PCB Assembly Capability
SMT, the full name is surface mount technology. SMT is a way to mount the components or parts onto the boards. Due to the better outcome and higher efficiency, SMT has become the primary approach used in the process of PCB assembly.
The advantages of SMT assembly
1. Small size and lightweight
Using SMT technology to assemble the components onto the board directly helps to reduce the entire size and the weight of the PCBs. This assemble method allows us to place more components in a restricted space, which can achieve compact designs and better performance.
2. High reliability
After the prototype is confirming, the entire SMT assembly process is almost automated with precise machines, making it minimizes the errors that may be caused by manual involvement. Thanks to the automation, SMT technology ensures the reliability and consistency of the PCBs.
3. Cost-saving
SMT assemble usually realizes through automatic machines. Though the input cost of the machines is high, the automatic machines help to reduce manual steps during SMT processes, which significantly improves the production efficiency and lower the labor costs in the long-run. And there are fewer materials used than through-hole assemble, and the cost would be decreased, too.
| SMT Capability: 19,000,000 point/day | |
| Testing Equipment | X-RAY nondestructive detector,First Article Detector, A0I, ICT detector, BGA Rework Instrument |
| Mounting Speed | 0.036 S/pcs (Best Status) |
| Components Spec. | Stickable minimum package |
| Minimum equipment accuracy | |
| IC chip accuracy | |
| Mounted PCB Spec. | Substrate size |
| Substrate thickness | |
| Kickout Rate | 1.Impedance Capacitance Ratio : 0.3% |
| 2.IC with no kickout | |
| Board Type | POP/Regular PCB/FPC/Rigid-Flex PCB/Metal based PCB |
| DIP Daily Capability | |
| DIP plug-in line | 50,000 point/day |
| DIP post soldering line | 20,000 point/day |
| DIP test line | 50,000pcs PCBA/day |
| Manufacturing Capability of Main SMT Equipment | ||
| Machine | Range | Parameter |
| Printer GKG GLS | PCB printing | 50x50mm~610x510mm |
| printing accuracy | ±0.018mm | |
| Frame size | 420x520mm-737x737mm | |
| range of PCB thickness | 0.4-6mm | |
| Stacking integrated machine | PCB conveying seal | 50x50mm~400x360mm |
| Unwinder | PCB conveying seal | 50x50mm~400x360mm |
| YAMAHA YSM20R | in case of conveying 1 board | L50xW50mm -L810xW490mm |
| SMD theoretical speed | 95000CPH(0.027 s/chip) | |
| Assembly range | 0201(mm)-45*45mm component mounting height: ≤15mm | |
| Assembly accuracy | CHIP+0.035mmCpk ≥1.0 | |
| Quantity of components | 140 types (8mm scroll) | |
| YAMAHA YS24 | in case of conveying 1 board | L50xW50mm -L700xW460mm |
| SMD theoretical speed | 72,000CPH(0.05 s/chip) | |
| Assembly range | 0201(mm)-32*mm component mounting height: 6.5mm | |
| Assembly accuracy | ±0.05mm, ±0.03mm | |
| Quantity of components | 120types (8mm scroll) | |
| YAMAHA YSM10 | in case of conveying 1 board | L50xW50mm ~L510xW460mm |
| SMD theoretical speed | 46000CPH(0.078 s/chip) | |
| Assembly range | 0201(mm)-45*mm component mounting height: 15mm | |
| Assembly accuracy | ±0.035mm Cpk ≥1.0 | |
| Quantity of components | 48 types(8mm reel)/15 types of automatic IC trays | |
| JT TEA-1000 | Each dual track is adjustable | W50~270mm substrate/single track is adjustable W50*W450mm |
| Height of components on PCB | top/bottom 25mm | |
| Conveyor speed | 300~2000mm/sec | |
| ALeader ALD7727D AOI online | Resolution/Visual range/Speed | Option:7um/pixel FOV:28.62mmx21.00mm Standard:15um pixel FOV:61.44mmx45.00mm |
| Detecting speed | <230 millisecond/field of view | |
| Bar code system | automatic bar code recognition(bar code or QR code) | |
| Range of PCB size | 50x50mm(min)~510x300mm(max) | |
| 1 track fixed | 1 track is fixed,2/3/4 track is adjustable;the min. size between 2 and 3 track is 95mm; the max size between 1 and 4 track is 700mm. | |
| Single line | The max track width is 550mm. Double track : the max double track width is 300mm(measurable width); | |
| Range of PCB thickness | 0.2mm-5mm | |
| PCB clearance between top and bottom | PCB top side: 30mm / PCB bottom side: 60mm | |
| 3D SPI SINIC-TEK | Bar code system | automatic bar code recognition(bar code or QR code) |
| Range of PCB size | 50x50mm(min)~630x590mm(max) | |
| Accuracy | 1μm, height: 0.37um | |
| Repeatability | <1um (4sigma) Volume/Area<1%(4sigma), height>1um (4sigma) | |
| Speed of visual field | 0.3s/visual field | |
| Reference point detecting time | 0.5s/point | |
| Max height of detection | ±550um~1200μm | |
| Max measuring height of warping PCB | ±3.5mm~±5mm | |
| Minimum pad spacing | 100um(based on a soler pad with a height of 1500um) | |
| Minimum testing size | rectangle 150um, circular 200um | |
| Height of component on PCB | top/bottom 40mm | |
| PCB thickness | 0.4~7mm | |
| Unicomp X-Ray detector 7900MAX | Light tube type | enclosed type |
| Tube voltage | 90kV | |
| Max output power | 8W | |
| Focus size | 5μm | |
| Detector | high definition FPD | |
| Pixel size | <85μm | |
| Effective detection size | 130*130[mm] | |
| Pixel matrix | 1536*1536[pixel] | |
| Frame rate | 20fps | |
| System magnification | 600X | |
| Navigation positioning | Can quickly locate physical images | |
| Automatic measuring | Can automatically measure bubbles in packaged electronics such as BGA & QFN | |
| CNC automatic detection | Support single point and matrix addition, quickly generate projects and visualize them | |
| Geometric amplification | 300 times | |
| Diversified measurement tools | Support geometric measurements such as distance, angle, diameter, polygon, etc | |
| Can detect samples at a 70 degree angle | The system has a magnification of up to 6,000 | |
| BGA detection | Larger magnification, clearer image, and easier to see BGA solder joints and tin cracks | |
| Stage | Capable of positioning in X,Y and Z directions; Directional positioning of X-ray tubes and X-ray detectors | |