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What is BGA Assembly?

BGA assembly refers to the process of mounting a Ball Grid Array (BGA) onto a PCB using the reflow soldering technique. BGA is a surface-mounted component that utilizes an array of solder balls for electrical interconnection. As the circuit board passes through a solder reflow oven, these solder balls melt, forming electrical connections.

Definition of BGA
BGA: Ball Grid Array
Classification of BGA
PBGA: plasticBGA plastic encapsulated BGA
CBGA: BGA for ceramic BGA packaging
CCGA: Ceramic column BGA ceramic pillar
BGA packaged in shape
TBGA: tape BGA with ball grid column

Steps of BGA Assembly

The BGA assembly process typically involves the following steps:

PCB Preparation: The PCB is prepared by applying solder paste to the pads where the BGA will be mounted. The solder paste is a mixture of solder alloy particles and flux, which helps with the soldering process.

Placement of BGAs: The BGAs, which consist of the integrated circuit chip with solder balls on the bottom, are placed onto the prepared PCB. This is typically done using automated pick-and-place machines or other assembly equipment.

Reflow Soldering: The assembled PCB with the placed BGAs is then passed through a reflow oven. The reflow oven heats the PCB to a specific temperature that melts the solder paste, causing the solder balls of the BGAs to reflow and establish electrical connections with the PCB pads.

Cooling and Inspection: After the solder reflow process, the PCB is cooled down to solidify the solder joints. It is then inspected for any defects, such as misalignment, shorts, or open connections. Automated optical inspection (AOI) or X-ray inspection may be used for this purpose.

Secondary Processes: Depending on the specific requirements, additional processes such as cleaning, testing, and conformal coating may be performed after BGA assembly to ensure the reliability and quality of the finished product.
Advantages of BGA Assembly


BGA Ball Grid Array






PBGA 217L Plastic Ball Grid Array










CPGA Ceramic Pin Grid Array


DIP Dual Inline Package





1. Small footprint
BGA packaging consists of the chip, interconnects, a thin substrate, and an encapsulation cover. There are few exposed components and the package has a minimal number of pins. The overall height of the chip on the PCB can be as low as 1.2 millimeters.

2. Robustness
BGA packaging is highly robust. Unlike QFP with a 20mil pitch, BGA does not have pins that can bend or break. Generally, BGA removal requires the use of a BGA rework station at high temperatures.

3. Lower parasitic inductance and capacitance
With short pins and low assembly height, BGA packaging exhibits low parasitic inductance and capacitance, resulting in excellent electrical performance.

4. Increased storage space
Compared to other packaging types, BGA packaging has only one-third of the volume and approximately 1.2 times the chip area. Memory and operational products using BGA packaging can achieve more than a 2.1-fold increase in storage capacity and operational speed.

5. High stability
Due to the direct extension of pins from the center of the chip in BGA packaging, the transmission paths for various signals are effectively shortened, reducing signal attenuation and improving response speed and anti-interference capabilities. This enhances the stability of the product.

6. Good heat dissipation
BGA offers excellent heat dissipation performance, with the chip temperature approaching the ambient temperature during operation.

7. Convenient for rework
The pins of BGA packaging are neatly arranged on the bottom, making it easy to locate damaged areas for removal. This facilitates the rework of BGA chips.

8. Avoidance of wiring chaos
BGA packaging allows for placing many power and ground pins in the center, with I/O pins positioned on the periphery. Pre-routing can be done on the BGA substrate, avoiding chaotic wiring of I/O pins.

RichPCBA  BGA Assembly Capabilities

RICHPCBAis a globally renowned manufacturer for PCB fabrication and PCB assembly. BGA assembly service is one of the many service types we offer. PCBWay can provide you with high-quality and cost-effective BGA assembly for your PCBs. The minimum pitch for BGA assembly that we can accommodate is 0.25mm  0.3mm.

As a PCB service provider with 20 years of experience in PCB manufacturing, fabrication and assembly, RICHPCBA has a rich background. If there is a demand for BGA assembly, please feel free to contact us!