01
Ukuqonda injongo ye-PCB lamination
2024-06-26
1. Ukuncibilikisa Okunsundu
Inhloso:
Hlanganisa ubuso bethusi ngamakhemikhali ukuze kukhiqizwe ungqimba lwe-oxide (brown cuprous oxide), okwandisa indawo yobuso ukuze kuthuthukiswe amandla okubopha.
Ukunakwa:
1. Ngemva kokufaka i-oxidizing ensundu, ibhodi kufanele lilayishwe ngokushesha futhi lifakwe i-laminate. Uma lishiywa isikhathi eside kakhulu, lithambekele ekutholeni umswakama futhi lihlangane ne-CO2 emoyeni ukuze lenze i-carbonic acid, ezoncibilikisa ungqimba lwe-oxide ensundu, oluthinta amandla alo okubopha futhi lwandise ingozi yokuhlukanisa.
2. Ibhodi elinesendlalelo sethusi esijiyile (≥2oz) kanye nebhodi elingenalutho kudingeka libhakwe ukuze kususwe umswakama owedlulele.
Amapharamitha okubhaka: 120℃±5℃×120 min
2. Ngaphambi kokufaka i-stack
Inhloso:
Ngokwemiyalelo ye-MI, hlanganisa ibhodi eliyinhloko kanye ne-PP ndawonye.
Isakhiwo esivamile sebhodi elinezingqimba ezine
3. Ukulayisha ibhodi
Inhloso:
Beka isethi ngayinye yamabhodi abekwe kusengaphambili futhi aboshwe ngokwahlukana epuletini lensimbi ngokulandelana, ngokuvamile ngamabhodi angu-4-6pnl okukhiqiza epuletini ngalinye.
4. Ukuvikela
Inhloso:
Ngokusebenzisa izinga lokushisa elithile kanye nengcindezi, inqubo yokuqinisa i-PP kusuka ku-semi-solid iye kuketshezi yenziwa ukuze kuhlanganiswe ibhodi eliyinhloko, i-PP kanye ne-copper foil ndawonye.
5. Ukukhipha imithwalo
Inhloso:
Hlukanisa ibhodi elifakwe i-laminate libe yi-PNL, bese ulipholisa.
6. Ukubhoboza okuqondiwe kwe-X-ray
Inhloso:
Bamba indawo yesithombe se-inner layer graphic target ngokusebenzisa i-X-Ray radiation ye-Idivayisi ye-X-Ray, bese ubhoboza imigodi yokubeka endaweni yokubhoboza ngomshini.
0102