-solder paste ngokufanelekileyo kubalulekile ekudaleni amajoyinti e-solder anokuthenjwa anokumelana noxinzelelo loomatshini kunye nemijikelo yobushushu. I-SPI iqinisekisa ukuba i-solder paste isetyenziswa ngokufanayo nangokuchanekileyo, nto leyo ekhokelela ekuphuculeni ukuthembeka kunye nobude bexesha lesixhobo se-elektroniki.
3. Ukusebenza kakuhle kweendleko: Ukufumanisa nokulungisa iingxaki zokusetyenziswa kwe-solder paste kwasekuqaleni kwemveliso kubiza kakhulu kunokujongana neengxaki emva kokuba izixhobo zibekwe okanye zifakwe i-solder. I-SPI inceda ekunciphiseni ixesha lokungasebenzi kwemveliso kunye nokunciphisa inkunkuma yezinto.
4. Ukuthobela iMigangatho: Amashishini amaninzi afuna ukuthotyelwa kwimigangatho ethile yomgangatho kunye nemigaqo. I-SPI inceda abavelisi ukuba bahlangabezane nale migangatho ngokuqinisekisa ukuba ukusetyenziswa kwe-solder paste kuyahlangabezana neemfuno ezifunekayo.
Ziziphi iindlela zokuhlola i-SPI?
I-SPI inokwenziwa kusetyenziswa iindlela ezahlukeneyo, nganye ineenzuzo zayo kunye nokusetyenziswa kwayo. Iindlela eziphambili ziquka:
1.Uhlolo lwe-Optical oluzenzekelayo (i-AOI): Le yeyona ndlela ixhaphakileyo ye-SPI, esebenzisa iikhamera ezinesisombululo esiphezulu kunye nee-algorithms zokucubungula imifanekiso ukuhlola ukusetyenziswa kwe-solder paste. Iinkqubo ze-AOI zinokubona izinto ezingaqhelekanga ezifana ne-solder paste egqithisileyo okanye enganeleyo, ukungalungelelani kakuhle, kunye nokudibanisa. Ezi nkqubo zisebenza kakuhle kakhulu kwaye zinokucubungula inani elikhulu lee-PCB ngokukhawuleza.
2.Uhlolo lwe-X-reyi: Ukuhlolwa kwe-X-ray kusetyenziselwa ukubona iingxaki ezingabonakaliyo emehlweni okanye ngeendlela eziqhelekileyo zokukhanya. Kuluncedo ngakumbi ekuhloleni izakhiwo zangaphakathi ze-PCB ezinamalayelo amaninzi kunye nokufumanisa iingxaki ezifana neebridges ze-solder ezifihliweyo okanye izithuba.
3. Ukuhlolwa Ngesandla: Nangona kungaqhelekanga kwimveliso yomthamo omkhulu, ukuhlolwa ngesandla kungasetyenziswa kwimveliso encinci okanye njengendlela eyongezelelweyo. Abahloli abaqeqeshiweyo bajonga ngokubonakalayo ukusetyenziswa kwe-solder paste kwaye basebenzisa izixhobo ezifana neeglasi zokukhulisa ukuze babone iziphene.
4. Ukuhlolwa kweLaser: Iinkqubo ze-SPI ezisekelwe kwiLaser zisebenzisa iilaser ukulinganisa ukuphakama kunye nomthamo weedipozithi ze-solder paste. Le ndlela inika imilinganiselo echanekileyo kwaye iyasebenza ekufumaneni imiba enxulumene nomthamo we-paste kunye nokufana.
Ziziphi iiparameter eziphambili kwi-SPI Inspection?
Iiparameters ezininzi ezibalulekileyo ziyavavanywa ngexesha lokuhlolwa kwe-SPI ukuqinisekisa ukusetyenziswa ngokufanelekileyo kwepeyinti yesolder. Ezi parameters ziquka:
1. Umthamo weSolder Paste: Ubungakanani besolder paste ebekwe kwiphedi nganye kufuneka bube ngaphakathi kwemida echaziweyo. Intlama eninzi okanye encinci kakhulu inokukhokelela kwiziphene kwiindawo zokudibanisa.
2. Ubukhulu bePaste: Ubukhulu be-solder paste mabuhambelane ukuqinisekisa ukumanzisa nokunamathelana kakuhle kwezixhobo. Ukwahluka kobukhulu bepaste kunokuchaphazela umgangatho we-solder joint.
3. Ulungelelwaniso: I-solder paste kufuneka ihambelane ngokuchanekileyo nee-PCB pads. Ukungalingani kakuhle kunokubangela ukwakheka kakubi kwe-solder joint kunye neengxaki zokubekwa kwe-component.
4. Ukusasazwa kwePaste: Ukusasazwa okufanayo kwepaste yesolder kwi-PCB kubalulekile ukuze kuhlanganiswe ipaste rhoqo. Iinkqubo ze-SPI zivavanya ukulingana kokusasazwa kwepaste ukuthintela iingxaki ezifana ne-solder voids okanye i-bridging.
Ungaqinisekisa njani umgangatho wokuprinta iSolder Paste?
● Isantya se-Squeegee: Isantya sokuhamba kwe-squeeze simisela ukuba lingakanani ixesha elikhoyo lokuba i-solder paste "iqengqeleke" kwi-apertures ye-stencil nakwi-pads ye-PCB. Ngokwesiqhelo, kusetyenziswa useto lwe-25mm ngomzuzwana kodwa oku kuyahluka ngokuxhomekeke kubukhulu be-apertures ngaphakathi kwe-stencil kunye ne-solder paste esetyenzisiweyo.
● Uxinzelelo lwe-Squeegee: Ngexesha lomjikelo wokuprinta, kubalulekile ukufaka uxinzelelo olwaneleyo kulo lonke ubude beblade yokucinezela ukuqinisekisa ukuba istencil icocekile. Uxinzelelo oluncinci kakhulu lunokubangela "ukutshiza" kwentlama kwistencil, ukubekwa kakubi, kunye nokudluliselwa okungaphelelanga kwi-PCB. Uxinzelelo oluninzi lunokubangela "ukukhuhla" kwentlama ukusuka kwiindawo ezinkulu, ukuguguleka okugqithisileyo kwistencil kunye ne-squeegees, kwaye kunokubangela "ukopha" kwentlama phakathi kwestencil kunye ne-PCB. Indawo eqhelekileyo yoxinzelelo lwe-squeegee yi-500 grams yoxinzelelo kwi-25mm yeblade ye-squeegee.
● Cinezela i-engile: I-engile ye-squeegee idla ngokubekwa kwi-60° zizibambi ezinamathele kuzo. Ukuba i-engile inyusiwe, inokubangela "ukukhutshelwa" kwe-holder paste kwi-stencil apertures kwaye i-solder paste encinci ibekwe. Ukuba i-engile inciphile, inokubangela ukuba intsalela ye-solder paste ishiywe kwi-stencil emva kokuba i-squeeze igqibile ukuprinta.
● Isantya sokwahlulwa kweStencil: Esi sisantya apho i-PCB yahlukana khona ne-stencil emva kokuprinta. Useto lwesantya olufikelela kwi-3mm ngomzuzwana kufuneka lusetyenziswe kwaye lulawulwa bubungakanani beendawo ezivulekileyo ngaphakathi kwe-stencil. Ukuba oku kukhawulezile kakhulu, kuya kubangela ukuba i-solder paste ingaphumi ngokupheleleyo kwiindawo ezivulekileyo kunye nokwakheka kwemiphetho ephezulu ejikeleze iindawo ezigciniweyo, okwaziwa ngokuba yi-"dog-ears".
● Ukucoca iStencil: Istencil kufuneka icocwe rhoqo xa isetyenziswa, nto leyo enokwenziwa ngesandla okanye ngokuzenzekelayo. Umatshini wokuprinta ozenzekelayo unenkqubo enokumiselwa ukucoca istencil emva kwenani elimiselweyo leeprints kusetyenziswa izinto ezingenayo ilint ezifakwe kwikhemikhali yokucoca efana ne-Isopropyl Alcohol (IPA). Le nkqubo yenza imisebenzi emibini, owokuqala kukucoca icala elingaphantsi lestencil ukuze kumiswe ukungcoliswa, kwaye owesibini kukucoca iindawo ezivulekileyo kusetyenziswa i-vacuum ukunqanda ukuvaleka.
● Imeko yeStencil kunye neSqueegee: Zombini iistencil kunye neesqueegee kufuneka zigcinwe kwaye zigcinwe ngononophelo njengoko nawuphi na umonakalo woomatshini kuzo zombini unokukhokelela kwiziphumo ezingafunekiyo. Zombini mazihlolwe ngaphambi kokusetyenziswa kwaye zicocwe kakuhle emva kokusetyenziswa, kungcono ukusebenzisa inkqubo yokucoca ezenzekelayo ukuze kususwe nayiphi na intsalela ye-solder paste. Ukuba kukho nawuphi na umonakalo obonwayo kwi-squeegee okanye iistencil, kufuneka zitshintshwe ukuqinisekisa inkqubo ethembekileyo nephindaphindwayo.
● Printa iStroke: Lo ngumgama ohanjwa yi-squeegee kwi-stencil kwaye kucetyiswa ukuba ubuncinci ube yi-20mm ukudlula umngxuma okude kakhulu. Umgama odlula umngxuma okude kakhulu ubalulekile ukuvumela indawo eyaneleyo yokuba i-paste iqengqeleke xa ibuya njengoko iqengqeleka i-solder paste bead evelisa amandla asezantsi aqhubela i-paste kwi-apertures.
Zeziphi iintlobo zeePCB ezinokuprintwa?
Noba kutheniqinile,I-IMS,ukuguquguquka okuqinileyookanyei-flex PCB(jonga kwi-Ukuveliswa kwePCB), ukuba amandla e-PCB awanelanga ukuxhasa i-PCB ngokwayo ukuba ithambe ngokupheleleyo njengoko kufuneka kwiireyile zemigca ye-SMT, umenzi we-PCB assembly uya kucela ukuba ihlengahlengiswe.Umthwali we-SMTokanye umthwali (owenziwe ngeDurostone).
Le yinto ebalulekileyo ukuqinisekisa ukuba i-PCB ibanjwe ngokuthe tyaba kwi-stencil ngexesha lenkqubo yokuprinta. Ukuba i-PCB, nokuba iqinile, i-IMS, iqinile okanye ithambile, ayixhaswanga ngokupheleleyo, inokukhokelela kwiziphene zokuprinta, njengokungafakwa kakuhle kwepeyinti kunye nokuguguleka. Izixhasi ze-PCB zihlala zibonelelwa ngoomatshini bokuprinta abanobude obuzinzileyo kwaye baneendawo ezicwangcisiweyo ukuqinisekisa inkqubo ehambelanayo. Kukwakho nee-PCB eziguquguqukayo kwaye ziluncedo ekuhlanganiseni amacala amabini.
PUhlolo lweSolder Paste eprintiweyo (i-SPI)
Inkqubo yokuprinta i-solder paste yenye yezona zinto zibalulekileyo kwinkqubo yokuhlanganisa umphezulu. Okukhona isiphene sichongiwe kwangoko kokukhona kuya kuba kuncinci ukubiza ukulungisa - umthetho oluncedo ekufuneka uqwalaselwe kukuba isiphene esichongiweyo emva kokuphinda sisetyenziswe siya kubiza amaxesha ali-10 kuneso sichongiweyo ngaphambi kokuphinda sisetyenziswe - isiphene esichongiweyo emva kovavanyo siya kubiza amaxesha ali-10 ngaphezulu kokuphinda sisetyenziswe. Kuyaqondakala ukuba inkqubo yokuprinta i-solder paste inika amathuba amaninzi kakhulu kwiziphene kunanoma yimuphi omnye umntu.Iinkqubo zoMveliso zeTekhnoloji yokuHamba koMphezulu (i-SMT)Ukongeza, ukutshintshela kwi-solder paste engenalo i-lead kunye nokusetyenziswa kwezinto ezincinci, kuye kwandisa ubunzima benkqubo yokuprinta. Kuye kwangqinwa ukuba ii-solder paste ezingenalo i-lead azisasazeki okanye "zimanzi" kunye nee-tin lead solder paste. Ngokubanzi, inkqubo yokuprinta echanekileyo ngakumbi iyafuneka kwinkqubo engenalo i-lead. Oku kuye kwanyanzela umenzi ukuba aqalise uhlobo oluthile lokuhlolwa emva kokuprintwa. Ukuqinisekisa inkqubo, ukuhlolwa kwe-solder paste ngokuzenzekelayo kunokusetyenziswa ukujonga ngokuchanekileyo iidipozithi ze-solder paste. Kwi-RICHFULLJOY, sinokubona ezinye iziphene ze-solder paste eprintiweyo, iidipozithi ezinganeliyo zomgca, iidipozithi ezigqithisileyo, ukuguqulwa kwesimo, i-missing paste, i-paste offset, i-smearing, i-bridging kunye nokunye.
